• Title/Summary/Keyword: Free Drop

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Study on the Lapping Characteristics of Sapphire Wafer by using a Fixed Abrasive Plate (고정 입자 정반을 이용한 사파이어 기판의 연마 특성 연구)

  • Lee, Taekyung;Lee, Sangjik;Jo, Wonseok;Jeong, Haedo;Kim, Hyoungjae
    • Tribology and Lubricants
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    • v.32 no.2
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    • pp.44-49
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    • 2016
  • Diamond mechanical polishing (DMP) is a crucial process in a sapphire wafering process to improve flatness and achieve the target thickness by using free abrasives. In a DMP process, material removal rate (MRR) is a key factor to reduce process time and cost. Controlling mechanical parameters, such as velocity and pressure, can increase the MRR in a DMP process. However, there are limitations of using high velocities and pressures for achieving a high MRR owing to their side effects. In this paper, we present the lapping characteristics and improvement of MRR by using a fixed abrasive plate through an experimental study. The change in MRR as a function of velocity and pressure follows Preston's equation. The surface roughness of a wafer decreases as the plate velocity and pressure increases. We observe a sharp decrease in MRR over the lapping time at a high velocity and pressure in the velocity and pressure test. An analysis of surface roughness (Rq and Rpk) indicates that wear of abrasives decreases the MRR sharply. In order to investigate the effect of abrasive wear on the MRR, we utilize a cutting fluid and a rough wafer. The cutting fluid delays the wear of abrasives resulting in improvement of MRR drop. The rough wafer maintains the MRR at a stable rate by self-dressing.

Experimental Study of the Supersonic Free Jet Discharging from a Petal Nozzle (페탈노즐로부터 방출되는 초음속 자유제트에 관한 실험적 연구)

  • Lee, Jun-Hee;Kim, Jung-Bae;Gwak, Jong-Ho;Kim, Heuy-Dong
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.2133-2138
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    • 2003
  • In general, flow entrainment of surrounding gas into a supersonic jet is caused by the pressure drop inside the jet and the shear actions between the jet and the surrounding gas. In the recent industrial applications, like supersonic ejector system or scramjet engine, the rapid mixing of two different gases is important in that it determines the whole performance of the flow system. However, the mixing performance of the conventional circular jet is very low because the shear actions are not enough. The supersonic jet discharging from a petal nozzle is known to enhance mixing effects with the surrounding gas because it produces strong longitudinal vortices due to the velocity differences from both the major and minor axes of petal nozzle. This study aims to enhance the mixing performance of the jet with surrounding gas by using the lobed petal nozzle. The jet flows from the petal nozzle are compared with those from the conventional circular nozzle. The petal nozzles employed are 4, 6, and 8 lobed shapes with a design Mach number of 1.7 each, and the circular nozzle has the same design Mach number. The pitot impact pressures are measured in detail to specify the jet flows. For flow visualization, the schlieren optical method is used. The experimental results reveal that the petal nozzle reduces the supersonic length of the supersonic jet, and leads to the improved mixing performance compared with the conventional circular jet.

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Electrochemical Migration Characteristics of Sn-3.0Ag-0.5Cu Solder Alloy in NaBr and NaF Solutions (NaBr 및 NaF 용액에 대한 Sn-3.0Ag-0.5Cu 솔더 합금의 Electrochemical Migration 특성)

  • Jung, Ja-Young;Jang, Eun-Jung;Yoo, Young-Ran;Lee, Shin-Bok;Kim, Young-Sik;Joo, Young-Chang;Chung, Tai-Joo;Lee, Kyu-Hwan;Park, Young-Bae
    • Journal of Welding and Joining
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    • v.25 no.3
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    • pp.57-63
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    • 2007
  • Electrochemical migration characteristics of Pb-free solder alloys are quantitatively correlated with corrosion characteristics in harsh environment conditions. In-situ water drop test and corrosion resistance test for Sn-3.0Ag-0.5Cu solder alloys were carried out in NaBr and NaF solutions to obtain the electrochemical migration lifetime and pitting potential, respectively. Sn-3.0Ag-0.5Cu solder alloy shows similar ionization and electrochemical migration behavior with pure Sn because of Ag and Cu do not migrate due to the formation of resistant intermetallic compounds inside solder itself. Electrochemical migration lifetime in NaBr is longer than in NaF, which seems to be closely related to higher pitting potential in NaBr than NaF solution. Therefore, it was revealed that electrochemical migration lifetime of Sn-3.0Ag-0.5Cu solder alloys showed good correlation to the corrosion resistance, and also the initial ionization step at anode side is believed to be the rate-determining step during electrochemical migration of Pb-free solders in these environments.

