• Title/Summary/Keyword: Fusion temperature

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A Novel Runner Design for Flow Balance of Cavities in Multi-Cavity Injection Molding (다수 빼기 사출성형에서 캐비티간 충전균형을 위한 새로운 런너의 설계)

  • Park, Seo-Ri;Kim, Ji-Hyun;Lyu, Min-Young
    • Polymer(Korea)
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    • v.33 no.6
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    • pp.561-568
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    • 2009
  • Small injection molded articles are generally molded by multi-cavity injection molding. The most important thing in multi-cavity molding is flow imbalance among the cavities because it affects the physical property and the quality of products. The cavity filling balance can be achieved by flow balance in the runner through the thermal balance. In this study, novel screw type runner or helical type runner has been developed for the flow balance in the runner and performed experiment and computer simulation. Flow balance has been observed using various screw type runners for several resins such as amorphous and crystalline polymers including low and high viscosities grades. Flow balance experiments have been performed for various injection speeds since the flow balance can be affected by injection speed among the injection conditions. Experimental results have been compared with computational results and they showed good agreement. The cavity filling balance can be achieved by the screw runner where the temperature distribution is uniform through the circulation flow along the screw channel in the screw runner. It has been verified that the novel screw runner is very effective device in flow balance in the multi-cavity injection molding. cavity filling imbalance, multi-cavity injection molding, runner design, screw runner, thermal balance.

Numerical Analysis of Warpage and Stress for 4-layer Stacked FBGA Package (4개의 칩이 적층된 FBGA 패키지의 휨 현상 및 응력 특성에 관한 연구)

  • Kim, Kyoung-Ho;Lee, Hyouk;Jeong, Jin-Wook;Kim, Ju-Hyung;Choa, Sung-Hoon
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.2
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    • pp.7-15
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    • 2012
  • Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

Performance analysis of SNR and BER for radiation pattern reconfigurable antenna (인체 부착용 방사패턴 재구성 안테나의 SNR 및 BER 성능 분석)

  • Lee, Chang Min;Jung, Chang Won
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.16 no.6
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    • pp.4125-4130
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    • 2015
  • This paper presents the communication performance for the radiation pattern reconfigurable antenna in the wearable device measuring bio signal (temperature, blood pressure, pulse etc.) of human body. The operational frequency is 2.4 - 2.5 GHz, which covers Bluetooth communication bandwidth. The maximum gain of the antennas is 1.96 dBi. The proposed antenna is efficiently transmitting and receiving signal by generating two opposite beam directions using two RF switches (PIN diode). Also, we investigated how radiation pattern changes according to three angles ($30^{\circ}$, $90^{\circ}$, $150^{\circ}$) of Top Loading. In this paper, we measured and compared the SNR (Signal-to-Noise Ratio) and BER (Bit Error Rate) performances of the proposed antennas in the condition between an ideal environment of anechoic chamber and smart house existing practical electromagnetic interferences (Universal Software Radio Peripheral, USRP). Throughout the comparing the results of the measurement of two cases, we found that the SNR is degraded over 5dB in average and BER is increased over ten times in maximum, therefore, it is confirmed that the error rate of receiving signal is increased. The measured results of SNR and BER value in this paper able to expect the performance degrading by the interference from the electromagnetic devices.

The Study on Filling Factor of Radiation Shielding Lead-free Sheet Via Screen Printing Method (스크린 프린팅 공법을 통한 방사선 무연 차폐 시트에 관한 연구)

