• Title/Summary/Keyword: Flexible mold

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Variation of a Triangular Pattern Shape due to Shrinkage in the Repeated UV Imprint Process (반복적인 UV 임프린트 공정에서 수축에 따른 삼각 단면을 가진 패턴의 형상 변화)

  • Jeong, Jiyun;Choi, Su Hyun;Cho, Young Tae
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.19 no.7
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    • pp.67-73
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    • 2020
  • Shrinkage is inevitable in the curing of resins during the nanoimprint process. The degree of shrinkage that occurs as the resin transforms from a viscous liquid to solid differs depending on the type of resin. However, if the cured material is repeatedly cured using the same material, constant shrinkage can be confirmed. In this study, the pattern of change was observed by repeatedly performing the nanoimprint process using a resin with a constant shrinkage rate. The observed pattern for the change of shape was made using a triangular pyramid-shaped aluminum master mold and a flexible replica mold made from the master. Shrinkage that results from the nanoimprint process occurs linearly in the longitudinal direction of the pattern and can be predicted by simple calculations. The change of the pattern due to shrinkage occurred as expected. If the shrinkage rate remains constant, various patterns can be manufactured with high accuracy by correcting these changes before producing a specific shape. This study confirms that the pattern of the desired angle can be obtained by performing the repeated imprint without having to manufacture a master mold.

Fabrication of Superhydrophobic Film with Uniform Structures Using Two Step Lithography and Nanosilica Coating (Two step lithography와 나노 실리카 코팅을 이용한 초발수 필름 제작)

  • Yu, Chaerin;Lee, Dong-Weon
    • Journal of Sensor Science and Technology
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    • v.28 no.4
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    • pp.251-255
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    • 2019
  • We propose a two-step lithography process to minimize edge-bead issues caused by thick photoresist (PR) coating. In the conventional PR process, the edge bead can be efficiently removed by applying an edge-bead removal (EBR) process while rotating the silicon wafer at a high speed. However, applying conventional EBR to the production of desired PR mold with unique negative patterns cannot be used because a lower rpm of spin coating and a lower temperature in the soft bake process are required. To overcome this problem, a two-step lithography process was developed in this study and applied to the fabrication of a polydimethylsiloxane (PDMS) film having super-hydrophobic characteristics. Following UV exposure with a first photomask, the exposed part of the silicon wafer was selectively removed by applying a PR developer while rotating at a low rpm. Then, unique PR mold structures were prepared by employing an additional under-exposure process with a second mask, and the mold patterns were transferred to the PDMS. Results showed that the fabricated PDMS film based on the two-step lithography process reduced the height difference from 23% to 5%. In addition, the water contact angle was greatly improved by spraying of hydrophobic nanosilica on the dual-scaled PDMS surface.

Development of tool-life prediction program to determine the optimal machining conditions in mold machining (금형 가공 시 최적 가공조건을 결정하기 위한 공구수명 예측 프로그램 개발)

  • Soon-Ok Park;Min-Hak Kim;Sun-Kyung Lee;Sung-Taek Jung
    • Design & Manufacturing
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    • v.17 no.1
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    • pp.7-12
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    • 2023
  • Recently, with the emergence of the 4th industrial revolution, the demand for smart factories and factory automation is increasing. In this study, a tool life prediction program was developed to select optimal machining conditions using CNC milling equipment, which is widely used in flexible production and automation. The equipment used in the experiment was Hwacheon Machine Tool's 5-axis machining equipment, and the tool used was a 17F2R tool. For the machining path, the down-milling cutting method was selected and long-term machining was performed. The analysis standard for side wear on the tool was set at 0.1 to 0.2 mm, and tool life data and wear data were obtained in the cutting experiment. The program was created through the data obtained from the experiment, and a prediction rate of over 90% was secured when comparing the experimental data and the predicted data.

