• 제목/요약/키워드: Flexible Formation

검색결과 201건 처리시간 0.023초

유동적인 군집대형을 기반으로 하는 군집로봇의 경로 계획 (An Advanced Path Planning of Clustered Multiple Robots Based on Flexible Formation)

  • 위성길;딜샷사이토프;최경식;이석규
    • 한국정밀공학회지
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    • 제29권12호
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    • pp.1321-1330
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    • 2012
  • This paper describes an advanced formation algorithm of clustered multiple robots for their navigation using flexible formation method for collision avoidance under static environment like narrow corridors. A group of clustered multiple robots finds the lowest path cost for navigation by changing its formation. The suggested flexible method of formation transforms the basic group of mobile robots into specific form when it is confronted by particular geographic feature. In addition, the proposed method suggests to choose a leader robot of the group for the obstacle avoidance and path planning. Firstly, the group of robots forms basic shapes such as triangle, square, pentagon and etc. depending on number of robots. Secondly, the closest to the target location robot is chosen as a leader robot. The chosen leader robot uses $A^*$ for reaching the goal location. The proposed approach improves autonomous formation characteristics and performance of all system.

플렉서블 기반 미세 무연솔더 범프를 이용한 칩 접합 공정 기술 (The Chip Bonding Technology on Flexible Substrate by Using Micro Lead-free Solder Bump)

  • 김민수;고용호;방정환;이창우
    • 마이크로전자및패키징학회지
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    • 제19권3호
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    • pp.15-20
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    • 2012
  • In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

Flexible and Scalable Formation for Swarm Systems

  • Kim Dong-Hun
    • International Journal of Fuzzy Logic and Intelligent Systems
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    • 제5권3호
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    • pp.222-229
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    • 2005
  • This paper presents a self-organizing scheme for multi-agent swarm systems based on coupled nonlinear oscillators (CNOs). In this scheme, unicycle robots self-organize to flock and arrange group formation through attractive and repulsive forces among themselves. The main result is the maintenance of flexible and scalable formation. It is also shown how localized distributed controls are utilized throughout group behaviors such as formation and migration. In the paper, the proposed formation ensures safe separation and good cohesion performance among the robots. Several examples show that the proposed method for group formation performs the group behaviors such as reference path following, obstacle avoidance and flocking, and the formation characteristics such as flexibility and scalability, effectively.

외피 구조를 통한 경계의 유연성 형성에 관한 연구 - 토요 이토와 SANAA의 현대 건축을 중심으로 - (A Study on Building Envelope and Formation of Flexible Boundary - Focused on Contemporary Architecture of Toyo Ito and SANAA -)

  • 최상기
    • 한국실내디자인학회논문집
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    • 제19권2호
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    • pp.81-89
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    • 2010
  • The problem of defining the relationship between interior space and exterior envelope of a building has long been a challenging task in the field of architecture throughout its history. This research chronologically reviews some of the important turning points in various schools of thoughts concerning construction of exterior envelope, with focus on how they influenced and altered the formation of our interior environment. This research also stipulates on how technological advance in the late 20th century laid grounds for a new type of interior-exterior relations in architecture through creation of flexible and ambiguous boundary conditions. The focus of this qualitative research will be on contemporary works of Japanese architects Toyo Ito, SANAA, and related group of architects who address the issues of transparency, flexible interior layout, buffer zones, structural facade, and neutralized (homogeneous) space that produces spatial quality of non-linear, non-hierarchical, and de-materialized space as a direct alternative to modern principles of space making.

셀형 유연조립시스템에서 작업부하 균형을 고려한 통합 배치설계에 관한 연구 (A Study on Even Distribution of Workloads Using Simulated Annealing Method on Integrated Layout Design in Cellular flexible Assembly Systems)

  • 정지용;노인규
    • 한국경영과학회지
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    • 제23권4호
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    • pp.63-73
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    • 1998
  • With the success of flexible manufacturing systems(FMSs), flexible assembly systems(FASs) have been developed to automatic factories further. As in a cellular FMS, a celluar FAS is considered as the most flexible and feasible assembly systems configuration. This paper presents a method for the integrated layout design in cellular FASs. Unlike the traditional paper, this paper deals with the formation of cells and the layout of cells for jobs with operation times on different machines. The procedure in this paper consists of two distinct phases. The first phase presents machine arrangement in a double rows flowline. cell formation not to allow intercellular movements, and integrated layout design in cellular FASs considering the characteristics of FAS, layout, and production factors This phase uses older optimal algorithm. The second phase proposes to balance the system with an objective of reducing the degree of workload deviation in the cells. Simulated annealing method is used to balance the system. This phase also shows the integrated layout design in cellular FASs with the cost less than total cost of the first phase.

