• Journal of The Korean Digital Architecture Interior Association
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• v.12 no.3
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• pp.5-13
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• 2012

In this study, features and design effects of PV(Photovoltaic) modules were classified to help the installation of BIPV(Building Integrated Photovoltaic) In addition, through domestic and international trends and cases survey, installation method was organized and applicable range of efficiency and design from First-generation solar cells to the third-generation solar cell was classified. Frist, Crystalline Solar cell module of first-generation is appropriate for the wall type, roof, louver, shading and etc. It has superiority of technology and price stability and can be achieved by a variety of aesthetic effects. Second, Dye-Sensitized Solar Cell of Thin Film solar cell can express a variety of colors, adjust light transmittance and maximize the aesthetic splendor. It is appropriate for the wall type, window type, curtain wall type and etc. Also, see-through type solar cell can provide comforts cause of free flow of light. And it is advantageous from economic due to adjust the indoor temperature. It is appropriate for the atrium type, curtain wall type, window type and etc.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2003.05a
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• pp.393-396
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• 2003

Conventional method for designing and installing anechoic chambers is to utilize porous wedges for the sound absorbers. As cutoff frequency lowers down such as 63Hz or 50Hz, the corresponding long wedges diminish the free field area of the chamber. In this study, a new broadband compact absorber(BCA) is introduced which absorbs acoustic energy down to 50Hz. Most prominent is that it measures only 250mm thick. A freely vibrating panel between the non-fibrous absorbers allows tuned absorption at the low frequency region in addition to the high frequency absorption resulted from the conventional absorber installed at the front. Standing waves at low frequency range are suppressed as the BCA modules which are tuned to the corresponding modes absorb sound energy effectively, resulting in anechoic condition. Not only the low frequency performances, but the high frequency absorption is measured to meet adequate conditions for the anechoic chamber. Realized BCA chambers are presented.

• Journal of the Korean Society of Safety
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• v.17 no.4
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• pp.178-183
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• 2002

The purpose of this study was to quantitatively investigate the effects of external load upper extremity posture on perceived discomfort. An experiment was conducted for measuring discomfort scores depending upon external loads and upper extremity postures, in which the free modules and numeric estimate method of the magnitude estimation was adopted as a tool for obtaining discomfort ratings. The upper extremity postures were controlled by wrist flexion/extension, elbow foexion, shoulder flexion, and shoulder adduction/abduction. The results showed that all experimental variables except shoulder adduction/abduction were significant at ${\alpha}$=0.01 or 0.05. The effect of external load was very much larger than that of upper extremity postures. Therefore, it is recommended that a new posture classification scheme taking effect of external load to into consideration be developed for quantifying postural load.

• Journal of Information Processing Systems
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• v.10 no.1
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• pp.69-80
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• 2014

The free distance of (n, k, l) convolutional codes has some connection with the memory length, which depends on not only l but also on k. To efficiently obtain a large memory length, we have constructed a new class of (2k, k, l) convolutional codes by (2k, k) block codes and (2, 1, l) convolutional codes, and its encoder and generation function are also given in this paper. With the help of some matrix modules, we designed a single structure Viterbi decoder with a parallel capability, obtained a unified and efficient decoding model for (2k, k, l) convolutional codes, and then give a description of the decoding process in detail. By observing the survivor path memory in a matrix viewer, and testing the role of the max module, we implemented a simulation with (2k, k, l) convolutional codes. The results show that many of them are better than conventional (2, 1, l) convolutional codes.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.11
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• pp.21-31
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• 1998

This study described computer aided die design system for cold forging of non-axisymmetric parts. To design the die of cold forging. an integrated approach based on a rule-base system and commercial F. E. code were adopted. This system is implemented on the personal computer and its environment is a commercial CAD package named as AutoCAD. The system includes four modules. In the initial data input module, the variables which are necessary to design of die are inputted by user and die material are selected from the database. In the analysis and redesign module, stress distrubution action on the designed die is analyzed by commercial FEM code NISA II. The designed die is modified to prevent failure in both states of stress free and pressurizing. The developed system provides powerful capabilities for die design of non-axisymmetric parts.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.5
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• pp.115-121
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• 1996

Recently, the Z-Map model has been used widely to represent the three dimensional geometric shape and to achieve the cross-section and point evaluation of the shape. In this paper, the CNC cutting planning and simulation modules for product with three dimensional geometric shape are realized based on the Z-Map model. The realized system has the various capabilities related to the automatic generation of tool path for the rough and finish cutting processes, the automatic elimination of overcut, the automatic generation of CNC program for a machining center and the cutting simulation. Especially, the overcut-free tool path is obtained by using the CL Z-Map models which are composed of the offset surfaces of the geometric shape of product.

• Communications of the Korean Mathematical Society
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• v.38 no.1
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• pp.21-38
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• 2023

Let R be a commutative ring with identity. Let R be an integral domain and M a torsion-free R-module. We investigate the relation between the notion of e-exactness, recently introduced by Akray and Zebari [1], and generalized the concept of homology, and establish a relation between e-exact sequences and homology of modules. We modify some applications of e-exact sequences in homology and reprove some results of homology with e-exact sequences such as horseshoe lemma, long exact sequences, connecting homomorphisms and etc. Next, we generalize two special drived functor T or and Ext, and study some properties of them.

• The Bulletin of The Korean Astronomical Society
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• v.45 no.1
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• pp.66.3-66.3
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• 2020

We present the optical design of Linear Astigmatism Free - Three Mirror System (LAF-TMS) D200 for UVO-Multiband Polarizing Imager System (UVOMPIS). LAF-TMS D200 is the off-axis wide-field telescope with EPD = 200 mm, F/2, and Field of View (FoV) = 2° × 4°. Its optical mirrors are optimized to freeform surfaces for high-quality optical performance over a wide FoV. The proposed mirror holder consists of four aluminum optomechanical modules that have applied for LAF-TMS D150 which is a prototype of the LAF-TMS system. It can accurately mount mirrors and also can sustain from vibration environments. As a feasibility study, quasi-static, modal, harmonic, and random vibration analyses have been performed to LAF-TMS D150 optomechanical structure under the qualification level of the Soyuz-2/Fregat launch system. We evaluate the vibration analysis results in terms of von Mises stress and Margin of Safety.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.