• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.07b
• /
• pp.710-713
• /
• 2004

The design, simulation, modeling and measurement of a low temperature co-fired ceramic (LTCC) RF switch module for GSM applications is presented in this paper. RF switch module is constructed using a Rx/Tx switching circuit and integrated low pass filter. The low pass filter function was designed to operate in th GSM band. Insertion and return loss of the low pass filter were designed less than 0.3 dB and better than 12.7 dB at 900 MHz. The RF switch module contained 10 embedded passives and 3 surface mount components integrated on $4.6{\times}4.8{\times}1.2$ nm, 6-layer multi-layer integrated circuit. The insertion loss of switch module was measured at 900 MHz was 11 dB.

• Proceedings of the KIEE Conference
• /
• 2004.07c
• /
• pp.1673-1675
• /
• 2004

The design, modeling and measurement of RF switch module for GSM applications is presented in this paper. RF switch module is constructed using a LTCC multi-layer switching circuit and integrated low pass filter. Insertion and return loss of the low pass filter were designed less than 0.3 dB and better than 12.7 dB at 900 MHz. The RF switch module contained 10 embedded passives and 3 surface mount components integrated on $4.6{\times}4.8{\times}1.2$ mm, 6-layer multi-layer integrated circuit. The insertion loss of switch module was measured at 900 MHz was 11 dB.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
• /
• 2001.11a
• /
• pp.96-100
• /
• 2001

본 논문에서는 skeleton slot 복사기를 이용하여 GSM 900과 GSM 1800에서 사용할 수 있는 이중대역 안테나를 설계 및 제작하여 측정 결과를 비교 분서하였다. 기본적인 skeleton slot 구조에서는 낮은 밴드의 2배 이상의 주파수에서는 수평 빔폭이 일정치 않고, 정재파비 특성이 불량하였으나, 급전부와 측면 방사부분의 다중경로 형성 및 절곡 구조를 이용하여 이를 해결하였다. 안테나의 크기는 반사판이 190$\times$190(mm), 복사기는 154$\times$106(mm), 높이는 33mm로 하여 현재 서비스 사업자틀이 주로 사용하는 크기로 구성하였다. 구성 재질은 1mm 두께의 알류미늄판을 이용하며, 이를 NCT로 타공 및 절곡하여 제작하였기 때문에 대량 생산 시 단가를 낮출수 있다. 실측결과 900MHz 대역에서 13.7%, 1800MHz 대역에서 16.4%의 -l0dB 반사손실 대역폭을 만족하고, 방사패턴도 대역별로 $\pm$1$^{\circ}$이내의 일정한 양상을 보여 이중대역 안테나로서의 요구를 만족하였다.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.15 no.6
• /
• pp.540-547
• /
• 2004

In this paper, a current - mode class D(CMCD) power amplifier over 70 % power added efficiency at 900 ㎒ is designed and implemented. Based on push-pull class B structure, main power loss due to charge and discharge of output capacitance in switching mode power amplifier is minimized by applying a parallel harmonic control circuit. Experimental CMCD amplifier with 73 % power added efficiency at 3.2 W and 72 % power added efficiency at 5 W are achieved respectively. In addition a characteristic of switching mode power amplifier whose output power is proportional to magnitude of U power is verified.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.22 no.9
• /
• pp.881-887
• /
• 2011

In this paper, we proposed vertically structured radiator for increasing bandwidth and gain of mobile phone internal antenna. The proposed antenna has vertically structured radiator instead of planar structured radiator to improve the antenna characteristics for GSM850/900 and DCS1800/PCS1900 bands. The antenna improve bandwidth of low band with 28 % than planar structured radiator. and also, improve bandwidth of high band with 14 %, efficiency 31.80~86.36 %, average gain -4.956~-0.617 dBi on the GSM850/900 and DCS1800/PCS1900 bands. These results are good performance among the small antenna with vertically structured radiator for increasing bandwidth and gain.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.18 no.3 s.118
• /
• pp.288-297
• /
• 2007

