• Applied Microscopy
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• v.36 no.spc1
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• pp.25-33
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• 2006

Nanofabrication with finely focused ion and electron beams is reviewed, and position and size controlled fabrication of nano-metals and -semiconductors is demonstrated. A focused ion beam (FIB) interface attached to a column of 200keV transmission electron microscope (TEM) was developed. Parallel lines and dots arrays were patterned on GaAs, Si and $SiO_2$ substrates with a 25keV $Ga^+-FIB$ of 200nm beam diameter at room temperature. FIB nanofabrication to semiconductor specimens caused amorphization and Ga injection. For the electron beam induced chemical vapor deposition (EBI-CVD), we have discovered that nano-metal dots are formed depending upon the beam diameter and the exposure time when decomposable gases such as $W(CO)_6$ were introduced at the beam irradiated areas. The diameter of the dots was reduced to less than 2.0nm with the UHV-FE-TEM, while those were limited to about 15nm in diameter with the FE-SEM. Self-standing 3D nanostructures were also successfully fabricated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1531-1534
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• 2005

Nano pattern is being utilized to produce micro optical components, sensors, and information storage devices. In this study, a study on nano pattern fabrication using raster-scan type Focused Ion Beam (FIB) milling is introduced. Because the intensity of ion beam has Gaussian distribution, the overlapping of the Gaussian beam results in a 3D pattern, and the shape of the pattern can be adjusted by variation of FIB milling parameters, such as overlap, ion dose, and dwell time. The Gaussian shape of single beam intensity has been investigated by experiment, and 3D nano patterns with pitch of 200nm generated by FIB is demonstrated.

• Applied Microscopy
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• v.48 no.2
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• pp.49-53
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• 2018

A successful transmission electron microscope (TEM) analysis is closely related to the preparation of the TEM specimen and should be followed by the suitable TEM specimen preparation depending on the purpose of analysis and the subject materials. In the case of the Si-based anode material, lithium atoms of formed Li silicide were removed due to ion beam and electron beam during TEM specimen preparation and TEM observation. To overcome the problem, we proposed a new technique to make a TEM specimen without the ion beam damage. In this study, two types of test specimens from the Si-based anode material of Li-ion battery were prepared by respectively adopting the only focused ion beam (FIB) method and the new FIB-ultramicrotome method. TEM analyses of two samples were conducted to compare the Ga ion damage of the test specimen.

• Applied Microscopy
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• v.48 no.4
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• pp.122-125
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• 2018

The focused ion beam (FIB) method is widely used to prepare specimens for observation by transmission electron microscopy (TEM), which offers a wide variety of imaging and analytical techniques. TEM has played a significant role in material investigation. However, the FIB method induces amorphization due to bombardment with the high-energy gallium ($Ga^+$) ion beam. To solve this problem, electron beam induced deposition (EBID) is used to form a protective layer to prevent damage to the specimen surface. In this study, we introduce an optimized TEM specimen preparation procedure by comparing the EBID of carbon and tungsten as protective layers in FIB. The selection of appropriate EBID conditions for preparing specimens for TEM analysis is described in detail.

• Applied Science and Convergence Technology
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• v.25 no.5
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• pp.98-102
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• 2016

The level set method has recently become popular in the simulation of semiconductor processes such as etching, deposition and photolithography, as it is a highly robust and accurate computational technique for tracking moving interfaces. In this research, full three-dimensional level set simulation has been developed for the investigation of focused ion beam processing. Especially, focused ion beam induced nanodot formation was investigated with the consideration of three-dimensional distribution of redeposition particles which were obtained by Monte-Carlo simulation. Experimental validations were carried out with the nanodots that were fabricated using focused $Ga^+$ beams on Silicon substrate. Detailed description of level set simulation and characteristics of nanodot formation will be discussed in detail as well as surface propagation under focused ion beam bombardment.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1011-1012
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• 2011

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.30-34
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• 2005

This paper describes the design and manufacturing of a focused-ion-beam machining system which can make small features of nano size. We use a SIMION simulator in order to obtain the design data of an ion column. The simulation result shows that the focal length of ion beam decreases as the applied voltage of object lens increases. Finally, we obtained the good images of a mesh of 50 micrometers by using the adjustment of applied voltage, acceleration power, and dimension of each elements.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.1 s.256
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• pp.139-144
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• 2007

This paper presents development of carbon nanotube (CNT) tip modified by focused ion beam (FIB) and experimental results in non-contact mode of atomic force microscopy (AFM) using fabricated tip. We used an electric field which causes dielectrophoresis, to align and deposit CNTs on a conventional silicon tip. The morphology of the fabricated CNT tip was then modified into a desired shape using focused ion beam. We measured anodic aluminum oxide sample and trench structure to estimate the performance of FIB-modified tip and compared with those of conventional Si tip. We demonstrate that FIB modified tip in non contact mode had superior characteristics than conventional tip in the respects of wear, image resolution and sidewall measurement.

• Journal of the Mineralogical Society of Korea
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• v.28 no.4
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• pp.293-297
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• 2015

Focused ion beam (FIB) technique is widely used in the precise preparation of thin slices for the transmission electron microscopic (TEM) observation of target area of the minerals and geological materials. However, structural damages and artifacts by the Ga ion beam as well as electron beam damage are major difficulties in the TEM analyses. TEM analyses of the mineral samples showed the amorphization of quartz and feldspar, curtain effect, and Ga contamination, particularly near the grain edges and relatively thin regions. Although the ion beam damage could be much reduced by the improved procedures including the adjustment of the acceleration voltage and current, the ion beam damage and contamination are likely inevitable, thus requiring careful interpretation of the micro-structural and micro-chemical features observed by TEM analyses.

• Proceedings of the Materials Research Society of Korea Conference
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• 1993.11a
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• pp.59-59
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• 1993