• 제목/요약/키워드: Friction force monitoring

검색결과 26건 처리시간 0.029초

마찰력 측정을 통한 CMP 공정의 모니터링 (CMP Process Monitoring through Friction Force Measurement)

  • 정해도;박범영;이현섭;김형재;서헌덕
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.622-625
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    • 2004
  • The CMP monitoring system was newly developed by the aid of friction force measurement, resulting from installation of piezoelectric quartz sensor on R&D polisher. The correlation between friction and CMP results was investigated in terms of tribological aspects by using the monitoring system. Various friction signals were monitored and analyzed by the change of experimental conditions such as pressure, velocity, pad and slurry. First of all, the lubrication regimes were classified with Sommerfeld Number through measuring coefficient of friction in ILD CMP. And then, the removal mechanism of abrasives could be understood through the correlation with removal rate and coefficient of friction. Especially, the amount of material removal per unit sliding distance is directly proportional to the friction force. The uniformity of CMP performances was also deteriorated as coefficient of friction increased.

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CMP에서의 스틱-슬립 마찰특성에 관한 연구 (A Study on the Characteristics of Stick-slip Friction in CMP)

  • 이현섭;박범영;서헌덕;박기현;정해도
    • 한국전기전자재료학회논문지
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    • 제18권4호
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    • pp.313-320
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    • 2005
  • Stick-slip friction is one of the material removal mechanisms in tribology. It occurs when the static friction force is larger than the dynamic friction force, and make the friction curve fluctuated. In the friction monitoring of chemical mechanical polishing(CMP), the friction force also vibrates just as stick-slip friction. In this paper, an attempt to show the similarity between stick-slip friction and the friction of CMP was conducted. The prepared hard pa(IC1000/Suba400 stacked/sup TM/) and soft pad(Suba400/sup TM/) were tested with SiO₂ slurry. The friction force was measured by piezoelectric sensor. According to this experiment, it was shown that as the head and table velocity became faster, the stick-slip time shortened because of the change of real contact area. And, the gradient of stick-slip period as a function of head and table speed in soft pad was more precipitous than that of hard one. From these results, it seems that the fluctuating friction force in CMP is stick-slip friction caused by viscoelastic behavior of the pad and the change of real contact area.

Cu CMP에서 스틱-슬립 마찰과 스크래치에 관한 연구 (A Study on Stick-slip Friction and Scratch in Cu CMP)

  • 이현섭;박범영;정석훈;정재우;서헌덕;정해도
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.653-654
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    • 2005
  • Stick-slip friction is one of the material removal mechanisms in tribology. This stick-slip friction occurs when the static friction force is larger than the dynamic friction force, and make the friction curve fluctuated. In the friction force monitoring system for chemical mechanical polishing(CMP), the friction force also vibrates just as stick-slip friction. It seems that the stick-slip friction causes scratches on the surface of moving parts. In this paper, A study on the scratches which occur during copper CMP was conducted in a view of stick-slip friction.

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프레스 딥 드로잉 가공 시 플랜지부의 마찰진동 측정에 관한 기초연구 (A study on measuring friction vibration in flange area during deep drawing process)

  • 윤재웅
    • Design & Manufacturing
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    • 제17권4호
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    • pp.8-13
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    • 2023
  • In this study, it was studied whether a new measurement factor "frictional vibration" that occurs due to the material flow of the die and sheet metal in the flange area during deep drawing process, could be measured using an vibration sensor. The blank holder force acting on the flange area during drawing processing acts as a friction force in the opposite direction into which the sheet material flows and causes friction vibration. As the blank holder force increases, the friction force increases, and as the blank holder force decreases, the friction force also decreases. Because of this, friction vibration also increases and decreases in proportion to the size of the blank holder force. According to this theory, whether frictional vibration occurs was measured using a flange simulator and a vibration sensor. The initial pressure was created using a torque wrench, and it was confirmed that the amplitude increased by about 4 times when torque 6 Nm was increased. When the forming velocity was rapidly changed to 300 mm/min, the amplitude increased approximately 4 times. It was confirmed that the amplitude of frictional vibration according to the measurement location was greater the further away from the specimen. It was verified that a new measurement factor "friction vibration" in the flange area can be measured and used for online monitoring.

CNC 선반에서의 절삭력 감지 시스템 개발 (Development of a Cutting Force Monitoring System for a CNC Lathe)

  • 허건수;이강규;김재옥
    • 한국정밀공학회지
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    • 제16권1호통권94호
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    • pp.219-225
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    • 1999
  • Monitoring of the cutting force signals in cutting process has been well emphasized in machine tool communities. Although the cutting force can be directly measured by a tool dynamometer, this method is not always feasible because of high cost and limitations in setup. In this paper an indirect cutting force monitoring system is developed so that the cutting force in turning process is estimated based on a AC spindle drive model. This monitoring system considers the cutting force as a disturbance input to the spindle drive and estimates the cutting force based on the inverse dynamic model. The inverse dynamic model represents the dynamic relation between the cutting force, the motor torque and the motor power. The proposed monitoring system is realized on a CNC lathe and its estimation performance is evaluated experimentally.

