• JSTS:Journal of Semiconductor Technology and Science
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• 제16권6호
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• pp.854-859
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• 2016

Recently, GeSn is drawing great deal of interests as one of the candidates for group-IV-driven optical interconnect for integration with the Si complementary metal-oxide-semiconductor (CMOS) owing to its pseudo-direct band structure and high electron and hole mobilities. However, the large lattice mismatch between GeSn and Si as well as the Sn segregation have been considered to be issues in preparing GeSn on Si. In this work, we deposit the GeSn films on Si by DC magnetron sputtering at a low temperature of $250^{\circ}C$ and characterize the thin films. To reduce the stresses by GeSn onto Si, Ge buffer deposited under different processing conditions were inserted between Si and GeSn. As the result, polycrystalline GeSn domains with Sn atomic fraction of 6.51% on Si were successfully obtained and it has been demonstrated that the Ge buffer layer deposited at a higher sputtering power can relax the stress induced by the large lattice mismatch between Si substrate and GeSn thin films.

• 한국전기전자재료학회논문지
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• 제13권8호
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• pp.643-650
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• 2000

Density-of-states effective mass(m*$_{d}$) and conductivity mass(m*$_{c}$)for Ge and Ge$_{0.8}$/Sn$_{0.2}$ are obtained by using 8$\times$8 k.p and strain Hamiltonians. It is shown that m*$_{d}$ and m*$_{c}$ for electrons in Ge/Ge$_{0.8}$/Sn$_{0.2}$(001) and Ge$_{0.8}$/Sn$_{0.2}$/Ge(001) are much smaller than those for electrons in relaxed Ge mainly due to the increase of interaction caused by the strain between the conduction band and valence bands at the $\Gamma$ point. The lift of degeneracy in Ge/Ge$_{0.8}$/Sn$_{0.2}$(001) and Ge/Ge$_{0.8}$/Sn$_{0.2}$(001) makes m*$_{d}$ and m*$_{c}$ for holes smaller than those in relaxed Ge and results in the decrease of the interband scattering as well as interband scattering. The decrease of the interband scattering is more obvious in Ge/Ge$_{0.8}$/Sn$_{0.2}$(001) because of its large splitting energy between the heavy hole and light hole band. Therefore, Ge/Ge$_{0.8}$/Sn$_{0.2}$(001) is expected to be good candidate for the development of ultra high-speed CMOS device.CMOS device.eed CMOS device.CMOS device.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.378.2-378.2
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• 2014

We have investigated optical characteristics of $p-Ge_{0.99}Sn_{0.01}$ and Ge films grown on Si substrates using photoreflectance (PR) spectroscopy. The $Ge_{0.99}Sn_{0.01}$ and Ge films were grown by using an ultra-high vacuum chemical vapor deposition and molecular beam epitaxy methods, respectively. PR spectra were measured at 25 K and an extended InGaAs detector was used. By comparing $Ge_{0.99}Sn_{0.01}/Si$ and Ge/Si spectra, we observed the signals related to direct transition and split-off band of $Ge_{0.99}Sn_{0.01}$. The transition energies of $Ge_{0.99}Sn_{0.01}$ and Ge films were approximately 0.74 and 0.84 eV, respectively. Considering the shift of split-off band transition of $Ge_{0.99}Sn_{0.01}$, we suppose that the transition at 0.74 eV is attributed to direct transition between ${\Gamma}$ band and valence band. The temperature- and excitation power-dependent PR spectra were also measured.

• 한국분말재료학회지
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• 제9권6호
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• pp.422-432
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• 2002