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Requirements analysis for production of freeform concrete segments. (비정형 콘크리트 부재 생산을 위한 요구조건 분석)

  • Sung, Soojin;Lee, Donghoon;Kim, Sunkuk
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2014.05a
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    • pp.68-69
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    • 2014
  • Production of freeform concrete segments use various molds because of the unique shape of it unlike common concrete segments. As a result, the mold for freeform concrete segments cannot be reused. Therefor, cost overrun is occurred by needs of more time and manpower to produce the freeform concrete segments compared with common concrete segments. To prevent the cost overrun, a new production method for the freeform concrete segments is needed to develop and the requirements for it should be analyzed before. Therefor, the aim of this study is requirements analysis for production of freeform concrete segment. The requirements of production of freeform concrete segments and form for it is analyzed in this study. The result of this study would be used to suggest the new production method of freeform concrete segments.

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All-Organic Nanowire Field-Effect Transistors and Complementary Inverters Fabricated by Direct Printing

  • Park, Gyeong-Seon;Seong, Myeong-Mo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.632-632
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    • 2013
  • We generated single-crystal organic nanowire arrays using a direct printing method (liquidbridge- mediated nanotransfer molding) that enables the simultaneous synthesis, alignment and patterning of nanowires from molecular ink solutions. Using this method, single-crystal organic nanowires can easily be synthesized by self-assembly and crystallization of organic molecules within the nanoscale channels of molds, and these nanowires can then be directly transferred to specific positions on substrates to generate nanowire arrays by a direct printing process. The position of the nanowires on complex structures is easy to adjust, because the mold is movable on the substrates before the polar liquid layer, which acts as an adhesive lubricant, is dried. Repeated application of the direct printing process can be used to produce organic nanowire-integrated electronics with twoor three-dimensional complex structures on large-area flexible substrates. This efficient manufacturing method is used to fabricate all-organic nanowire field-effect transistors that are integrated into device arrays and inverters on flexible plastic substrates.

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Lip Type Electromagnetic Flap Valve for Low Leakage (누수 최소화를 위한 립 타입 전자력 플랩 밸브)

  • Lim, In-Ho;Lee, Ki-Jung;Sim, Woo-Young;Yang, Sang-Sik
    • Proceedings of the KIEE Conference
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    • 2008.07a
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    • pp.1476-1477
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    • 2008
  • This paper reports on a flexible flap valve actuated by electromagnetic force under a constant pressure source. The flexible flap valve consists of the three main components: a flexible flap with a steel disk embedded in PDMS, an electromagnetic actuator and two glass plates with inlet and outlet. Sealing lip structures for improving the valve characteristics are added on the outlet of the bottom glass substrate. The flap valve is fabricated by the spin-coating process, the EDM process, SU-8 mold process and oxygen plasma treatment. The dimension of an assembled flap valve is $12mm{\times}20mm{\times}28mm$. The stroke volume of the flap valve is measured for various pressures and open times. When the input voltage of 30 V is applied for 0.33 s, the minimum stroke volume of the flap valve is 70 ${\mu}L$ at 50 kPa.

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Preparation of Low-cost and Flexible Metal Mesh Electrode Used in the Hybrid Solar Cell by Simple Electrochemical Depositon (전기화학적 전착에 의한 태양전지용 저가 유연 금속 메쉬 제작)

  • Lee, Ju-Yeol;Lee, Sang-Yeol;Lee, Ju-Yeong;Kim, Man
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2017.05a
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    • pp.123.1-123.1
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    • 2017
  • Hybrid solar cells have intensively studied in recent years due to their advantages such as cost effectiveness and possibility of applications in flexible and transparent devices. It is critical to fabricate individual layer composed of organic and inorganic materials in the hybrid solar cell at low cost. Therefore, it is required to manufacture cheaply and enhance the photon-to-electricity conversion efficiency of each layer in the flexible solar cell industry. In this research, we fabricated pure Cu metal mesh electrode prepared by using electroplating and/or electroless plating on the Ni mold which was manufacture through photolithography, electroforming, and polishing process. Copper mesh was formed on the surface of nickel metal working master when pulsed electrolytic copper deposition were performed at various plating parameters such as plating time, current density, and so on. After electrodeposition at 2ASD for 5~30seconds, the line/pitch/thickness of copper mesh sheet was $1.8{\sim}2.0/298/0.5{\mu}m$.

