Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)
- 2006.05a
- /
- Pages.479-480
- /
- 2006
- /
- 2005-8446(pISSN)
Relationship between Frictional Signal and Polishing Characteristics of ITO Thin Film
ITO 박막의 연마특성과 마찰력 신호와의 상관관계
- Chang O.M. (Mecha. & Prec. Eng. Dept. PNU) ;
- Park K.H. (Mecha. & Prec. Eng. Dept. PNU) ;
- Park B.Y. (Mecha. & Prec. Eng. Dept. PNU) ;
-
Seo H.D.
(Mecha. & Prec. Eng. Dept. PNU)
;
-
Kim H.J.
(G&P technology)
;
-
Jeong H.D.
(Mechanical Eng. Dept., PNU)
- 장원문 (부산대 정밀기계공학과) ;
- 박기현 (부산대 정밀기계공학과) ;
- 박범영 (부산대 정밀기계공학과) ;
-
서헌덕
(부산대 정밀기계공학과)
;
-
김형재
(지앤피테크놀로지)
;
-
정해도
(부산대 기계공학부)
- Published : 2006.05.01
Abstract
The purpose of this paper is to investigate the relationship between CMP(Chemical Mechanical Polishing) characteristics of ITO thin film and friction signal by using the CMP monitoring system. Suba 400 pad and MSW2000 slurry of the Rohm & Haas Co. was used in this experiment to investigate the charateristics of ITO CMP. From this experiment, it is proven that the coefficient of friction is related to uniformity of the removal rate of the ITO thin film. Therefore, the prediction of polishing result would be possible by measuring friction signal.
Keywords