Bacterial adhesion and colonization differences between zirconia and titanium implant abutments: an in vivo human study

  • De Oliveira, Greison Rabelo;Pozzer, Leandro;Cavalieri-Pereira, Lucas;De Moraes, Paulo Hemerson;Olate, Sergio;De Albergaria Barbosa, Jose Ricardo
    • Journal of Periodontal and Implant Science
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    • v.42 no.6
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    • pp.217-223
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    • 2012
  • Purpose: Several parameters have been described for determining the success or failure of dental implants. The surface properties of transgingival implant components have had a great impact on the long-term success of dental implants. The purpose of this study was to compare the tendency of two periodontal pathogens to adhere to and colonize zirconia abutments and titanium alloys both in hard surfaces and soft tissues. Methods: Twelve patients participated in this study. Three months after implant placement, the abutments were connected. Five weeks following the abutment connections, the abutments were removed, probing depth measurements were recorded, and gingival biopsies were performed. The abutments and gingival biopsies taken from the buccal gingiva were analyzed using real-time polymerase chain reaction to compare the DNA copy numbers of Aggregatibacter actinomycetemcomitans, Porphyromonas gingivalis, and total bacteria. The surface free energy of the abutments was calculated using the sessile water drop method before replacement. Data analyses used the Mann Whitney U-test, and P-values below 0.05 find statistical significance. Results: The present study showed no statistically significant differences between the DNA copy numbers of A. actinomycetemcomitans, P. gingivalis, and total bacteria for both the titanium and zirconia abutments and the biopsies taken from their buccal gingiva. The differences between the free surface energy of the abutments had no influence on the microbiological findings. Conclusions: Zirconia surfaces have comparable properties to titanium alloy surfaces and may be suitable and safe materials for the long-term success of dental implants.

Effects of Ag and Cu Additions on the Electrochemical Migration Susceptibility of Pb-free Solders in Na2SO4 Solution

  • Yoo, Y.R.;Nam, H.S.;Jung, J.Y.;Lee, S.B.;Park, Y.B.;Joo, Y.C.;Kim, Y.S.
    • Corrosion Science and Technology
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    • v.6 no.2
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    • pp.50-55
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    • 2007
  • The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

Seismic Performance of the Framed Apartment Building Structure with Damping System (감쇠시스템을 적용한 라멘조 아파트의 내진성능평가)

  • Chun, Young-Soo;Lee, Bum-Sik;Park, Ji-Young
    • Land and Housing Review
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    • v.8 no.3
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    • pp.181-187
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    • 2017
  • To proactively respond to internal and external changes such as the recent demographic change and rising demand for diversified housing types, this study investigated the framed-structure free plan public house model proposed by the LH to look at the seismic performance of framed-structure apartment according to damper system use through non-linear analysis. The effectiveness thereof was also examined in terms of performance and economy. As a result, the proposed damper system application method to framed-structure free plan public house model was found to meet the performance requirements of the present earthquake-resistant design (KBC2016) and effective to apply to designs. The max response displacement and max response acceleration were compared based on the nonlinear analysis. As a result, the building with damper system showed better earthquake resistance performance than earthquake-resistant structure thanks to the damper system, although the base shear of earthquake-resistant system was reduced by 20% in design. The damper system is expected to help reduce building damage while ensuring excellent earthquake resistance performance. In addition, the framework quantities of earthquake-resistant structure and structure with damping system were compared. As a result, columns were found to reduce concrete amount by about 3.9% and rebar, by about 7.3%. Walls showed about 12.6% reduction in concrete and about 10.7% in rebar. In terms of cost, framework construction cost including formwork and foundation expenses was expected to drop by about 5~6%.

Optimization of the in vitro fertilization system in pigs

  • Song-Hee Lee;Xiang-Shun Cui
    • Journal of Animal Reproduction and Biotechnology
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    • v.38 no.2
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    • pp.70-76
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    • 2023
  • Background: Despite considerable technological advancements, polyspermy remains a significant challenge in in vitro fertilization (IVF) procedures in pigs, disrupting normal embryonic development. Here, we aimed to determine whether optimal fertilization conditions reduce the polyspermy incidence in pigs. Methods: In vitro-matured oocytes were co-incubated with sperm according to a modified two-step culture system. Results: In the first experiment, oocytes were briefly co-incubated with sperm, washed in IVF medium, and then moved to fresh IVF medium for 5 or 6 h. Although the 6 h sperm-free cultured group had a higher penetration rate than the 5 h cultured group, the polyspermy rate significantly increased in the 6 h sperm-free cultured group. The gamete co-incubation period was either 20 or 40 min. The 40 min cultured group had a higher rate of blastocyst formation and number of total cells in blastocysts than the 20 min cultured group. In experiment 2, oocytes were inseminated with sperm separated by Pecroll treatment. Percoll treatment increased the rate of oocyte penetration and blastocyst formation compared to the control. In experiment 3, fertilized oocytes were cultured in 25 µL microdroplets (10 gametes/drop) or 500 µL (100 gametes/well) of culture medium in 4-well plates. The large volume of medium significantly reduced the number of dead oocytes and increased the rate of blastocyst formation compared to the small volume. Conclusions: Collectively, these results demonstrate that various fertilization conditions, including modified co-culture period, active sperm separation, and culture medium volume, enhance fertilization efficiency and subsequent embryonic development by decreasing polyspermy occurrence.

