• Journal of the Korean Vacuum Society
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• v.8 no.4A
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• pp.465-469
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• 1999

In this paper, spacer process for FED (Field Emission Display ) was developed with the glass to glass anodic bonding technology using Al film as an interlayer. Characteristics, current density-time curves and force of the anodic boding were measured on various thickness of Al film; 1000$\AA$, 2000$\AA$, 3000$\AA$, 4000$\AA$ and 500$\AA$. Holders for spacer were fabricated with photosensitive glass and (110) Si wafer by bulk micromachining. Spacers was formed on glass substrate by spacer glass to glass anodic bonding and an evacuated panel was fabricated to prove the potential of application for FED.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.53-57
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• 2014

Thin glass (< 100 microns) is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. But thin glass is extremely brittle, so mechanical micromachining to create through glass vias (TGVs) is particularly challenging. In this article we show how laser processing using deep UV excimer lasers at a wavelength of 193 nm provides a viable solution capable of drilling dense patterns of TGVs with high hole counts. Based on mask illumination, this method supports parallel drilling of up over 1,000 through vias in 30 to $100{\mu}m$ thin glass sheets. (We also briefly discuss that ultrafast lasers are an excellent alternative for laser drilling of TGVs at lower pattern densities.) We present data showing that this process can deliver the requisite hole quality and can readily achieve future-proof TGV diameters as small $10{\mu}m$ together with a corresponding reduction in pitch size.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.640-643
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• 2003

We present investigations of the surface micromachining for transparent glass substrate, e.g. soda lime glass using tightly focused 800nm Ti:sapphire femtosecond laser. In this study, experiment conditions such as laser intensity, scanning speed, focus position were controlled as variable parameters to decide optimal machining conditions. This study shows clearly that laser intensity and scanning speed are dominant factors for good surface morphology. Using the optimal conditions, grooves with 50${\mu}{\textrm}{m}$ line width were fabricated on glass substrate and their surface morphologies were investigated from SEM image.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.151-152
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• 2011

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.451-454
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• 2001

In this study, a micro-glucose sensor was fabricated by micromachining technology and its sensing characteristics were investigated. The 7740 pyrex glass was used as the bottom substrate and anisotropically etched silicon wafer was used as the top substrate. The size of the fabricated microchip is 1.58${\times}$1.58mm$^2$. It is shown that output current exhibits a linear change according to glucose concentration (100 mM ∼ 300 mM). It is also shown that the response time for glucose was within 240 sec. It was followed by a saturation trend within 50 sec. The g1ucose sensor with Fc$\^$+/ exhibits relatively higher sensitivity than that without Fc$\sub$+/ for output current.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.6 no.1
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• pp.24-28
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• 2005

A micromachined biochip with a three dimensional silicon chamber was developed for the construction of biosensors. Anisotropic etching was used fur the formation of the chamber on the p-type silicon wafer(100) and then was glued to the Pyrex glass bottom-substrate with pre-deposited platinum electrode. The electrochemical characterization of its Pt electrode and Ag/AgCl reference electrode was investigated.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.12
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• pp.1159-1165
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• 2013

Powder blasting, which is an efficient micromachining method for glass, silicon, and ceramics, has a critical disadvantage in that the surface finish is poor owing to the brittle fracture of materials. Low-pressure waterjet machining can be applied to smoothen the rough surface inside the blasted structure. In this study, the surface roughness and sectional dimension of micro-channels are observed during the repetitive application of a waterjet to blasted micro-channels. The asperities and subsurface cracks created by blasting are removed by waterjet machining. Along with the surface roughness, it is found that the sectional dimension increases and the edges of the finished micro-channel become slightly round. Finally, a microfluidic chip is machined by the blasting-waterjet process and a transparent microfluidic channel is obtained efficiently.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1422-1424
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• 1995

In this paper, a pyrex glass is machined using Electric Discharge Machining. In order to fabricate the desired shape, the process conditions are optimized appropriatley. This paper shows that the applied voltage and the concentration of electrolytic solution significantly affect the size and shape of the hole in the pyrex glass. As the applied voltage grows, the size of the hole increases but the shape is little affected.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.963-966
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• 2000

Abrasive jet machining(AJM) process is similar to the sand blasting, and effectively removes hard and brittle materials. AJM has applied to rough working such as deburring and rough finishing. As the needs for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro groove cutting of glass. Diameter of hole and width of line in this groove cutting is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro groove cutting in glass, but the size of machined groove was increased about 2~4${\mu}{\textrm}{m}$. therefore, this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD parts.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.10
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• pp.178-183
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• 2001

Abrasive jet machining(AJM) process is similar to the sand blasting and effectively removes hard and brittle materials. AJM has applied to rough working such as debarring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM is developed, and has become the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro grooving of glass. Diameter of hole and width of line in grooving is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro grooving of glass, but the size of machined groove increased about 2~4${\mu}{\textrm}{m}$. With the fine tuning of masking process and compensation of film wear. this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD.