• 반도체디스플레이기술학회지
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• 제21권3호
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• pp.74-79
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• 2022

In this study, the plasma corrosion resistance and the change in the number of contamination particles generated using the plasma etching process and cleaning process of coating parts for semiconductor plasma etching equipment were investigated. As the coating method, atmospheric plasma spray (APS) was used, and the powder materials were Y₂O₃ and Y₃Al₅O₁₂ (YAG). There was a clear difference in the densities of the coatings due to the difference in solubility due to the melting point of the powdered material. As a plasma environment, a mixed gas of CF₄, O₂, and Ar was used, and the etching process was performed at 200 W for 60 min. After the plasma etching process, a fluorinated film was formed on the surface, and it was confirmed that the plasma resistance was lowered and contaminant particles were generated. We performed a surface cleaning process using piranha solution(H₂SO₄(3):H₂O₂(1)) to remove the defect-causing surface fluorinated film. APS-Y₂O₃ and APS-YAG coatings commonly increased the number of defects (pores, cracks) on the coating surface by plasma etching and cleaning processes. As a result, it was confirmed that the generation of contamination particles increased and the breakdown voltage decreased. In particular, in the case of APS-YAG under the same cleaning process conditions, some of the fluorinated film remained and surface defects increased, which accelerated the increase in the number of contamination particles after cleaning. These results suggest that contaminating particles and the breakdown voltage that causes defects in semiconductor devices can be controlled through the optimization of the APS coating process and cleaning process.

• 한국분말재료학회지
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• 제18권6호
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• pp.517-525
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• 2011

In this study, the used DOCs, which could remove the air pollutants such as CO and HC in the exhaust gas from diesel vehicle, were remanufactured by various conditions. Their catalytic performances and characterization were also investigated. The remanufacturing process of the deactivated DOCs includes high temperature cleaning of incineration, ultrasonic cleaning for washing with acid/base solutions to remove deactivating materials deposited to the surface of the catalysts, and active component reimpregnation for reactivating catalytic activity of them. The catalytic performance tests of the remanufactured DOCs were carried out by the diesel engine dynamo systems and chassi dynamo systems in CVS-75 mode. All prepared catalysts were characterized by the optical microscopes, SEM, EDX, porosimeter and BET to investigate correlations between catalytic reactivity and surface characteristics of them. The remanufactured DOCs at various conditions showed the improved catalytic performances reaching to 90% of fresh DOC, which is attributed to remove the deactivating materials from the surface of the used DOC through the analysis of catalytic performance test and their characterization.

• 한국전기전자재료학회논문지
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• 제23권5호
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• pp.353-357
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• 2010

Recently, silicon etching have received much attention for display industry, nano imprint technology, silicon photonics, and MEMS application. After the etching process, removing of etch mask and residue of sidewall is very important. The investigation of the etched mask removing was carried out by using the ashing, HF dipping and acid cleaning process. Experiment shows that oxygen component of reactive gas and photoresist react with silicon and converting them into the mask fence. It is very difficult to remove by using ashing or acid cleaning process because mask fence consisted of Si and O compounds. However, dilute HF dipping is very effective process for SiOx layer removing. Finally, we found optimized condition for etched mask removing.

• 한국인쇄학회지
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• 제15권2호
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• pp.117-130
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• 1997

Studies have been conducted to explore thermal imidization of polyamic acid. Aromatic polyimides are well recognized as high temperature linear polymers, and polyimide are used as structural materials, fibers, and adhesive. Two different kinds of polyimide were prepared by theimidization of polyamic acid which were synthesized from 2,2-bis[4-(4-aminophenoxy)phenyl]- hexafluoropropane, 2,2-bis [4-(4-aminophenxy)phenyl] - hexamethylpropane and caprolactam and pyromelliti dianhydride under N-Methly-pyrrolidinone solvent. Polyamic acids were converted to polyimides containing imide bond by thermal imidization. The weight 50% loss temperatures of polyimide by TGA thermogram were recorded in the range of 700 ~ 720$^{\circ}$C in nitrogen gas. According, as a results, we conclued polyamic acid were cycliation after H2O molecule separationed, and this polyimide film could be used for Printed Circuit Boand.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1997년도 하계학술대회 논문집 C
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• pp.1280-1282
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• 1997

The oxynitride films were photo-chemically deposited by ArF(wave length: 193nm) excimer laser CVD used to excite and dissociate gas phases $Si_2H_6$, $N_2O$, and $NH_3$ molecules. We obtained various electrical properties when we varied wafer cleaning procedures consisted of a conventional RCA and a two-dip step[4]. The results show the films have low leakage currents and good TZDB properties. We also analyzed the composition of the oxynitride films which have homogeneous composition throughout the film.