A Study on the Correlation with the Degree of Compaction and the Penetration Depth Using the Portable Penetration Meter at Field Test (휴대용 다짐도 측정기의 현장실험을 통한 다짐도와 관입깊이 상관성 연구)

  • Park, Geoun Hyun
    • Journal of the Korean GEO-environmental Society
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    • v.19 no.11
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    • pp.5-14
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    • 2018
  • Worldwide, soil compaction work is one of the most important activities that are carried out on civil engineering works sites. Compaction work, particularly in the area of road construction, is considered to be important, as poor compaction work is closely related with poor construction even after a construction is complete. Currently, the plate bearing test or the sand cone method relative to the unit weight of soil test are commonly used to measure the degree of compaction, but as these require a great deal of time, equipment and manpower, it is difficult to secure economic efficiency. The method that is used to measure the degree of compaction according to the penetration depth achieved by free fall objects through gravity is the Free-Fall Penetration Test (FFPT), which uses a so-called "portable compaction measuring meter (PCMM)." In this study, the degree of compaction was measured and a penetration depth graph was developed after the field test using the portable compaction measuring meter. The coefficient of determination was 0.963 at a drop height of 10 cm, showing the highest level of accuracy. Both horizontal axis and longitudinal axis were developed in a decimal form of graph, and the range of allowable error was ${\pm}1.28mm$ based on the penetration depth. The portable compaction measuring meter makes it possible to measure the degree of compaction simply, quickly and accurately in the field, which will ensure economic efficiency and facilitate the process management.

Design and Implementation of a Low-Code/No-Code System

  • Hyun, Chang Young
    • International journal of advanced smart convergence
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    • v.8 no.4
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    • pp.188-193
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    • 2019
  • This paper is about environment-based low-code and no-code execution platform and execution method that combines hybrid and native apps. In detail, this paper describes the Low-Code/No-Code execution structure that combines the advantages of hybrid and native apps. It supports the iPhone and Android phones simultaneously, supports various templates, and avoids developer-oriented development methods based on the production process of coding-free apps and the produced apps play the role of Java virtual machine (VM). The Low-Code /No-Code (LCNC) development platform is a visual integrated development environment that allows non-technical developers to drag and drop application components to develop mobile or web applications. It provides the functions to manage dependencies that are packaged into small modules such as widgets and dynamically loads when needed, to apply model-view-controller (MVC) pattern, and to handle document object model (DOM). In the Low-Code/No-Code system, the widget calls the AppOS API provided by the UCMS platform to deliver the necessary requests to AppOS. The AppOS API provides authentication/authorization, online to offline (O2O), commerce, messaging, social publishing, and vision. It includes providing the functionality of vision.

Effect of REM Addition on The Surface Tension and The Critical Temperature of The Immiscible Liquid Phase Separation of The 60%Bi-24%Cu-16%Sn alloy

  • Park, Joong-Chul;Min, Soon-Ki;Lee, Joon-Ho
    • Korean Journal of Materials Research
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    • v.19 no.2
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    • pp.111-114
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    • 2009
  • For the fabrication of core-shell structure bimetallic lead-free solder balls, both the critical temperature ($T_{cr}$) for the phase separation of two immiscible liquid phases and the temperature coefficient of the interfacial tension between the two separated liquid phases are required. In order to obtain this information, the temperature dependence of the surface tension of 60%Bi-24%Cu-16%Sn(-REM) alloys was measured using the constrained drop method. The slope of the temperature dependence of the surface tension changed clearly at a critical temperature for the separation of two immiscible liquid phases. The critical temperature of the 60%Bi-24%Cu-16%Sn alloy was estimated to be 1097K. An addition of 0.05% Ce decreased the critical temperature to 1085K, whereas that of 0.05% La increased it to 1117K. It was found that the surface tension and its temperature coefficient of the 60%Bi-24%Cu-16%Sn alloy were slightly increased by the addition of 0.05% Ce and 0.05% La. In addition, additions of Ce and La increased the temperature coefficient of the interfacial tension.