• Journal of Wellbeing Management and Applied Psychology
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• v.7 no.2
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• pp.13-21
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• 2024

Purpose: The purpose is to expand the role of local senior welfare centers as a place for intergenerational integration by analyzing the intergenerational awareness and satisfaction of participants in the intergenerational integration program. Research design, data and methodology: The empirical study conducted a survey on 205 participants (114 seniors, 91 teenagers) of the generation integration program being implemented at a senior welfare center located in Seoul. Results: Regarding the satisfaction of participants in the generation integration program, both the elderly and youth showed that the more contact they had between generations, the higher the satisfaction with participation. In the case of the elderly, the better the subjective health status, the older the respondent, and the lower the educational level, the higher the satisfaction, and the more frequently they met youth, the higher the satisfaction. On the other hand, the longer the youth participated in the program, the weaker their negative emotions toward the elderly, and the higher the degree of visits to grandparents, the higher their satisfaction with participation. Conclusions: The biggest determinant of satisfaction with the generational integration program at senior welfare centers is the intensity and frequency of contact between the elderly and youth generations.

• Journal of the Korean Society of Systems Engineering
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• v.9 no.2
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• pp.69-82
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• 2013

US DoD operated JCIDS(Joint Capability Integration and Development System) for top down requirement generation. Although the JCIDS can be a good practice for the countries which are trying to shift from bottom up to top down requirement generation, it contains many processes related with review and approval. In this study we structured a joint capability integration and development process from the JCIDS eliminating the organization dependent review or approval process so that it can be applied to any organization with some modification. Furthermore we implemented the process in the computer aided systems engineering tool, Cradle, for convenient use of the process. The result of this study can provide a basic process for top down capability development, and an efficient why of doing each element of the process using CASE tool.

• The Bulletin of The Korean Astronomical Society
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• v.34 no.1
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• pp.169.2-169.2
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• 2009

• Journal of Electrical Engineering and Technology
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• v.13 no.2
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• pp.540-549
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• 2018

This paper proposes the method of active distribution network expansion planning considering distributed generation integration and distribution network reconfiguration. The distribution network reconfiguration is taken as the expansion planning alternative with zero investment cost of the branches. During the process of the reconfiguration in expansion planning, all the branches are taken as the alternative branches. The objective is to minimize the total costs of the distribution network in the planning period. The expansion alternatives such as active management, new lines, new substations, substation expansion and Distributed Generation (DG) installation are considered. Distribution network reconfiguration is a complex mixed-integer nonlinear programming problem, with integration of DGs and active managements, the active distribution network expansion planning considering distribution network reconfiguration becomes much more complex. This paper converts the dual-level expansion model to Second-Order Cone Programming (SOCP) model, which can be solved with commercial solver GUROBI. The proposed model and method are tested on the modified IEEE 33-bus system and Portugal 54-bus system.

• Journal of the Korea Safety Management & Science
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• v.5 no.2
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• pp.67-74
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• 2003

One of the recent trends of cockpit development is to integrate the part of whole cockpit and compartment. The goal of this study is to develop and Analyze User's Convenience for a cockpit prototype based on the design guide of cockpit integration module. The process of this study has been followed analyzing development trend of next generation Automotive cockpit, extracting the design factor needed to making integration module and laying down the design guide of cockpit integration module. After that process, next-generation Automotive cockpit has been embodied as graphical image designing. Henceforth, applying this module to real will be considered after evaluation of utilization. THis study is indicated that one example for evaluation of utilization.

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.52.2-52
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• 1998

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.2
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• pp.23-34
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• 2013

Over the past several decades in the microelectronics industry, devices have gotten smaller, thinner, and lighter, without any accompanying degradation in quality, performance, and reliability. One permanent and deniable trend in packaging as well as wafer fabrication industry is system integration. The proliferating options for system integration, recently, are driving change across the overall semiconductor industry, requiring more investment in developing, ramping and supporting new die-, wafer- and board-level solution. The trend toward 3D system integration and miniaturization in a small form factor has accelerated even more with the introduction of smartphones and tablets. In this paper, the key issues and state of the art for system integration in the packaging process are introduced, especially, focusing on ease transition to next generation packaging technologies like through silicon via (TSV), 3D wafer-level fan-out (WLFO), and chip-on-chip interconnection. In addition, effective solutions like fine pitch copper pillar and MEMS packaing of both advanced and legacy products are described with several examples.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.

• Journal of IKEEE
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• v.19 no.4
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• pp.479-485
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• 2015

A resistance deviation-to-time interval converter based on dual-slope integration using second generation current conveyors (CCIIs) is designed for connecting resistive bridge sensors with a digital system. It consists of a differential integrator using CCIIs, a voltage comparator, and a digital control logic for controlling four analog switches. Experimental results exhibit that a conversion sensitivity amounts to $15.56{\mu}s/{\Omega}$ over the resistance deviation range of $0-200{\Omega}$ and its linearity error is less than ${\pm}0.02%$. Its temperature stability is less than $220ppm/^{\circ}C$ in the temperature range of $-25-85^{\circ}C$. Power dissipation of the converter is 60.2 mW.

• The Journal of Economics, Marketing and Management
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• v.12 no.1
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• pp.39-51
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• 2024

Purpose: This study aims to derive planning directions of community facilities integrating generations based on local communities to promote sustainable intergenerational exchange by analyzing the spatial configuration and programs of domestic and foreign generation-integrated community facilities based on local communities. Research design, data and methodology: Through theoretical consideration, the concept of intergenerational integration, types of intergenerational exchange, and spatial arrangement types were identified. Then, case study analysis of domestic and foreign community facilities with well-planned intergenerational exchange spaces and programs were conducted to identify intergenerational integration, and to derive community facility planning direction. Results: The results of this research are as follows. First, in terms of humanware, in order to revitalize continuous exchange between the 1st, 2nd, and 3rd generations, a systematic support system is needed to build mutual trust through voluntary participation by each generation. Second, it is important to provide a variety of shared spaces while maintaining the uniqueness of each facility from a hardware perspective, and must be planned in such a way that selective interaction takes place with privacy and interaction in mind. Third, in terms of software, programs that meet the characteristics of each user must be provided. Conclusions: It is expected that the results of this research can be used as basic data for planning community facilities that integrate generations based on local communities, contributing to the search for sustainable ways to revitalize intergenerational exchange in the future.