• 청정기술
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• 제5권1호
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• pp.62-77
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• 1999

전자 및 컴퓨터 산업의 발전으로 반도체 산업은 비약적으로 발전하고 있다. 그러나 반도체 제조 공정에서 필수적으로 사용되는 각종 환경 오염 물질에 대한 규제가 세계적으로 강화되고 있어 반도체 업계의 적극적인 환경 대응책이 없이는 반도체 수출에 대한 선진국의 제재를 피하기 어렵다. 따라서 본 연구에서는 청정 기술 측면에서, 반도체 산업의 환경영향 개선을 위한 세정 공정의 기술적 대체 방안에 대하여 조사하였다. 세정 공정의 대안으로서 기상 세정 공정, UV 사용 공정, 플라즈마 사용 공정을 조사하였으며, 각 공정의 장단점을 비교하였다.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 추계학술대회 논문집
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• pp.331-335
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• 2009

A novel multi-staged waste pyrolysis & gasification system of pilot scale (~1 ton/day) is designed and constructed in Korea Institute of Industrial Technology. The pyrolysis & gasification system is composed of pyrolysis & gasification system, syngas reformer, syngas cleaning system, gas engine power generation system and co-combustion system. For each unit process, experimental approaches have been conducted to find optimal design and operating conditions. As a result, We can produce syngas with a calorific value of ~4000 kcal/$Nm^3$ and cold gas efficiency of the system is more than 55 % in case of waste plastic and oxygen as a gasifying agent.

• 한국응용과학기술학회지
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• 제34권1호
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• pp.58-65
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• 2017

유동층가스화기는 경제적으로 기술적으로 입증된 기술로서 가장 상용화에 가까운 가능성을 보여주고 있다. 그러나 한국에서는 설계, 현장문제 해결뿐 아니라 파일럿 규모의 설비 운전 등이 부족하여 상용화에 이르지 못하고 있다. 본 연구에서는 바이오매스의 가스화를 위하여 3 MWth 급 순환유동층(CFB) 반응기를 개발하여 운전하였다. 유동층반응기는 순환유동층 반응기와 기포유동층 반응기로 구성되었으며 타르와 산성가스를 제거하기 위하여 세라믹필터, 급속냉각, 습식스크러버를 사용하였다. 3MWth 급 바이오매스 가스화기의 최적 운전조건을 도출하기 위하여 equivalence ratio에 따른 영향을 조사하였다

• 대한전자공학회논문지SD
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• 제41권12호
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• pp.13-19
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• 2004

반도체 또는 평판디스플레이 제조에 있어 노광공정 후의 PR(photo-resist) 제거 공정으로서 기존의 황산기반 용액을 대체하는 고농도 오존 수 생성 기술에 대한 연구를 수행하였다. 세라믹 연면방전구조의 오존발생장치를 개발하여, 0.5［ℓ/min］의 산소 유량에서 최대 12［wt%］이상의 오존가스 농도를 얻었으며, 이를 고농도로 물과 혼합하기 위한 고효율 오존접촉장치를 개발하였다. 오존 수 생성 실험 결과, 오존가스 10［wt%］에서 80［ppm］이상의 오존 수 농도를 달성하였으며, 70［ppm］의 오존 수에서 PR 제거율 147［nm/min］의 양호한 결과를 얻었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 C
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• pp.1698-1700
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• 2003

The electrostatic precipitator(ESP) is a device for removing particulate pollutants in the form of either a solid (dust or fumes) or a liquid (mist) from a gas using an electrostatic force, Electrostatic precipitation has been widely used for cleaning gas from almost all industrial processes with a medium to large gas volume(>2,000 $m^3/min$), including utility boilers, blast furnaces, and cement kilns. ESP is also in wide use for air cleaning in living environments (home, offices, hospitals, etc.) ESP has large advantages over other particulate control device : a low operating cost, a high collection performance, and ease of maintenance. The purpose of this study is to investigate the characteristics of the smoke removal of an air cleaner by adjusting variable frequency and monitoring of turbidity three results of this research are as follows ;the first is the best efficient switching frequency which is 60Hz, the second is the smoke removal time which is obtained to 9 seconds, third is that the best efficient firing angle is $90^{\circ}$ As a result, the switching trigger frequency and SCR gate firing angle is very important factor to predict the best collection efficiency.