• Journal of the Korean Vacuum Society
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• v.15 no.4
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• pp.395-403
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• 2006

It is known that $MgAl_2O_4$ has higher resistance to moisture than MgO, in humid ambient MgO is chemically unstable. It reacts very easily with moisture in the air. In this study, the characteristic of $MgAl_2O_4$ and $MgAl_2O_4/MgO$ layers as dielectric protection layers for AC- PDP (Plasma Display Panel) have been investigated and analysed in comparison for conventional MgO layers. MgO and $MgAl_2O_4$ films both with a thickness of $1000\AA$ and $MgAl_2O_4/MgO$ film with a thickness of $200/800\AA$ were grown on the Cu substrates using the electron beam evaporation. $1000\AA$ thick aluminium layers were deposited on the protective layers in order to avoid the charging effect of $Ga^+$ ion beam while the focused ion beam(FIB) is being used. We obtained sputtering yieds for the MgO, $MgAl_2O_4$ and $MgAl_2O_4/MgO$ films using the FIB system. $MgAl_2O_4/MgO$ protective layers have been found th show $24{\sim}30%$ lower sputtering yield values from 0.244 up to 0.357 than MgO layers with the values from 0.364 up to 0.449 for irradiated $Ga^+$ ion beam with energies ranged from 10 kV to 14 kV. And $MgAl_2O_4$ layers have been found to show lowest sputtering yield values from 0.88 up to 0.109. Secondary electron emission coefficient(g) using the ${\gamma}$- FIB. $MgAl_2O_4/MgO$ and MgO have been found to have similar g values from 0.09 up to 0.12 for indicated $Ne^+$ ion with energies ranged from 50 V to 200 V. Observed images for the surfaces of MgO and $MgAl_2O_4/MgO$ protective layers, after discharge degradation process for 72 hours by SEM and AFM. It is found that $MgAl_2O_4/MgO$ protective layer has superior hardness and degradation resistance properties to MgO protective layer.

• Journal of the Korean Vacuum Society
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• v.2 no.3
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• pp.304-313
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• 1993

집속 이온빔 기술은 고해상도의 이온빔 리토그라피, 마스크가 필요없는 이온주입, 그리고 Ion beam induced deposition 등 반도체 소자의 미세가공에 널리 이용되어 왔다. 좋은 안정도와 높은 전류밀도, 적은 에너지 퍼짐 그리고 낮은 에미턴스와 높은 선명도를 갖는 집속 이온빔 장비를 위한 액체 갈륨 이온원이 한국에서 개발 시업되었다. 이온빔의 전압이 15kV, 렌즈전압이 7kV 그리고 렌즈상단에 위치한 aperture의 직경이 0.2mm일 때, 0.1$mu extrm{m}$의 빔 직경으로 집속되는 정전 einzel렌즈가 설계 조립되었고, FIB 진공 chamber는 렌즈부와의 차 등 진공시스템으로 구성되어 설계제작되었다. FIB 장비가 조만간 한국에서 이온빔 밀링, ion beam induced deposition 그리고 잘못된 부분의 수정 등 반도체 제작공정에서의 응용에 큰 기여를 할 것이라 기대된다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.3
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• pp.175-180
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• 2003

As the integrated circuit device shrinks to the deep submicron regime, the ion implantation process with high ion dose has been attracted beyond the conventional ion implantation technology. In particular, for the case of boron ion implantation with low energy and high dose, the stabilization and throughput of semiconductor chip manufacturing are decreasing because of trouble due to the machine conditions and beam turning of ion implanter system. In this paper, we focused to the improved characteristics of processing conditions of ion implantation equipment through the modified deceleration mode. Thus, our modified recipe with low energy and high ion dose can be directly apply in the semiconductor manufacturing process without any degradation of stability and throughput.

• Proceedings of the KIEE Conference
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• 1992.07b
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• pp.843-846
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• 1992

This thesis was investigated on optical-and ion-induced characteristics in positive(a-$Se_{75}Ge_{25}$) and negative (Ag/a-$Se_{75}Ge_{25}$) resists for focused-ion-beam microlithogaphy. The a-$Se_{75}Ge_{25}$ inorganic thin film shows an increase in optical absorption after exposure to$\sim$$10^{16}$ dose(ions/$cm^{2}$) of Ga ions. The observed shift in the absorption edge toward longer wavelengths is consistent with that in films exposed to band-gap photons ($\sim$$10^{20}$ photons/$cm^{2}$). But, ion induced shift is twice as much as that in film exposed to optical radiation. This result may be related with microstructural rearrangements with in the short range of SeGe network. Due to changes in the short range order, the chemical bonding may be affected, which results in increased chemical dissolution in ion-induced film. Also, this resist exhibits good thermal stability because of its high Tg(~220$^{\circ}C$). The composition of deposited film measured by AES is consistent with that of bulk.

• Korean Journal of Mineralogy and Petrology
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• v.33 no.4
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• pp.419-426
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• 2020

Understanding the pore structure including pore shape and connectivity in unconventional reservoirs is essential to increase the recovery rate of unconventional energy resources such as shale gas and oil. In this study, we found analysis condition to probe the nanoscale pore structure in shale reservoirs using Focused Ion Beam (FIB) and Ion Milling System (IMS). A-068 core samples from Liard Basin are used to probe the pore structure in shale reservoirs. The pore structure is analyzed with different pretreatment methods and analysis condition because each sample has different characteristics. The results show that surface milling by FIB is effective to obtain pore images of several micrometers local area while milling a large-area by IMS is efficient to observe various pore structure in a short time. Especially, it was confirmed that the pore structure of rocks with high content of carbonate minerals and high strength can be observed with milling by IMS. In this study, the analysis condition and process for observing the pore structure in the shale reservoirs is established. Further studies are needed to perform for probing the effect of pore size and shape on the enhancement of shale gas recovery.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.736-739
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• 2009

We have studied that the secondary electron emission characteristics of functional layers which have different kinds of MgO sub-micrometer size powder in AC-PDP. We used cathodoluminescence(CL) and gamma focused ion beam (${\gamma}$-FIB) system for measurement of secondary electron emission characteristics. Also we made 6 inch test panel which applied functional layers for evaluation of discharge characteristics.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.171-172
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.283-284
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.135-136
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• 2007

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.469-470
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• 2007