• International Journal of Precision Engineering and Manufacturing
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• 제7권4호
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• pp.18-22
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• 2006

Although many efforts have been made in making nanometer-sized holes, there is still a major challenge in fabricating individual single-digit nanometer holes in a more controllable way for different materials, size distribution and hole shapes. In this paper we describe our efforts to use a top down approach in nanofabrication method to make single-digit nanoholes. There are three major steps towards the fabrication of a single-digit nanohole. 1) Preparing the freestanding thin film by epitaxial deposition and electrochemical etching. 2) Making sub-micro holes ($0.2{\mu}\;to\;0.02{\mu}$) by focused ion beam (FIB), electron beam (EB), atomic force microscope (AFM), and others methods. 3) Reducing the hole size to less than 10 nm by epitaxial deposition, FIB or EB induced deposition and micro coating. Preliminary work has been done on thin films (30 nm in thickness) preparation, sub-micron hole fabrication, and E-beam induced deposition. The results are very promising.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1992년도 춘계학술대회 논문집
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• pp.30-33
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• 1992

This thesis was investigated on ion-induced characteristics in a-$Se_{75}Ge_{25}$ positive and negative resists for focused-ion-beam microlithogaphy. The exposed a-$Se_{75}Ge_{25}$ inorganic thin film shows an increase in optical absorption after exposure to~$10_{16}$ dose of Ga+. The observed shift in the absorption edge toward longer wavelengths is consistent with that in films exposed to band-gap photons(~$10^{21}$photons/cm2). This result may be related with microstructural rearrangements with in the short range of SeGe network. Due to changes in the short range order, the chemical bonding may be affected, which results in increased chemical dissolution in ion-induced film. Also, this resist exhibits good thermal stability because of its high Tg(~$220^{\circ}C$). When focused ion beams are used for direct exposure of resist over a substrate, unwanted implantation of the substrate may be an issue. A possible way to avoid this is to match the thickness of the resist to the range of ions in the resist. Thin aspect is currently under investigation.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.67-68
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• 2010

• 전자공학회논문지 IE
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• 제47권2호
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• pp.8-12
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• 2010

TEM(Transmission Electrion microsopy) 투과전자현미경은 재료의 기초 구조 분석과 반도체 또는 생물시편의 미세 구조분석에 널리 사용되는 장비이다. TEM 분석은 필수적으로 목적에 부합되는 적절한 시편제작이 수반되어야 한다. 다양한 전자 현미경 시편 제작 방법 중 본 논문에서는 FIB(Focus Ion Beam)를 이용한 시편 제작법 중 시편에 입사되는 에너지와 이온 Gun과 시편과의 상호 각도, 이온 밀링 깊이 조절 등의 실험을 통하여 표면 손상 최소화를 벌크 웨이퍼와 패턴화된 시편에서 실험하였다. 최소화된 표면 영향성(약 5nm)을 패턴화된 시편에 구현하였다.

• 한국공작기계학회논문집
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• 제16권5호
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• pp.129-133
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• 2007

Focused Ion Beam(FIB) systems is a useful tool for the fabrication of micro-nano scale structures. In this study, the effects of FIB etching on the Au microstructure are systematically investigated. As the fabrication parameters, ion dose, dwell time and beam overlap ratio are studied. First, the increases of Ga ion dose makes the milling yield higher and the sidewall of milling profile steeper. Dwell time is found to have little effects on the milling profile due to the relatively large milling area of $1\times1{\mu}m^2$ used in this study. However, beam overlap significantly affects not only milling rate but also milling profile. As the beam overlap ratio changes from positive to negative, the development of regular cross-stripe patterns at the bottom with low milling rate is observed.

• Applied Microscopy
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• 제39권4호
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• pp.349-354
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• 2009

TFT-LCD의 구조불량이 발생한 박막 트랜지스터에 대해서 집속이온빔 가공장치(Dual-beam FIB/SEM)를 이용하여 연속절편법(Serial sectioning)과 일련의 연속적인 2차원 주사전자현미경 이미지를 얻었고, IMOD 소프트웨어를 통해서 3차원 구조구현(3D reconstruction) 연구를 하였다. 3차원 구조구현 결과, Gate막과 Data막이 접합되어 있는 불량이 관찰되었다. 두 막이 접합되어서 ON/OFF 역할을 하는 Gate의 기능이 상실되었고, Data신호는 Drain을 통해서 투명전극에 전류를 공급하여 계속 빛나는 선 불량(line defect)이 발생한 것으로 판단된다. 이 논문의 결과인 집속이온빔 가공장치(Dual-Beam FIB/SEM)를 이용한 3차원 구조구현 연구와 연속절편법, 주사전자현미경 이미지작업, 이미지 프로세싱에 대한 결과는 향후 연구의 기초자료로 활용될 수 있을 것으로 판단된다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.799-801
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• 2003

The secondary electron emission $coefficient({\bullet})$ of vacuum annealed MgO films has been investigated by ${\bullet}$ -focused ion beam(${\bullet}$ -FIB) system. The vacuum annealed MgO films have been found to have higher ${\bullet}$ values than those for as-deposited MgO films for Ne+ ion. Also it is found that the ${\bullet}$ for air-hold of vacuum annealed MgO layers for 24-hours is similar to that for vacuum annealed MgO films without any air-hold.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.802-805
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• 2003

The ion-induced secondary electron emission coefficient ${\gamma}$ for MgO thin film with $O_{2}$ plasma treatment has been investigated by ${\gamma}$-FIB (focused ion beam) system. The MgO thin film deposited from sintered material with $O_2$ plasma treatment is found to have higher ${\gamma}$ than that without $O_{2}$ plasma treatment. The energy of $Ne^{+}$ ions used has been ranged from 100eV to 200eV throughout this experiment. It is found that the highest secondary electron emission coefficient ${\gamma}$ has been achieved for 10 minutes of $O_{2}$ plasma treatment.

• Applied Microscopy
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• 제45권4호
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• pp.195-198
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• 2015

Gas-assisted etching (GAE) with focused ion beam (FIB) was applied to prepare plan-view specimens of Cu thin-layer on a silicon substrate for transmission electron microscopy (TEM). GAE using $XeF_2$ gas selectively etched the silicon substrate without volume loss of the Cu thin-layer. The plan-view specimen of the Cu thin film prepared by FIB milling with GAE was observed by scanning electron microscopy and $C_S$-corrected high-resolution TEM to estimate the size and microstructure of the TEM specimen. The GAE with FIB technique overcame various artifacts of conventional FIB milling technique such as bending, shrinking and non-uniform thickness of the TEM specimens. The Cu thin film was uniform in thickness and relatively larger in size despite of the thickness of <200 nm.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.605-606
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• 2008