• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.3.2-3.2
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• 2009

Development of printed electronics, which is occasionally referred to as 'flexible' or 'polymer' electronics, has attracted considerable world wide attention in recent years. Printed (or flexible) electronics is currently expected to represent a new form of electronics and open up wide ranging applications in displays, electron devices for medical use, sensors, and other areas. This presentation aims to provide a strategy for scalable and viable paths to accomplish flexible, printable, large area circuits displaying high performance. Novel approaches evolving from system on package (SoP) to system on flex (SoF) technology will allow the integration of heterogeneous materials platforms into a system which is needed to enhance the functionality of the system. The talk also includes speculations about areas on which future advances in printed electronics could have a substantial impact along with a brief introduction of the Korea Printed Electronics Association (KoPEA).

• Journal of the Korean Society for Precision Engineering
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• v.31 no.6
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• pp.477-481
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• 2014

Flexible electronics have been to the fore because it is believed that flexibility can add incredible value such as light weight and mobility into the existing electronic devices and create new markets of large-area and low-cost electronics such as wearable eletronics in near future. Offset printing processes are regarded as major candidates for manufacturing the flexible electronics because they can provide the patterning resolution of micron-size effectively in large-area. In view of mechanics, the most important viewpoint in offset printing is how to achieve the synchronized movement of two contact surfaces in order to prevent slip between two contact surfaces and distortion of the blanket surface during ink transfer so that the high-resolution and good-overlay patterns can be printed. In this paper, a novel low-cost measurement method of the synchronization error using the motor control output signals is proposed and the compensation method is presented to minimize the synchronization error.

• Journal of Powder Materials
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• v.19 no.5
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• pp.343-347
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• 2012

In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA, XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.578-578
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• 2012

Graphene, a flat one-atom-thick two-dimensional layer of carbon atoms, is considered to be a promising candidate for nanoelectronics due to its exceptional electronic properties. Most of all, future nanoelectronics such as flexible displays and artificial electronic skins require low cost manufacturing process on flexible substrate to be integrated with high resolutions on large area. The solution based printing process can be applicable on plastic substrate at low temperature and also adequate for fabrication of electronics on large-area. The combination of printed electronics and graphene has allowed for the development of a variety of flexible electronic devices. As the first step of the study, we prepared the gate electrodes by printing onto the gate dielectric layer on PET substrate. We showed the performance of graphene field-effect transistor with electrohydrodynamic (EHD) inkjet-printed Ag gate electrodes.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.66-69
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• 2007

We have investigated printing techniques for processing organic light-emitting diodes (OLEDs). We succeeded to gravure print uniform organic thin films as well as screen print low work function cathode for OLED structure. Furthermore, by using roll-to-roll manufacturing methods, we have been able to fabricate all-printed flexible OLED demonstrator.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.6
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• pp.491-495
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• 2014

We developed a compact high-precision slot-die coating machine for thin-film deposition on a flexible substrate. For smooth and precise coating, air-bearing and linear motor system were employed to minimize velocity ripple. The gap control mechanism is specially designed to have repeatability of gap between nozzle and substrate under 1 ${\mu}m$. Due to extremely precise gap control, the machine can coat thin-films down to 50 nm with $200mm{\times}100mm$ size. A thin film of Ag nano-particle ink is coated for demonstration.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.19.1-19.1
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• 2010

The process of manufacturing printed electronics using printing technology is attracting attention because its process cost is lower than that of the conventional semiconductor process. This technology, which offers both a lower cost and higher productivity, can be applied in the production of organic TFT (thin film transistor), solar cell, RFID(radio frequency identification) tag, printed battery, E-paper, touch screen panel, black matrix for LCD(liquid crystal display), flexible display, and so forth. In general, in order to implement printed electronics, narrow width and gap printing, registration of multi-layer printing by several printing units, and printing accuracy of under $20\;{\mu}m$ are all required. These electronic products require high precision to the degree of tens of microns - in a large area with flexible material, and mass productivity at low cost. As such, the roll-to-roll printing process is attracting attention as a mass production system for these printed electronic devices. For the commercialization of this process, two basic electronic ink technologies, such as conductive ink and polymers, and printing equipment have to be developed. Therefore, this paper addressed basis design and test to develop fine patterning equipment employing the roll-to-roll printing equipment and electronic ink.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.2 s.117
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• pp.111-117
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• 2007

In this paper, a new marchand balun using broadside-coupled coplanar waveguide(CPW) on flexible printed circuit (FPC) is proposed. The proposed balun is designed based on the coupled line theory. The fabricated balun shows compact size and improved performance compared to the conventional microstrip line marchand balun. Measured amplitude and phase imbalance between the two balanced output ports are within 0.2 dB and $1^{\circ}$ respectively in a wide frequency range($1.63{\sim}3.44$ GHz). The proposed balun is expected to be used between various antennas and RF front-ends as a functional interconnection.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.63.1-63.1
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• 2012

In recent years, the functional inks for printed electronics that can be combined with a variety of printing techniques have attracted increasingly significant interest for use in low cost, large area, high performance integrated electronics and microelectronics. In particular, the development of solution-processable conductor, semiconductor and insulator materials is of great importance as such materials have decisive impacts on the electrical performance of various electronic devices, and, therefore, need to meet various requirements including solution processability, high electrical performance, and environmental stability. Semiconductor inks such as IGO, CIGS are synthesized by chemical solution method and microwave reaction method for TFT and solar cell application. Fine circuit pattern with high conductivity, which is valuable for flexible electrode for PCB and TSP devices, can be printed with highly concentrated and stabilized conductor inks such as silver and copper. Solution processed insulator such as polyimide derivatives can be use to all printed TFT device. Our research results of functional inks for printed electronics provide a recent trends and issues on this area.

• Journal of the Korean Ceramic Society
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• v.48 no.6
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• pp.543-548
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• 2011

The inkjet printing technology has undergone remarkable development since the concept of printed electronics was first introduced. The large interest which it has sparkled is due to its many enticing features such as processing simplicity, low cost and scalability as well as its compatibility with flexible electronics. Thanks to constant improvements, inkjet printing has nowadays become a mature technology which is an effective replacement for a number of intricate and expensive conventional laboratory tools and is also on the verge of gaining industrial significance. Technological challenges which still remain open include low temperature processing, high density integration and reproducibility. This paper reviews some recent advances in the inkjet printing technology, addressing those issues. And we also discuss a number of novel approaches to performing inkjet printing.