  • Kang, Sang-Sik;Jeong, Ah-Rim;Lee, Su-Min;Yang, Seung-Woo;Kim, Kyo-Tae;Heo, Ye-Ji;Park, Ji-Koon
    • Journal of the Korean Society of Radiology
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    • v.12 no.6
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    • pp.713-718
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    • 2018
  • In many previous studies, monte carlo simulation is used to produce lead-free shielding sheet, and the possibility of radiation shielding capability and weight reduction is presented. But it is difficult to simulation for binder and micro-pores because of In fact it does not provide sufficient information necessary for the commercialization process. Therefore, in this paper, the results of radiation shielding capability corresponding to filling factor was presented by using the screen printing method to provide information on gel-paste required for the commercialization process. In this study, the geometric setup for evaluate of radiation shielding ability was designed to comply with IEC 61331-1:2014 and KS A 4025. In addition, radiation irradiation conditions were 100 kVp filtered with 2.0 mmAl total filtration was applied according to KS A 4021 standard. In this study, Pb $1270{\mu}m$, $BaSO_4$ $3035{\mu}m$, $Bi_2O_3$ $1849{\mu}m$ and $WO_3$ $2631{\mu}m$ were analyzed based on ten value layer. Additionally, the filling factor was analyzed as $BaSO_4$ 38.6%, $Bi_2O_3$ 27.1%, $WO_3$ 30.15%. However, in the case of applying low-temperature high-pressure molding in the future, it is expected that the radiation shielding capability can be sufficiently improved by reducing the porosity while increasing the filling factor.

Hexagonal shape Si crystal grown by mixed-source HVPE method (혼합소스 HVPE 방법에 의해 성장된 육각형 Si 결정)

  • Lee, Gang Seok;Kim, Kyoung Hwa;Park, Jung Hyun;Kim, So Yoon;Lee, Ha Young;Ahn, Hyung Soo;Lee, Jae Hak;Chun, Young Tea;Yang, Min;Yi, Sam Nyung;Jeon, Injun;Cho, Chae Ryong;Kim, Suck-Whan
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.31 no.3
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    • pp.103-111
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    • 2021
  • Hexagonal shape Si crystals were grown by the mixed-source hydride vapor phase epitaxy (HVPE) method of mixing solid materials such as Si, Al and Ga. In the newly designed atmospheric pressure mixed-source HVPE method, nuclei are formed by the interaction between GaCln, AlCln and SiCln gases at a high temperature of 1200℃. In addition, it is designed to generate a precursor gas with a high partial pressure due to the rapid reaction of Si and HCl gas. The properties of hexagonal Si crystals were investigated through scanning electron microscopy (FE-SEM), energy dispersive X-ray spectroscopy (EDS), high-resolution X-ray diffraction (HR-XRD), and Raman spectrum. From these results, it is expected to be applied as a new material in the Si industry.

Improvement of lower hybrid current drive systems for high-power and long-pulse operation on EAST

  • M. Wang;L. Liu;L.M. Zhao;M.H. Li ;W.D. Ma;H.C. Hu ;Z.G. Wu;J.Q. Feng ;Y. Yang ;L. Zhu ;M. Chen ;T.A. Zhou;H. Jia;J. Zhang ;L. Cao ;L. Zhang ;R.R. Liang;B.J. Ding ;X.J. Zhang ;J.F. Shan;F.K. Liu ;A. Ekedahl ;M. Goniche ;J. Hillairet;L. Delpech
    • Nuclear Engineering and Technology
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    • v.54 no.11
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    • pp.4102-4110
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    • 2022
  • Aiming at high-power and long-pulse operation up to 1000 s, some improvements have been made for both 2.45 GHz and 4.6 GHz lower hybrid (LH) systems during the recent 5 years. At first, the guard limiters of the LH antennas with graphite tiles were upgraded to tungsten, the most promising material for plasma facing components in nuclear fusion devices. These new guard limiters can operate at a peak power density of 12.9 MW/m2. Strong hot spots were usually observed on the old graphite limiters when 4.6 GHz system operated with power >2.0 MW [B. N. Wan et al., Nucl. Fusion 57 (2017) 102019], leading to a reduction of the maximum power capability. With the new limiters, 4.6 GHz LH system, the main current drive (CD) and electron heating tool for EAST, can be operated with power >2.5 MW routinely. Long-pulse operation up to 100 s with 4.6 GHz LH power of 2.4 MW was achieved in 2021 and the maximal temperature on the guard limiters measured by an infrared (IR) camera was about 540 ℃, much below the permissible value of tungsten material (~1200 ℃). A discharge with a duration of 1056 s was achieved and the 4.6 GHz LH energy injected into the plasma was up to 1.05 GJ. Secondly, the fully-active-multijunction (FAM) launcher of 2.45 GHz system was upgraded to a passive-active-multijunction (PAM), for which the density of optimum coupling was relatively low (below the cut-off value). Good coupling with reflection coefficient ~3% has been achieved with plasma-antenna distance up to 11 cm for the new PAM. Finally, in order to eliminate the effect of ion cyclotron range of frequencies (ICRF) wave on 4.6 GHz LH wave coupling, the location of the ICRF launcher was changed to a port that is located 157.5° toroidally from the 4.6 GHz LH system and is not magnetically connected.