Mechanically driven decomposition of intermetallics during mechanical milling(MM 1 was investigated. This process for Fe-Ce and Fe-Sn system was studied using conventional XRD, DSC, magnetization and alternative current susceptibility measurements. Mechanical alloying and milling form products of the following composition (in sequence of increasing Gecontent): $\alpha$(${\alpha}_1$) bcc solid solution, $\alpha$+$\beta$-phase ($Fe_{2-x}Ge$), $\beta$-phase, $\beta$+FeGe(B20), FeGE(B20), FeGe(B20)+$FeGe_2$,$FeGe_2$,$FeGe_2$+Ge, Ge. Incongruently melting intermetallics $Fe_6Ge_5$ and $Fe_2Ge_3$ decompose under milling. $Fe_6Ge_5$ produces mixture of $\hat{a}$-phase and FeGe(B20), $Fe_2Ge_3$ produces mixture of FeGe(B20) and $FeGe_2$ phases. These facts are in good agreement with the model that implies local melting as a mechanism of new phase for-mation during medchanical alloying. Stability of FeGe(B20) phase, which is also incongruently melting compound, is explained as a result of highest density of this phase in Fe-Ge system. Under mechanical milling (MM) in planetary ball mill, FeSn intermetallic decomposes with formation $Fe_5Sn_3$ and $FeSn_2$ phases, which have the biggest density among the phases of Fe-Sn system. If decomposition degree of FeSn is relatively small(<60%), milled powder shows superparamagnetic behavior at room temperature. For this case, magnetization curves can be fitted by superposition of two Langevin functions. particle sizes for ferromagnetic $Fe_5Sn_3$ phase determined from fitting parameters are in good agreement with crystalline sizes determined from XRD data and remiain approximately chageless during MM. The decomposition of FeSn is attributed to the effects of local temperature and local pressure produced by ball collisions.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.496-499
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• 2000

In order to investigate the effect of Ge addition to the Cu Matrix on the microstructure and the critical current density, four kinds of internal tin processed Nb$_3$Sn strands with pure Cu and Cu 0.2, 0.4, 0.6 wt％ Ge alloy were drawn to 0.8 mm diameter. The microstructure and critical current of internal tin processed Nb$_3$Sn wires that were heat treated at temperatures ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$ for 240 h were investigated. The Ge addition to the matrix did not make workability worse. A Ge rich layer in the Cu-Ge matrix suppressed the growth of the Nb$_3$Sn layer and promoted grain coarsening. The greater the Ge content in the matrix, the lower the net Jc result after Nb$_3$Sn reaction heat treatment. There was no significant variation in Jc observed with heat treatment temperature ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.104-107
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• 2001

In order to investigate the effect of Ge addition to the Cu matrix on the microstructure and the critical current density, four kinds of internal tin processed Nb$_3$Sn strands with pure Cu and Cu 0.2, 0.4, 0.6 wt % Ge alloys were drawn to 0.8 mm diameter. The microstructure and critical current of internal tin processed Nb$_3$Sn wires that were heat treated at temperatures ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$ for 240h were investigated. The Ge addition to the matrix did not make workability worse. A Ge rich layer in the Cu-Ge matrix suppressed the growth of the Nb$_3$Sn layer and promoted grain coarsening. The greater the Ge content in the matrix, the lower the net Jc result after Nb$_3$sn reaction heat treatment. There was no significant variation in Jc observed with heat treatment temperature ranging from 68$0^{\circ}C$ to 74$0^{\circ}C$. The values of AC loss of Ge added wires were decreased to 40 % compare with no addition wire. Low AC loss was due to segregation of Ge rich layer in the Cu-Ge matrix. If Ge added wire with thin Nb filaments were fabricated, slow diffusion rate of Sn would be overcome and decreased AC loss that is weak Point of internal tin method.

• 한국진공학회지
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• 제7권2호
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• pp.77-81
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• 1998

RHEED(Reflection High Energy Electron Diffraction)상(pattern)의 거울반사점 (specular spot) 강도의 주기적인 진동을 이용하여, 계면금속(surfactant)Sn을 흡착하지 않은 경우와 흡착한 경우 Ge(111)표면 위에서 Ge의 층상성장을 조사하였다. 계면금속을 흡착하지 않았을 경우, 기판온도 $200^{\circ}C$에서 반점의 강도가 24ML정도 안정되게 진동하는 것으로 보 아, Ge층상성장의 최적온도로 생각되었다. 계면금속(Sn) 0.5ML를 Ge(111) 표면위에 흡착시 킨 후, Ge성장에서는 기판온도 $200^{\circ}C$에서 성장초기에 불규칙한 진동이 나타났으며, 반점강 도의 주기적인 운동이 흡착하지 않은 경우 보다 더 큰 진폭으로 38ML이상까지 관찰되었으 며 Ge이 성장하는 동안 d2$\times$2 구조의 변화가 없었다. 이는 계면금속이 교환작용으로 성장표 면 쪽으로 편석(segregation)하면서 흡착원자의 표면확산 거리를 저해시켜 3차원적 핵성장 에 의한 층상성장을 저해하고 대신 2차원적 성장을 도우는 것으로 생각된다.