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모델에 근거한 선삭력 모니터링 (Model-Based Monitoring of the Turning Force)

  • 허건수
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
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    • pp.11-15
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    • 1999
  • Monitoring of the cutting force signals in cutting process has been well emphasized in machine tool communities. Although the cutting force can be directly measured by a tool dynamometer, this method is not always feasible because of high cost and limitations in setup. In this paper an indirect cutting force monitoring system is developed so that the cutting force in turning process is estimated based on a AC spindle drive model. This monitoring system considers the cutting force as a disturbance input to the spindle drive and estimates the cutting force based on the inverse dynamic model. The inverse dynamic model represents the dynamic relation between the cutting force, the motor torque and the motor power. The proposed monitoring system is realized on a CNC lathe and its estimation performance is evaluated experimentally.

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현장시험을 통한 기초 말뚝 부마찰력의 특성과 시공관리 (Characteristics of Negative Skin Friction of Foundation Pile and Construction Management by Experimental Field Test)

  • 홍석우
    • 한국도로학회논문집
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    • 제14권3호
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    • pp.41-48
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    • 2012
  • 본 연구에서는 교량기초 말뚝의 부주면마찰력 시험을 통하여 연약지반에 타설된 강관말뚝의 부주면마찰력을 측정하였으며 장기적인 마찰응력의 관측시험을 통하여 경제적인 상부구조물 시공시기를 판단하였다. 본 연구의 결론은 다음과 같다. (1) 연약지반에서 부마착력의 크기는 침하속도가 클수록 크게 나타났다. (2) 마찰력의 관계 그래프에서 마찰응력의 증감이 없는 시기를 확인하여 상부구조물 시공시기를 판단할 수 있었다. (3) 말뚝정재하시험결과와 부주면마찰력 시험결과를 비교해 본 결과 항타 직후의 부주면마찰력은 재하시험 시의 마찰응력보다 크게 나오는 것으로 판단되며 15일 경과후의 측정값은 비슷하게 나오는 것으로 판단되었고, 이론식에 의한 결과와도 비슷하였다. (4) 부주면마찰력의 장기관측기법을 사용하면 부주면마찰력이 발생하고 있는 중이라도 적절한 상부구조물의 시공시기를 파악할 수 있어 경제적인 시공관리가 가능한 것으로 판단된다.

고압 RTM 공정에서 고속 수지 유동에 의한 섬유 보강재의 변형 거동에 관한 연구 (A Study on Slip Behavior of Fiber Preform by High Speed Resin Flow in High Pressure Resin Transfer Molding)

  • 안종무;성동기;이원오;엄문광;최진호
    • Composites Research
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    • 제27권1호
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    • pp.31-36
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    • 2014
  • 본 연구에서는 고압 RTM 공정에서 고속 수지 유동에 의한 섬유 보강재의 변형 거동에 관한 연구를 진행하였다. 이를 위해 섬유와 금형의 마찰계수 측정 장치와 고압 RTM 공정을 모사하여 preform 변형을 평가하는 장치를 구축하였다. 마찰계수 측정 장치를 통해 금형-섬유 간 Coulomb 마찰계수와 수력학적 마찰 계수를 측정하였고, preform 변형 평가 장치를 통해 preform의 변형이 발생할 때의 유체에 의해 작용하는 외력의 힘을 측정하였다. 마찰계수를 이용하여 마찰력을 구하고 외력과 비교하여 직물의 슬립(slip) 여부를 판별할 수 있었다. 유체에 의해 섬유에 작용하는 외력이 섬유와 금형 사이의 마찰력보다 커지게 되면 직물이 움직이는 것으로 관찰 되었으며, 이는 섬유의 체적률과 마찰계수에 주로 영향을 받는 것으로 나타났다.

ITO 박막의 연마특성과 마찰력 신호와의 상관관계 (Relationship between Frictional Signal and Polishing Characteristics of ITO Thin Film)

  • 장원문;박기현;박범영;서헌덕;김형재;정해도
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2006년도 춘계학술대회 논문집
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    • pp.479-480
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    • 2006
  • The purpose of this paper is to investigate the relationship between CMP(Chemical Mechanical Polishing) characteristics of ITO thin film and friction signal by using the CMP monitoring system. Suba 400 pad and MSW2000 slurry of the Rohm & Haas Co. was used in this experiment to investigate the charateristics of ITO CMP. From this experiment, it is proven that the coefficient of friction is related to uniformity of the removal rate of the ITO thin film. Therefore, the prediction of polishing result would be possible by measuring friction signal.

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On-line Monitoring of Tribology Parameters and Fault Diagnosis for Disc Brake System

  • Yang Zhao-Jian;Kim Seock-Sam
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2003년도 학술대회지
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    • pp.224-228
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    • 2003
  • The basic Principles and methods of the on-line monitoring of tribology parameters (friction coefficient and wear allowance) and fault diagnosis for the hoist disc brake system were introduced, the method were based on the spring force and oil pressure of the brake system and the hoist kinematics parameters. The experiment on the monitoring and diagnosis of hoist brake system were carried out. The research results showed: the monitoring and diagnosis methods are feasible.

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