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PLC Devices Fabricated on Flexible Plastic Substrate by Roll-to-Roll Imprint Lithography (유연 기판을 이용한 PLC소자 제작을 위한 롤투롤 공정 연구)

  • Kang, Ho Ju;Kim, Taehoon;Jeong, Myung Yung
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.4
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    • pp.25-29
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    • 2015
  • Demand for a low-cost, high-throughput, and high-resolution patterning method for fabricating devices continues to increase. The roll-to-roll (R2R) imprint lithography technique has received a great deal of attention as a means of fabricating next-generation devices. In this paper, we propose a fabrication method for polymeric planar lightwave circuit (PLC) devices that uses R2R imprint lithography. The proposed technique uses an elastomeric polydimethylsiloxane (PDMS) mold. A Si wafer with micro patterns is used as the Si master. The PDMS mold is then replicated from the Si master. By applying a precise web tension and at a given web speed, we fabricated a micro-patterned PLC device. The insertion losses were 4.0 dB for a $1{\times}2$ optical splitter. As such, the proposed method of fabricating a PLC device by the R2R process was shown to be an effective solution.

Design of flexure hinge to reduce lateral force of laser assisted thermo-compression bonding system (레이저 열-압착 본딩 시스템의 Lateral Force 감소를 위한 유연 힌지의 설계)

  • Lee, Dong-Won;Ha, Seok-Jae;Park, Jeong-Yeon;Yoon, Gil-Sang
    • Design & Manufacturing
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    • v.14 no.3
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    • pp.23-30
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    • 2020
  • Laser Assisted Thermo-Compression Bonding (LATCB) has been proposed to improve the "chip tilt due to the difference in solder bump height" that occurs during the conventional semiconductor chip bonding process. The bonding module of the LATCB system has used a piezoelectric actuator to control the inclination of the compression jig on a micro scale, and the piezoelectric actuator has been directly coupled to the compression jig to minimize the assembly tolerance of the compression jig. However, this structure generates a lateral force in the piezoelectric actuator when the compression jig is tilted, and the stacked piezoelectric element vulnerable to the lateral force has a risk of failure. In this paper, the optimal design of the flexure hinge was performed to minimize the lateral force generated in the piezoelectric actuator when the compression jig is tilted by using the displacement difference of the piezoelectric actuator in the bonding module for LATCB. The design variables of the flexure hinge were defined as the hinge height, the minimum diameter, and the notch radius. And the effect of the change of each variable on the stress generated in the flexible hinge and the lateral force acting on the piezoelectric actuator was analyzed. Also, optimization was carried out using commercial structural analysis software. As a result, when the displacement difference between the piezoelectric actuators is the maximum (90um), the maximum stress generated in the flexible hinge is 11.5% of the elastic limit of the hinge material, and the lateral force acting on the piezoelectric actuator is less than 1N.

Development of Roll-to- Flat Thermal Imprinting Equipment and Experimental Study of Large Area Pattern Replication on Polymer Substrate

  • Lee, Moon-G.;Lan, Shuhuai;Lee, Soo-Hun;Lee, Hye-Jin;Ni, Jun;Sung, Yeon-Wook
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.18 no.3
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    • pp.307-314
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    • 2009
  • Large area micro pattern replication has promising application potential in many areas. Rolling imprint process has been demonstrated as one of the most competitive processes for such micro pattern replication, because it has advantages in low cost, high throughput and high efficiency. In this paper, we developed a prototype of roll-to-flat(R2F) thermal imprint system for large area micro pattern replication process, which is one of the key processes in the fabrication of flexible displays. Experimental tests were conducted to evaluate the feasibility of system and the parameters' effect on the process, such as flat mold temperature, loading pressure and rolling speed. 100mm $\times$ 100mm stainless steel flat mold and commercially available polycarbonate sheets were used for the tests. The experimental results showed that the developed R2F system is suitable for fabrication of various micro devices with micro pattern over large area.

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