• 한국산업융합학회 논문집
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• 제4권4호
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• pp.451-455
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• 2001

The epitaxial growth of Ge on the clean and surfactant(Sn) adsorbed surface of Ge(111) was studied by the intensity oscillation of a RHEED specular spot. In the case of epitaxial growth without the adsorbed surfactant, the RHEED intensity oscillation was stable and periodic up to 24ML at the substrate temperature of $200^{\circ}C$. Therefore the optimum temperature for the epitaxial growth of Ge on clean Ge(111) seems to be $200^{\circ}C$. However, in the case of epitaxial growth with the adsorbed surfactant, the irregular oscillations are observed in the early stage of the growth. The RHEED intensity oscillation was very stable and periodic up to 38ML, and the $d2{\times}2$ structure was not charged with continued adsorption of Ge at the substrate temperature of $200^{\circ}C$. These results may be explained by the fact that the diffusion length of Ge atoms is increased by decreasing the activation energy of the Ge surface diffusion, resulted by segregation of Sn toward the growing surface. From the desorption process, the desorption energy of Sn in Ge $\sqrt{5}{\times}\sqrt{5}$ structure is observed to be 3.28eV.

• 한국자기학회지
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• 제23권4호
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• pp.117-121
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• 2013

본 연구에서는 대표적인 강자성 금속인 Fe에 비자성 원소가 치환된 비교적 단순한 B2 구조의 FeX(X = Al, Si, Ni, Ga, Ge, Sn) 합금의 자기변형계수를 제일원리계산으로 수행하여 Fe 기반 합금이 희토류 원소 기반 자기변형 물질인 Terfenol을 대체할 수 있는 가능성을 탐색하였다. 계산방법으로 자성 연구에 가장 적합한 것으로 알려져 있는 총퍼텐셜 선형보강 평면파(Full-potential Linearized Augmented Plane Wave; FLAPW) 방법을 사용하였으며 일반화 물매근사(generalized gradient approximation: GGA)을 도입하여 전자 상호간의 교환-상관 퍼텐셜을 기술하였다. B2 구조의 FeX(X = Al, Si, Ni, Ga, Ge, Sn)의 합금들 중에 FeSi와 FeGe은 비자성 상태가, 그 외 나머지 합금은 강자성 상태가 안정된 것으로 계산되었다. FeAl, FeNi, FeGa, FeSn의 자기변형계수 는 각각 -5, +6, -84, -522ppm으로 계산되어 FeSn은 큰 자기변형을 가질 수도 있음을 예측하였다.

• 한국자기학회지
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• 제2권2호
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• pp.99-104
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• 1992

상용의 Mn-Zn 훼라이트에 $GeO_{2}$와 $SnO_{2}$를 0.05, 0.3, 1.0 wt% 첨가하여 투자율의 온도특성, 손실인자 및 미세구조변화를 X-선 회절분석기, 주사전자현미경 및 LCR meter를 이용하여 관찰 하였다. $SnO_{2}$, $GeO_{2}$의 첨가량이 증가함에 따라, 투자율의 SPM(Secondary Peak Maximum)는 약 $80^{\circ}C$로부터 상온이하로 이동하였다. 미세구조의 현격한 변화없이 수반된 이러한 SPM의 이동은 이온 반경이 다른 Sn과 Ge이 주격자에 고용되었기 때문으로 판단된다. 투자율 및 손실인자의 주파수 의존성은 투자율이 100 kHz까지 모든조성에서 큰 변화가 없음을 알수있었고 손실인자는 10 kHz에서 최대값을 얻을 수 있었다.