The novel internal monopole chip antenna of penta-band operation for GSM850/GSM900/DCS/USPCS/WCDMA bands for mobile phones is proposed. This antenna occupies a small volume $8\times3.2\times20mm^3$ and is suitable to be embedded in a mobile phone as an internal antenna. The minimization of the proposed antenna was realized by using spiral line structure and meander line structure on FR-4 of dielectric$(\varepsilon_r=4.4)$. The designed antenna has the wide-band operation in the upper band by overlapping high order resonances. The measured bandwidth of this antenna (VSWR>3) is 150MHz$(1,030\sim1,180\;MHz)$ in the lower band operation and 650 MHz$(1,760\sim2,410\;MHz)$ in higher band operation. The measured radiation efficiency within bandwidth(VSWR 3:1) is over 50 %. The antenna has been designed by a commercial software HFSS.

• Journal of the Korea Institute of Information and Communication Engineering
• /
• v.14 no.5
• /
• pp.1270-1276
• /
• 2010

In this paper, Quad-Band small antenna for GSM850, GSM900, DCS1800, DCS1900 is designed and fabricated. The antenna achieved the size reduction of over 67.9 % than the conventional PIFA(Planar Inverted-F Antenna) by using a MD(Magneto-Dielectric) material. A simple feeding microstrip line is used to feed the antenna from a $50{\Omega}$ coaxial line, which is capacitively coupled to the grounded patch structure for broadband characteristics. The impedance bandwidth the proposed antenna shows good results as broadband characteristics of 1341 MHz (801 ~ 2142 MHz) in VSWR < 3 (${\leq}\;-6\;dB$) and the gain is -6.67 ~ 4.25 dBi in the operating frequency.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.21 no.6
• /
• pp.706-713
• /
• 2010

In this paper, the small loop antenna with a parasitic loop structure for penta-band mobile phone application is proposed. This antenna is composed of a feed monopole, a radiating loop antenna with a parasitic loop structure and an additional radiating element. The antenna is printed on the very thin flexible substrate to mount on the dielectric carrier with a volume of 40 mm$\times$11 mm$\times$3 mm. The bandwidth of the proposed antenna is 402 MHz(773~1,175 MHz) for low band and 583 MHz(1,622~2,205 MHz) for high band. As a result, the proposed antenna covers the five bands of GSM850, GSM900, DCS1800, PCS1,900 and WCDMA for a 3:1 VSWR. Moreover, the radiation pattern, gain and efficiency are appropriate for mobile handset. Therefore, this antenna is suitable for small sized multi-band mobile handset applications.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.19 no.4
• /
• pp.477-483
• /
• 2008

The paper introduces mobile handset multi-band chip antenna to be used on meander line PIFA structure and parasite patch. The proposed antenna uses an FR-4 substrate. The top layer is consist of meander lines PIFA structure to implement GSM900 and is connected with each rad and meander line on the via-hole for maximize space efficiency. The middle layer is designed with the signal line and gap to implement a DCS and PCS bands, the bottom layer which is added to a parasite patch on the ground can be show an adjust of frequency and impedance character by the connection of the radiators of middle layer and coupling. The fabricated antenna with the dimension of $28{\times}6{\times}4\;mm^3$. The ground plane a dimension of $45{\times}90\;mm$, designed by a commercial software CST simulator. The experimental results show that the bandwidth for(VSWR<3) is 90($875{\sim}965$) MHz in GSM900 band operation and 380($1,670{\sim}2,050$) MHz in DCS, PCS band operation. The maximum gains of antenna are 0.25 dBi, 3.65 dBi and 3.3 dBi at resonance frequencies and it has omni-directional pattern practically.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.11a
• /
• pp.431-434
• /
• 2004

The design, simulation, modeling and measurement of a RF switch module for GSM applications were presented in this paper. switch module were simulated by ADS and constructed using a LTCC multi-layer switching circuit and integrated low pass filter, designed to operate in the GSM band. Insertion and return losses at 900 MHz of the low pass filters were designed to lower than 0.3 dB and higher than 12.7 dB respectively. The switch module constructed, contained 10 embedded passives and 3 surface mounted components integrated on $4.6{\times}4.8{\times}1.2$ m volume, 6-layer integrated circuit. The insertion loss of switch module at m MHz were around 11 dB.