• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.7
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• pp.1434-1437
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• 2011

Precision measurement of silicon wafer resistivity has been using single-configuration Four-Point Probe(FPP) method. This FPP method have to applying sample size, shape and thickness correction factor for a probe pin spacing to precision measurement of silicon wafer. The deference for resistivity measurement values applied correction factor and not applied correction factor was about 1.0 % deviation. The sample size, shape and thickness correction factor for a probe pin spacing have an effects on precision measurement for resistivity of silicon wafer.

• Journal of Electrical Engineering and Technology
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• v.10 no.1
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• pp.325-330
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• 2015

With approval from the Asia Pacific Metrology Program Working Group on Materials Metrology (APMP WGMM), an international comparison for sheet resistance standards for silicon wafers was firstly conducted among Korea Research Institute of Standards and Science (KRISS) in Korea, CMS/ITRI in Taiwan, and NIM in China, which are national metrology institutes (NMIs), from August 2011 to January 2012. The sheet resistance values of the standards are $10{\Omega}$, $100{\Omega}$, and $1000{\Omega}$; the measurement was conducted in sequence at KRISS, CMS/ITRI, NIM, and KRISS again using the four-point probe method with single and dual configuration techniques. The reference value for the measurement results of the three NMIs was obtained through averaging the values of the three results for each sheet resistance range. The differences between the reference value and the measured values is within 0.22% for $10{\Omega}$, 0.17% for $100{\Omega}$, and 0.12% for $1000{\Omega}$. Therefore, the international consistency for conducting sheet resistance measurements is confirmed within 0.22% through the APMP WGMM approved comparison.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.4 s.175
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• pp.874-880
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• 2000

In this paper, a DC potential drop measurement system was used to find the position of the flaw on a simple thin plate. Four-point probe test was evaluated and used for this study. In the four-point probe test, the more distance between current pins provides the more measurable scope, the less voltage difference, and the more voltage difference rate. In the other hand, the more distance between voltage pins provides the less voltage difference and the less voltage difference rate. An optimized four-point probe was applied to measure the relation between voltage and the relative position of flaw to the probe. The Maxwell 21) simulator was used to analyze the electromagnetic field, and it showed that the analytical result was similar to the experimental result within 11.4% maximum error.

• Nuclear Engineering and Technology
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• v.32 no.5
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• pp.433-445
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• 2000

The interfacial area concentration (IAC) is one of the most important parameters in the two-fluid model for two-phase flow analysis. The IAC can be measured by a local conductivity probe method that uses the difference of conductivity between water and air/steam. The number of sensors in the conductivity probe may be differently chosen by considering the flow regime of two-phase flow. The four sensor conductivity probe method predicts the IAC without any assumptions of the bubble shape. The local IAC can be obtained by measuring the three dimensional velocity vector elements at the measuring point, and the directional cosines of the sensors. The five sensor conductivity probe method proposed in this study is based on the four sensor probe method. With the five sensor probe, the local IAC for a given referred measuring area of the probe can be predicted more exactly than the four sensor probe. In this paper, the mathematical approach of the five sensor probe method for measuring the IAC is described, and a numerical simulation is carried out for ideal cap bubbles of which the sizes and locations are determined by a random number generator.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.267-269
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• 2003

반도체 웨이퍼 및 각종 박막의 면/비저항(sheet/resistivity resistance)의 측정에 비교적 간단히 측정할 수 있고 측정정확도가 높은 4탐침(four-point probe)방법이 널리 사용되고 있다 또한 4탐침 측정방법은 높은 분해능의 contour map작성과 ion implantation의 doping accuracy 및 doping uniformity의 측정에도 사용된다. 최근 재료의 소형, 박막화 경향으로 볼 때 정확한 비저항 측정의 필요성이 요구되고 있으며 이에 따라 4탐침 측정기술인 single 및 dual configuration method로 실리콘 웨이퍼에 대한 비저항의 측정 정확도를 고찰한 결과 dual configuration 측정방법이 single configuration측정 방법에 비하여 정밀 정확도가 더 좋은 것으로 고찰되었다.

