• Journal of Sensor Science and Technology
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• v.19 no.4
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• pp.306-312
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• 2010

We have detected deoxynivalenol(DON) using a metal-oxide-semiconductor field-effect-transistor(MOSFET)-based biosensor. The MOSFET-based biosensor is fabricated by a standard complementary metal-oxide-semiconductor(CMOS) process, and the biosensor's electrical characteristics were investigated. The output of the sensor was stabilized by employing a reference electrode that applies a fixed bias to the gate. Au which has a chemical affinity for thiol was used as the gate metal to immobilize a self-assembled monolayer(SAM) made of 16-mercaptohexadecanoic acid(MHDA). The SAM was used to immobilize anti-deoxynivalenol antibody. The carboxyl group of the SAM was bound to the anti- deoxynivalenol antibody. Anti-deoxynivalenol antibody and deoxynivalenol were bound by an antigen-antibody reaction. In this study, it is confirmed that the MOSFET-based biosensor can detect deoxynivalenol at concentrations as low as 0.1 ${\mu}g$/ml. The measurements were performed in phosphate buffered saline(PBS; pH 7.4) solution. To verify the interaction among the SAM, antibody, and antigen, surface plasmon resonance(SPR) measurements were performed.

• Applied Chemistry for Engineering
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• v.9 no.1
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• pp.6-12
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• 1998

A FET(Field Effect Transistor) type dissolved $CO_2$ sensor based on Severinghaus type $CO_2$ sensor was fabricated by the photolithographic process. The sensor consists of Ag/AgCl reference electrode and membranes (hydrogel membrane and $CO_2$ gas permeable membrane) on the pH-ISFET base chip. Ag/AgCl reference electrode was fabricated as follows. Ag layer was thermally evaporated and then its upper surface was chemically chloridized into the AgCl. The hydrogel used as an internal electrolyte solution was fabricated by a photolithographic method using 2-hydroxyethyl methacrylate(HEMA) and acrylamide. $CO_2$ permeable membrane on the top of the hydrogel layer was formed by photolithographic process with UV-oligomer. The FET type $pCO_2$ sensor fabricated by photolithographic method showed good linearity within the concentration range of $10^{-3}{\sim}10^0mole/{\ell}$ of dissolved $CO_2$ in aqueous solution with high sensitivity.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.191-192
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• 2003

For the CNT-FED to be cost-effective, many efforts for the lower voltage operation have been made in the under-gate cathode structure. In this study, the effects of the frit proportion in the CNT paste, cathode electrode width, CNT-to-counter electrode gap, and the CNT length in the cathode structure were examined.

• Journal of Digital Convergence
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• v.16 no.12
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• pp.309-315
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• 2018

In this paper, propose an efficient arc detection and control method to achieve fast machining speed, improved precision and surface roughness in discharge machining, especially for carbide and hard material processing and metal processing using discharge phenomenon as energy. A single discharge waveform is divided into three sections of Td (Time-Delay), Ton (Time-on) and Toff (Time-off) and the gate control timing is simulated using the HDL language. In this paper, we analyze the effect of the gap between the electrode and the workpiece on the machining results by determining the operation of the servo mechanism by sampling the Td section through the comparator circuit. As a result of the analysis, the Td section of the formed waveform was more precisely sampled at a high speed and the results were improved when applied to the gap control between the electrode and the workpiece.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.73-77
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• 2023

In this study, we developed a Multi-level FeRAM (Ferroelectrics random access memory) device utilizing different ferroelectric materials and analyzed its operation through C-V analysis using simulations. To achieve Multi-level operation, we proposed an MFM (Multi-Ferroelectric Material) structure by depositing two different ferroelectric materials with distinct properties horizontally on the same bottom electrode and subsequently adding a gate electrode on top. By analyzing C-V peaks based on the polarization phenomenon occurring under different voltage conditions for the two materials, we confirmed the feasibility of achieving Multi-level operation, where either one or both of the materials can be polarized. Furthermore, we validated the process for implementing the proposed structure using semiconductor fabrication through process simulations. These results signify the significance of the new structure as it allows storing multiple states in a single memory cell, thereby greatly enhancing memory integration.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.5
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• pp.8-14
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• 2007