Low Temperature Inducible Acid Tolerance Response in virulent Salmonella enterica serovar Typhimurium (병원성 Salmonella enterica serovar Typhimurium의 저온 유도성 산 내성 반응)

  • Song, Sang-Sun;Lee, Sun;Lee, Mi-Kyoung;Lim, Sung-Young;Cho, Min-Ho;Park, Young-Keun;Park, Kyeong-Ryang;Lee, In-Soo
    • Korean Journal of Microbiology
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    • v.37 no.3
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    • pp.228-233
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    • 2001
  • The acid tolerance response (ATR) of log-phase Salmouella enterica seroyar Typhimurium is induced by acid adaptation below pH4.5 and will protect cells against more severe acid. Two distinctive ATR systems in thisorganism are a log-phase and stationary-phase ATR in which acid adaptations trigger the synthesis of acid shockproteins (ASPs). We found that log-phase ATR system was strongly affected by environmental factor, low tem-perature, $25^{\circ}C$. Exposure to low temperature and mild acid has been shown to increase acid survival dra-matically, and this survival rate was showed higher than $37^{\circ}C$. Especially unadapted cells at $25^{\circ}C$ presented tenthousand folds survival increasing when compared with cells at $37^{\circ}C$. The degree of acid tolerance of rpoSwhich is blown to be required for acid tolerance more increase than $37^{\circ}C$. Even though AIR pattern of rpoSbetween unadapted and adapted was showed similar at pH 3.1, rpoS-dependent ATR system also has beendetected in low temperature because rpoSAp prevents sustained acid survival at $25^{\circ}C$. Therefore the resultssuggest low temperature ATR system requires rpoS-dependent and -independent both. To investigate the basisfor low temperature related ATR system, gene that was participated for low temperature acid tolerance (lat) wasscreened in virulent S. enterica serovar Typhimurium UKl Using the technique of P22- MudJ (Km, lacZ)-directed lacZ operon fusion, LF452 latA‥‥MudJ was isolated. The latA‥‥MudJ of S. enterica Typhimurium pre-vented low temperature acid tolerance response. Therefore latA is considered one of the important genes for acidadaptation.

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A Study on Fire Hazards in Multiple Compartments with Lightweight Partition Walls (경량칸막이 벽체를 통한 다중구획공간에서의 화재위험성에 관한 연구)