• Proceedings of the KIEE Conference
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• 2015.07a
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• pp.1515-1516
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• 2015

Touch panel 및 Touch screen 등의 투명전극으로 많이 사용되고 있는 ITO(Indium Tin Oxide)나 CNT(Carbon Nano Tube) 등 전도성 박막의 면저항을 쉽고 빠르게 측정하기 위하여 van der Pauw method를 이용한 면저항 측정기를 개발하였다. 이 면저항 측정기는 대면적 시료의 면저항을 측정 할 수 있어 매우 편리하다. 면저항 측정은 주로 Four Point Probe method로 측정하는 것이 일반적이나 본 연구에서는 van der Pauw method를 이용한 측정값과 Four Point Probe method로 측정한 결과를 비교한 결과 1 % 이내에서 일치하였다. 개발된 측정기의 측정 정확도는 지시값의 1.0 % 이하이고, 측정범위는 $2{\Omega}/{\square}{\sim} 5k{\Omega}/{\square}$이다.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.163.2-163
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• 2001

Confocal scanning microscopy (CSM) has been reported as an excellent method using the optical probe in scanning probe microscopy (SPM). Transmission or reflection confocal scanning microscopy (TCSM, RCSM) has been used in the three-dimensional reconstruction of specimen or the non-destructive measurement in vivo. The axial movement of the primary focal point having the information of specimen gives a good measurement performance with the great sensitivity. Application of the confocal theory and astigmatism to displacement measurement sensor uses the aperture as the pinhole or slit after collecting lens relating to confocal response in non-contact measurement; and astigmatic lens using four-segments detector as short-range sensor, long-range one combining the grating and rotary one hating the rotary directional grating. The aperture type can play an ...

• Journal of Applied Reliability
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• v.8 no.4
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• pp.155-166
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• 2008

PTH cracks are caused by the mismatch of coefficient of thermal expansion(CTE) between polymer and laminated materials, and are one of the main failure mechanisms of multi layer boards. In spite of its importance, it is usually hard to measure or detect them because of its small size and invisibility. To detect PTH cracks more effectively, this paper proposes a theoretical model that can estimate the resistance value from crack size of PTHs. Using four-point probe resistance measurement method, the resistance value of test coupons is measured. Through measured data, we verify the validity of the proposed theoretical model and set up criteria of failure.

• Journal of the Korean Vacuum Society
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• v.5 no.1
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• pp.54-61
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• 1996

Indium-tin oxide (ITO) films were deposited on the glass substrate by the reactive -ionized cluster beam deposition(ICBD) method. In the oxygen atmosphere, indium cluster formed through the nozzle is ionized by the electron bombardment and is accelerated to be deposited on the substrate. And tin is simultaneoulsy evaporated from the boron-nitride crucible. The chracteristics of films were examined by the X-ray photoelectron spectroscopy(XPS), glancing angle X-ray diffractrion(GXRD) and the electrical properties. were measured by 4-point-probe and Hall effect measurement system . From the XPS spectrum , it was found that indium and tin atoms combined with the oxygen to form oxide$(In_2O_3, SnO_2)$. In the case of films with high tin-concentration, the GXRD spectra show that the main $In_2O_3$ peak of (222) plane, but also sub peaks((440) peak etc.) and $SnO_2$ peaks were detected. From that results, itis concluded that the heavily dopped tin component (more than 14 at. %) disturbs to form $In_2O_3$(222) phase. Four-point-probe and Hall effect measurement show that, in the most desirable case, the transmittance of the films is more then 90% in visible range and its resistivity is $$\rho$=3.55 \times10^{-4}\Omega$cm and its mobility is $\mu$=42.8 $\textrm{cm}^2$/Vsec.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.2124-2125
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• 2011

금속의 비저항 측정방법은 4단자 방법, van der Pauw 방법, Four-Point Probe(FPP) 방법, eddy current 방법 등이 있다. 이들의 측정방법은 다르지만 동일한 시료에 대해 평가한 비저항은 측정 불확도 범위 내에서 일치하여야 한다. 이에 따라 균질한 비자성 금속(STS 316)을 선정한 후 비저항을 평가한 결과 4단자와 van der Pauw 방법에 의한 비저항(도전율)은 각각 75.86 ${\mu}{\Omega}{\cdot}cm$(2.273 %IACS)과 75.84 ${\mu}{\Omega}{\cdot}cm$(2.273 %IACS)로서 거의 동일한 결과를 나타냈으며, Four Point Probe(FPP) 방법은 75.91 ${\mu}{\Omega}{\cdot}cm$(2.271 %IACS), eddy current 방법은 76.63 ${\mu}{\Omega}{\cdot}cm$(2.25 %IACS)으로 나타났다.