• Title/Summary/Keyword: Fringe Multiplication

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Analysis of Stress Distribution of a Curved Beam Using Photoelasticity (광탄성법을 이용한 곡선보 평판의 응력분포 해석)

  • Baek, Tae-Hyun;Kim, Myung-Soo;Kim, Soo-Il
    • Journal of the Korean Society for Nondestructive Testing
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    • v.19 no.3
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    • pp.200-206
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    • 1999
  • This paper describes the stress analysis of a curved beam by using photoelasticity. In order to measure accurate isochromatic fringe orders at certain locations. fringes are doubled and sharpened by digital image processing. After fringe multiplication and sharpening. fringe orders can be read as a quarter order interval (N=0, 1/4, 2/4, 3/4,...). The results obtained from photoelastic experiment are compared with those calculated by using theory. Two results are agreed well even though there are some scatter bands with maximum 8 percent for the results of photoelastic measurements and theoretical calculation. Difference may be occurred due to the slight misalignment of the direction to which axial load is applied in photoelastic experiment. It is confirmed that accurate measurement of stress distribution can be possible by using the techniques of fringe multiplication and sharpening in photoelasticity.

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Development of Image Processing Technique for Photoelastic Fringe Analysis (광탄성 프린지해석을 위한 영상처리기법 개발)

  • 백태현;이재춘
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.10
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    • pp.2577-2584
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    • 1994
  • A method of digital image processing thechnique, which can multiply and sharpen isochromatic fringes in photoelasticity on both occasions, is developed. To test the method, photoelastic fringe patterns of a disk compressed by two diametrically opposite cocentrated loads are simulated and these patterns are processed to yield sharpened lines. The method is then aplied to measurement of residual stresses in glass bar. The procedure is proved to be capable of extraction sharpened lines accurately from photoelastic multiplied fringes, and yields good experimental results consistently and precisely.

Accurate Measurement of Residual Stresses of Glass Rods by Photoelasticity (광탄성법에 의한 유리봉 잔류응력의 정밀측정)

  • Baek, Tae-Hyun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.20 no.5
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    • pp.1524-1533
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    • 1996
  • Risidual stress of cylindrical glass rods are measured by photoelasticity to study the variation of stresses with respect to heat treatment temperatures. In order to measure the stresses accurately, fringe sharpening and multiplication techniques are applied to the determination of photoelastic fringe orders. Filon's separationmethod is used to resolve circumferential and redial stress ocmponents from isochromatic fringes which are the same as in-plane maximum shearing stresses. According to the photoelastic measurements, residual stress is increased as the heat treatment temperature of the rods is raised from $560^{\circ}C$ to $650^{\circ}C$ All the circumferential stress components are changed from tensile stresses to compressive ones at approximate $R_m$/$R_o$ = 0.6, where $R_o$/ is outer radius and $R_m$any measured radius. This analysis shows that residual stresses of the glass rods approach zero if the rods are heat-treated near the strain point.

Determination of Stress Intensity Factor $K_I$ from Two Fringe Orders by Fringe Multiplication and Sharpening

  • Chen, Lei;Baek, Tae-Hyun
    • Journal of the Korean Society for Nondestructive Testing
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    • v.27 no.6
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    • pp.550-555
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    • 2007
  • Stress intensity factor is one of the most important parameters in fracture mechanics. Both the stress field distribution and the crack propagation are closely related to these parameters. Due to the complexity of actual engineering problems, it is difficult to calculate the stress intensity factor by theoretical formulation, so photoelasticity method is a good choice. In this paper, modified two parameter method is employed to calculate stress intensity factor for opening mode by using data from more than one photoelastic fringe loop. For getting accurate experiment results, the initial fringes are doubled and sharpened by digital image programs from the fringe patterns obtained by a CCD camera. Photoelastic results are compared with those obtained by the use of empirical equation and FEM. Good agreement shows that the methods utilized in experiments are considerably reliable. The photoelastic experiment can be used for bench mark in theoretical study and other experiments.

Hybrid Photoelastic Stress Analysis Around a Central Crack Tip in a Tensile Loaded Plate Using Isochromatic Data (등색프린지 데이터를 이용한 인장하중 판재 중앙 균열선단 주위의 하이브리드 광탄성 응력장 해석)

  • Baek, Tae-Hyun;Chen, Lei
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.31 no.12
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    • pp.1200-1207
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    • 2007
  • An experimental test is presented for photoelastic stress analysis around a crack tip in tensile loaded plate. The hybrid method coupling photoelastsic fringe inputs calculated by finite element method and complex variable formulations involving conformal mappings and analytical continuity is used to calculate full-field stress around the crack tip in uniaxially loaded, finite width tensile plate. In order to accurately compare calculated fringes with experimental ones, both actual and regenerated photoelastic fringe patterns are two times multiplied and sharpened by digital image processing. Regenerated fringes by hybrid method are quite comparable to actual fringes. The experimental results indicate that Mode I stress intensity factor analyzed by the hybrid method are accurate within three percent compared with ones obtained by empirical equation and finite element analysis.

Hybrid Full-field Stress Analysis around a Circular Hole in a Tensile Loaded Plate using Conformal Mapping and Photoelastic Experiment (등각사상 맵핑 및 광탄성 실험법에 의한 원형구명 주위의 하이브리드 응력장 해석)

  • Baek, Tae-Hyun;Kim, Myung-Soo;Rhee, Ju-Hun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.23 no.6 s.165
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    • pp.988-1000
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    • 1999
  • An experimental study is presented for the effect of number of terms of a pewee series type stress function on stress analysis around a hole in tensile loaded plate. The hybrid method coupling photoelastsic data inputs and complex variable formulations involving conformal mappings and analytical continuity is used to calculate tangential stress on the boundary of the hole in uniaxially loaded, finite width tensile plate. In order to measure isochromatic data accurately, actual photoelastic fringe patterns are two times multiplied and sharpened by digital image processing. For qualitative comparison, actual fringes are compared with calculated ones. For quantitative comparison, percentage errors and standard deviations with respect to percentage errors are caculated for all measured points by changing the number of terms of stress function. The experimental results indicate that stress concentration factors analyzed by the hybrid method are accurate within three percent compared with ones obtained by theoretical and finite element analysis.

Nano-level High Sensitivity Measurement Using Microscopic Moiré Interferometry (마이크로 무아레 간섭계를 이용한 초정밀 변형 측정)

  • Joo, Jin-Won;Kim, Han-Jun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.32 no.2
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    • pp.186-193
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    • 2008
  • [ $Moir{\acute{e}}$ ] interferometry is an optical method, providing whole field contour maps of in-plane displacements with high resolution. The demand for enhanced sensitivity in displacement measurements leads to the technique of microscopic $moir{\acute{e}}$ interferometry. The method is an extension of the $moir{\acute{e}}$ interferometry, and employs an optical microscope for the required spatial resolution. In this paper, the sensitivity of $moir{\acute{e}}$ interferometry is enhanced by an order of magnitude using an immersion interferometry and the optical/digital fringe multiplication(O/DFM) method. In fringe patterns, the contour interval represents the displacement of 52 nm per fringe order. In order to estimate the reliability and the applicability of the optical system implemented, the measurements of rigid body displacements of grating mold and the coefficient of thermal expansion(CTE) for an aluminium block are performed. The system developed is applied to the measurement of thermal deformation in a flip chip plastic ball grid array package.