• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1995년도 추계학술대회 논문집
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• pp.24-29
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• 1995

A recently developed finishing process using rotating magnetic field is known to be very efficient for the finishing of parts such as vacuum tube, sanitary tube, etc., which are difficult to be finished by the conventional finishing methods as they are generally curbed tubes. But, the finishing system using rotating magnetic field have the defect that is the cross section of workpiece only circle because of internal rotating tool. Therefore, new finishing process of the workpieces which cross section are not circle is important and required. magnetic abrasive jet machining is a new concept finishing process. It is the precision internal finishing method using working fluid mixed with magnetic abrasives, which is jetted into the internal surface of tube. And magnetic poles are equipped on external surface of tube. In this study new concept finishing process or, magnetic abrasive jet machining system was developed. machining condition was predicted using simulation and some characteristics of the finishing process was analyzed.

• Tribology and Lubricants
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• 제26권4호
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• pp.219-223
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• 2010

Despite the increasing need of nanometer-scale accuracy in abrasive machining using ultrasmall particles such as abrasive jet and chemical mechanical polishing(CMP), the process mechanism is still unknown. Based on the background, research on the effects of various process parameters on the machined surface at abrasive machining was motivated and performed by using finite element analysis where the effect of slurry fluid flow involved. The effect of particle shape on the machined surface during particle-surface collision was discussed in this paper. The results from FEA simulation revealed that any damage or defect generation on machined surface by the impact may occur only if the particle has enough impact energy. Therefore, it could be concluded that generation of the defects and damage on the wafer surface after CMP process was mainly due to direct contact of the 3 bodies, i.e., pad-particle-wafer.

• Tribology and Lubricants
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• 제27권1호
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• pp.7-12
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• 2011

Interest in advanced machining process such as AJM(abrasive jet machining) and CMP(chemical-mechanical polishing) using micro/nano-sized abrasives has been on the increasing demand due to wide use of super alloys, composites, semiconductor and ceramics, which are difficult to or cannot be processed by traditional machining methods. In this paper, the effects of pressure, wafer moving velocity and fluid viscosity were investigated by 2-dimensional finite element analysis method considering slurry fluid flow. From the investigation, it could be found that the simulation results quite corresponded well to the Preston's equation that describes pressure/velocity dependency on material removal. The result also revealed that the stress and corresponding material removal induced by the collision of particle may decrease under relatively high wafer moving speed due to the slurry flow resistance. In addition, the increase in slurry fluid viscosity causes the reduction of material removal rate. It should be noted that the viscosity effect can vary with the shape of abrasive particle.