• Fire Science and Engineering
• /
• v.17 no.1
• /
• pp.1-7
• /
• 2003

In general, small buildings and residence housings rely on manual fire extinguishers instead of automatic fire suppression systems, which causes bigger disasters during the absence of human-beings or in the presence of children or the olders. For this reason, simple structured and low-cost automatic fire extinguisher using fusible metal detector was newly developed and patented. In this paper, some field tests were carried out to investigate its fire suppression performance. As a result, reaction time of the detection parts varied from 2 min 19s to 7 min 20s depending upon the room size and installation position. It was suggested that to reduce reaction time within 3 minutes, fusible metals with lower melting point should be adopted and the installation location should be moved to near ceiling instead of below 1.5 m.

• Fire Science and Engineering
• /
• v.17 no.4
• /
• pp.64-69
• /
• 2003

Low story apartments and housings with manual fire extinguishers are very susceptible to fro damages, when people are absent or there are old and weak peoples. To reduce such fire damages, automatic fire suppression at the early stage is very important, and thus automatic and cost-effec-tiye fire extinguisher was developed. This study revealed that the reaction temperature and response time are greatly influenced by the small thickness variation of the detective parts and heating rates. The influence of the thickness of the detective parts was shown significant when the heating rate was low, The reduction in the thickness could lower the response time to 40seconds.

• Korean Journal of Materials Research
• /
• v.31 no.8
• /
• pp.471-479
• /
• 2021

The electrochemical reaction between lead borate glass frit doped with Sn metal filler and Ni-Cr wire of a J-type resistor during a term of Joule heating is investigated. The fusing behavior in which the Ni-Cr wire is melted is not observed for the control group but measured for the Sn-doped specimen under 30 V and 500 mA. The Sn-doped lead borate glass frit shows a fusing property compared with other metal-doped specimens. Meanwhile, the redox reaction significantly contributes to the fusing behavior due to the release of free electrons of the metal toward the glass. The electrons derived from the glass, which used Joule heat to reach the melting point of Ni-Cr wire, increase with increasing corrosion rate at interface of metal/glass. Finally, the confidence interval is 95 ± 1.95₉ %, and the adjusted regression coefficient, R in the optimal linear graph, is 0.93, reflecting 93% of the data and providing great potential for fusible resistor applications.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.3
• /
• pp.53-57
• /
• 2011

In the modern packaging technologies highly condensed metal interconnects are typically formed by highcost processes. These methods inevitably require the precise controls of mutually dependant process parameters, which usually cause the difficulty of the change in the layout design for interconnects of chip to-chip, or chip-to-substrate. In order to overcome these problems, the unique concept and methodology of self-assembly even in micro-meter scale were developed. In this report we focus on the factors which influenced the self-formed bumps by analyzing the phenomenon experimentally. In case of RMA flux, homogenous pattern was obtained in both plain surface and cross-section surface observation. By using RA flux, the phenomena were accelerated although the self-formtion results was inhomogenous. With ussage of moderate RA flux, reaction rate of the self-formation was accelerated with homogeneous pattern.

• Journal of the Korean institute of surface engineering
• /
• v.50 no.6
• /
• pp.510-515
• /
• 2017

In this study, a transient liquid phase sintering (TLPS) process of Ag pastes mixed with a fusible metal alloy of Bi58Sn42 with the melting temperature of $138^{\circ}C$, was examined. After screen printing of the Ag pastes with and without Bi58Sn42 powders on polyimide (PI) substrates, the electrodes were heat-treated at different temperatures in the range between 150 and $300^{\circ}C$ for 60 min in air. Comparing the electrical conductivity of the Ag pastes with and without Bi58Sn42 alloy powder after the heat treatment, it was manifested that the low melting temperature alloy definitely played a major role in an increased conductivity when it is added into the Ag pastes by providing more electrical conduction paths between Ag particles. This can be explained by the fact that capillary force of the melts of Bi58Sn42 can contribute to the rearrangement of the Ag particles during the heat-treatment inducing better connectivity between the Ag particles.