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패킹을 이용한 다수 무인기의 유동적 대형 형성 알고리즘 (Flexible Formation Algorithm for Multiple UAV Using the Packing)

  • 김효중;김정훈;김문정;유창경
    • 한국항행학회논문지
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    • 제25권3호
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    • pp.211-216
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    • 2021
  • 다수 무인기를 이용한 시스템은 정찰, 네트워킹, 항공 촬영 등 다양한 목적으로 활용되고 있다. 이러한 시스템에서 다수 무인기로 구성된 대형을 형성하고 유지하는 것은 필수적이다. 본 논문에서는 다수 무인기의 대형을 형성하기 위한 자율화된 분산형 제어를 수행하는 알고리즘을 제안하였다. 제어명령은 근접 무인기 또는 임무 영역으로부터 서로 밀어내는 방향으로 작용하는 2차 시스템 형태의 힘을 고려하였다. 제어명령은 외부의 개입 없이 계측과 통신으로부터 획득되는 상대위치/속도를 통해 계산된다. 이는 개별 무인기들이 기준거리를 추종하도록 하며 임무영역 안에 겹치지 않고 최대한 조밀하게 배치되도록 한다. 기준거리 결정에는 채우기 문제를 풀기 위한 최적화 기법과 유사한 방식을 적용하였다. 임무영역은 형성하고자 하는 대형의 외곽선으로 정의되며 임무에 따라 유동적으로 설정될 수 있다. 제안한 알고리즘의 성능을 확인하기 위하여 수치 시뮬레이션을 수행하였다. 복잡성과 확장성을 고려한 영역에서 약 26.94초에 대형이 형성되며 약 71.91%의 채우기 밀도를 가지는 것을 확인하였다.

작업 순서와 기계 용량을 고려하는 유연조립 시스템의 독립 셀형성 (Independent Cell Formation Considering Operation Sequences and Machine Capacity in Flexible Assembly Systems)

  • 노인규;최형호
    • 산업경영시스템학회지
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    • 제19권40호
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    • pp.253-261
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    • 1996
  • In optimizing the layout design of a multi-product assembly environment, tile analysis of the material flow is a vital ingredient. In flexible assembly systems, assembly time is usually very short thus the transfer time is relatively more important Therefore operations sequence must be so determined, that have no backtracking operations as possible as, It is important to form cells, so that they have no intercell movement in curring much processing delay, and to arrange machines as possible as densly. This study presents a independent cell formation method considering operation sequences and machine capacity in flexible assembly systems.

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Formation of Buffer Layer on Mica for Application to Flexible Thin Film Transistors

  • Oh, Joon-Seok;Lee, Seung-Ryul;Lee, Jin-Ho;Ahn, Byung-Tae
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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    • pp.749-751
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    • 2007
  • A buffer layer consisting of $SiO_x/Ta/Ti$ has been developed in order to overcome the adhesion and stress problems between poly-Si film and mica. Polycrystalline silicon thin film transistor was successfully fabricated on the mica and transferred to a flexible plastic substrate.

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군집 지능을 이용한 분산 제어 기반 대형 형성 알고리즘 (Multi-UAV Formation Algorithm Based on Distributed Control Using Swarm Intelligence)

  • 김문정;김정훈;김효중;유창경
    • 한국항공우주학회지
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    • 제50권8호
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    • pp.523-530
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    • 2022
  • 다양한 임무에서 활용 가능한 무인기 다개체 시스템은 단일 무인기보다 복잡하므로 효율적인 대형 제어방식이 요구된다. 특히 광역 탐색임무에 있어 통신량 및 연산량 부담이 적으며, 무인기간 자율적인 대형 형성이 가능한 분산 제어형의 유동적인 대형 형성이 필요하다. 본 연구는 스캔 면적의 확장 및 탐색 성능향상을 위해 Swarm 대형과 뱅크 정렬 대형, 대형 전체 운동을 고려한 대형 형성 알고리즘을 제안한다. 본 알고리즘은 상대거리에 대해서 2차 진동 특성을 가지며 parameter tuning을 통해 알고리즘을 설계할 수 있다. 또한 통상적인 무인기 시스템에 적합하도록 제어명령을 변환하였고, 시뮬레이션을 통해 알고리즘의 대형 형성 및 운동에 대한 성능을 입증하였다.