• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.43-49
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• 2015

By the trends of electronic package to be smaller, thinner and more integrative, organic printed circuit board is required to be finer Cu trace pitch. This paper reports on a study of failure mechanism for PCB with fine Cu trace pitch using biased HAST. In weibull analysis of the biased HAST lifetime, it is found that the acceleration factor (AF) of between $135^{\circ}C/90%RH/3.3V$ and $130^{\circ}C/85%RH/3.3V$ is 2.079. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that $Cu_xO/Cu(OH)_2$ colloids and Cu dendrites were formed at anode (+) and at cathode (-), respectively. Thus, this gives the evidence that Cu dendrites formed at cathode by $Cu^{2+}$ ion migration lead to a short failure between a pair of Cu nets.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.134-137
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• 2008

The effects of residual stress and surface defects on the mechanical properties of the high carbon steel filament used for the automotive tire have been experimentally investigated. The samples were fabricated with annealing temperature. The residual stress was measured by focused ion beam and strain mapping software which has advantages, such as data with high accuracy and fast data acquisition time. Mechanical properties, such as tensile strength and fatigue resistance, were gradually increased up to $200^{\circ}C$ and then slightly decreased. From the measurement of residual stress and level of surface defect, it was revealed that the critical factor was varied with different temperature region. That is, the fatigue resistance increased due to decreasing the residual stress and decreased due to increasing the size and distribution of surface defect.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.3 s.192
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• pp.134-139
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• 2007

We report the suspension of individual multi-walled carbon nanotubes (MWNTs) from the bottom substrate using deep trench electrodes that were fabricated using optical lithography. During drying of the solution in dielectrophoretic assembly, the capillary force pulls the MWNT toward the bottom substrate, and it then remains as a deformed structure adhering to the bottom substrate after the solution has dried out. Small-diameter MWNTs cannot be suspended using thin electrodes with large gaps, but large-diameter MWNTs can be suspended using thicker electrodes. We present the statistical experimental results for successful suspension, as well as the feasible conditions for a MWNT suspension based on a theoretical approach.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.57-58
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• 2002

Asperity arrays and Independent asperities were fabricated on a silicon plate. Then pull-off and friction forces were measured on each asperity pattern by using AFM (atomic force microscope) in humid air and high vacuum of $2{\times}10^{-5}$ Pa. The probe of AFM cantilever has a flat square of about $1\;{\mu}m^2$ on its tip. The results showed that the pull-off force was proportional to the curvature radius of asperity peak in each ambient condition. The friction force was proportional to the pull-off force and was slightly higher in the humid air than in the high vacuum.

• Applied Microscopy
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• v.47 no.3
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• pp.165-170
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• 2017

Gas vesicles are intracellular gas-filled protein-shelled nanocompartments. The structures are spindle or cylinder-shaped, and typically $0.1{\sim}2{\mu}m$ in length and 45~250 nm in width. A variety of prokaryotes including photosynthetic bacteria and halophilic archaea form gas vesicles in their cytoplasm. Gas vesicles provide cell buoyancy as flotation devices in aqueous habitats. They are used as nanoscale molecular reporters for ultrasound imaging for biomedical purposes. The structures in halophilic archaea are poorly resolved due to the low signal-to-noise ratio from the high salt concentration in the medium. Such a limitation can be overcome using focused ion beam-thinning or inelastically scattered electrons. As the concentric bodies (~200 nm in diameter) in fungi possess gas-filled cores, it is possible that the concept of gas vesicles could be applied to eukaryotic microbes beyond prokaryotes.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.466-471
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• 2004

In focused-ion-beam (FIB) application of micromachining and device transplantation, four kinds of FIB processes, namely FIB sputtering, FIB-induced etching, redeposition, and FIB-induced deposition, are well utilized. As with FIB systems, scanning electron microscopes(SEMs) were extensively used in the semiconductor industry. They are the tools of choice for defect review and providing the image resolution needed for process monitoring. The enhanced capabilities of a dual-column on one chamber system are quickly becoming realized by the nano industry for performing a wide range of application.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.238.1-238.1
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• 2005

• Journal of the Korean Ceramic Society
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• v.42 no.4
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• pp.287-291
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• 2005

Pop-in deformation phenomena in aluminum was studied. Whether a pop-in occurs or not depended on the surface polishing method. Pop-in did not occur in aluminum which was polished mechanically, while it occurred in aluminum which was polished electrically. When pop-in occurred, elastic deformation preceded. Pop-in mechanism based on dislocation activity was suggested. Suggested mechanism was consistent with the result of microstructure analysis by Focused Ion Beam polisher (FIB) and Transmission Electron Microscopy (TEM).

• Journal of the Korean Society for Precision Engineering
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• v.24 no.11
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• pp.108-115
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• 2007

We have designed a high transmission C-shaped aperture using finite differential time domain (FDTD) technique. The C-shaped aperture was fabricated in the aluminum thin film on a glass substrate using a focused ion beam (FIB) milling. Nano-size patterning was demonstrated with a vacuum contact device to keep tight contact between the Al mask and the photoresist. Using 405 nm laser, we recorded a 50 nm-size dot pattern on the photoresist with the aperture and analyzed the spot size dependent on the dose illuminated on the aperture.

• Proceedings of the KIEE Conference
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• 1998.07d
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• pp.1444-1446
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• 1998

Direct writing of copper lines has been achieved by pyrolytic decomposition of copper formate films using a focused argon ion laser beam($\lambda$ =514.5nm) on a glass. The thickness and linewidth of the deposited copper films were considered as a function of laser power and scan speed. As the result from AES, there are no other elements except for copper after decomposition in the atmospheric ambient.