In this paper, $HfO_2$/Hf stacked film has been applied as the gate dielectric in MOS devices. The $HfO_2$ thin film was deposited on p-type (100) silicon wafers by atomic layer deposition (ALD) using TEMAHf and $O_3$ as precursors. Prior to the deposition of the $HfO_2$ film, a thin Hf metal layer was deposited as an intermediate layer. Round-type MOS capacitors have been fabricated on Si substrates with 2000${\AA}$-thick Al or Pt top electrode. The prepared film showed the stoichiometric components. At the $HfO_2$/Si interface, both Hf-Si and Hf-Si-O bonds were observed, instead of Si-O bond. The sandwiched Hf metal layer suppressed the growing of $SiO_x$ layer so that $HfSi_xO_y$ layer was achieved. It seems that the intermediate Hf metal layer has a benefit for the enhancement of electric characteristics of gate dielectric in $HfO_2$/Si structure.

• Journal of IKEEE
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• v.22 no.1
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• pp.209-212
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• 2018

In this work, we developed P(VDF-TrFE) organic/ferroelectric material based metal-ferroelectric-metal (MFM) capacitors in order to improve the switching characteristics of gallium nitride (GaN) heterojunction field-effect transistors (HFET). The 27 nm-thick P(VDF-TrFE) MFM capacitors exhibited about 60 ~ 96 pF capacitance with a polarization density of $6{\mu}C/cm^2$ at 4 MV/cm. When the MFM capacitor was connected in series with the gate electrode of GaN HFET, the subthreshold slope decreased from 104 to 82 mV/dec.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.163-163
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• 2015

The effect of nematic liquid crystal(5CB-4-Cyano-4'-pentylbiphenyl) on the amorphous indium gallium zinc oxide thin film transistors(a-IGZO TFTs) was investigated. Through dropping the 5CB on the a-IGZO TFT's channel layer which is deposited by RF-magnetron sputtering, properties of a-IGZO TFTs was dramatically improved. When drain bias was induced, 5CB molecules were oriented by Freedericksz transition generating positive charges to one side of dipoles. From increment of the capacitance by orientation of liquid crystals, the drain current was increased, and we analyzed these phenomena mathematically by using MOSFET model. Transfer characteristic showed improvement such as decreasing of subthreshold slope(SS) value 0.4 to 0.2 and 0.45 to 0.25 at linear region and saturation region, respectively. Furthermore, in positive bias system(PBS), prevention effect for electron trapping by 5CB liquid crystal dipoles was observed, which showing decrease of threshold voltage shift [(${\delta}V$]_TH) when induced +20V for 1~1000sec at the gate electrode.

• Korean Journal of Materials Research
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• v.8 no.1
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• pp.80-84
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• 1998

본 연구에서는 석영을 기판으로 사용하여 텅스텐 실리사이드 게이트를 고온에서 결정화시키고, 이\ulcorner 발생되는 crack 에 대한 생성원인을 조사하였다. 증착된 텅스텐실리사이드의 실리콘 조성과 실리콘 완층충의 두께가 증가함에 따라 열응력이 감소하는 경향이 관찰되었으며, 과잉의 실리콘 조성을 가진 실리사이드를 열처리한 경우에는 crack에 대한 저항이 증가함을 알 수 있었다. 그러나 실리콘 완충층을 사용한 경우는 두께가 증가함에 따라 열응력이 감소하는 경향이 있으나, crack이 보다 쉽게 발생되는 결과를 얻었다. 이는 실리사이드 반응에 의하여 거칠어진 계면에 응력이 집중되어 crack생성을 쉽게하는 것으로 여겨진다. 결과적으로 석영과 텅스텐실리사이드의 열\ulcorner창계수차이에 의하여 생성되는 열응력이 crack생성의 주원인으로 작용하고, 실리콘 완층층을 사용한 구조하에서는 계면에서 일어나는 실리사이드반응이 crack생성에 큰 영향을 미치는 것으로 생각된다.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.813-815
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• 2008

We prepared highly transparent and conductive Oxide/Metal/Oxide(OMO) multilayer by sputtering and developed wet etching process of OMO with a clear edge shape for the first time. The transmittance and sheet-resistance of the OMO are about 89% and $3.3\;{\Omega}/sq.$, respectively. We adopted OMO as a gate electrode of transparent TFT (TTFT) array and integrated OLED on top of the TTFT to result in high aperture ratio of bottom emission AM-OLED.