  • Park, Sang-Min;Choi, Su-Gil;Jin, Se-Young;Kim, Si-Kuk
    • Fire Science and Engineering
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    • v.34 no.2
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    • pp.14-21
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    • 2020
  • This paper presents the study of a fire risk to the backside of two miniatures of ISO 9705 2/5 using a lightweight partition for indoor space division and reproduction of the ISO 9705 test. An SGP partition, stud partition, glass wool panel, urethane foam panel, sandwich panel, and glass partition were selected as the test specimens, which are frequently used in construction. According to the ISO 9705 test standard, stabilization was achieved using a measuring device that recorded data before the ignition of a burner and continued recording for 120 s thereafter. After ignition was achieved, the power was increased to 300 kW for 600 s and then reduced to 100 kW for 600 s. The specimens were subsequently observed for 180 s, and the fire risk to the backside and the fire pattern of the wall unit were analyzed. Owing to the amount of heat generated by the ignition source, the maximum temperature of the backside was observed to be 67.7 ℃ for the SGP partition, 55.1 ℃ for the stud partition, 52.4 ℃ for the glass wool panel, 727.4 ℃ for the sandwich panel, 561 ℃ for the urethane foam panel, and 630.5 ℃ for the glass partition. In the cases of the sandwich and urethane foam panels, the explosion of flammable gas occurred by virtue of fusion of the interior materials. The reinforced glass was fractured owing to the temperature difference between the heat- and nonheat-responsive parts. Ultimately, the fire risk to the nearby section room was deemed to be high.

Studies on Cure Kinetics and Thermal Stability of Epoxy/Nylon 6 Blend (에폭시/나일론6 블랜드의 경화 동력학 및 열안정성에 관한 연구)

  • Kim, Dong-Kyu;Kim, Kwan-Woo;Han, Woong;Kwac, Lee-Ku;Kim, Byung-Joo
    • Applied Chemistry for Engineering
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    • v.26 no.5
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    • pp.538-542
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    • 2015
  • In this work, effects of the blend composition composed of 0, 10, 20, 30 and 40 wt% of nylon 6 to epoxy (diglycidylether of bisphenol-A, DGEBA) resin were investigated in terms of cure kinetics and thermal stability by differential scanning calorimeter (DSC) and thermogravimetric analysis (TGA). As the content of the nylon 6 increased, the maximum exothermic temperature ($T_{max}$) and the value of cure activation energy ($E_a$) decreased. The maximum exothermic temperature of the blending samples decreased with increasing in nylon 6 content, resulting in the decrease in curing activation energy of them due to the rapid curing reaction with epoxy resin in this system. From TGA analysis results of the DGEBA/nylon 6, the thermal stability based on the thermal stability index ($A^*{\cdot}K^*$) and integral procedure decomposition temperature (IPDT) increased with increase in the nylon 6 content. This was because of the combination of DGEBA and nylon 6 having good heat resistance, resulting in improving thermal stability of the DGEBA/nylon 6.

Investigation of the Molding Conditions to Minimize Residual Stress and Shrinkage in Injection Molded Preform of PET Bottle (PET 병용 프리폼 사출성형에서 잔류응력과 수축 최소화를 위한 성형조건의 연구)

  • Cho, Sung-Hwan;Hong, Jin-Su;Lyu, Min-Young
    • Polymer(Korea)
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    • v.35 no.5
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    • pp.467-471
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    • 2011
  • PET bottle is manufactured by blow molding the preform, which is molded by injection molding. The neck part of the preform of PET bottle for juice or grain-based beverage is crystallized before blowing to improve heat resistance at the entrance of the bottle. However, residual stress, developed during injection molding of preform, prevents the crystallization. In order to release the residual stress in the preform, the preform is annealed after the injection molding. If the residual stress is reduced by optimizing the injection molding conditions of preform the annealing time would be shortened. In this study, the optimum conditions for minimizing the residual stress and increasing dimensional accuracy of the injection molded preform are suggested through CAE analysis. In order to optimize the molding conditions, minimizing residual stress and shrinkage, computer simulations have been carried out with help of design of experiment scheduling. Injection temperature, initial packing pressure and filling time were selected for control parameters. Residual stress was affected by injection temperature and filling time. Shrinkage was affected by injection temperature. It was found that maximum residual stress, distribution of residual stress and shrinkage were decreased by 22%, 40% and 25%, respectively at an optimum molding condition compared with the results of previous molding condition.