• 제목/요약/키워드: Flexible Array

검색결과 175건 처리시간 0.022초

고무 인젝션 방법을 이용한 플렉시블 씰 제작 (The Flexible Seal Fabrication utilizing a rubber Injection Method)

  • 김병훈;권태훈;조인현
    • 한국추진공학회:학술대회논문집
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    • 한국추진공학회 2010년도 제35회 추계학술대회논문집
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    • pp.707-710
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    • 2010
  • KSLV-I 킥모터 노즐 개발에 있어서 가장 중요한 개발품은 노즐 구동에 필요한 플렉시블 씰 개발이다. 특히 플렉시블 씰 제작 기술의 확보는 킥 모터 노즐 개발에 있어서 핵심 개발 사항 중에 하나였다. 킥모터 플렉시블 씰 제작에 사용된 방법은 금형에 순서대로 배열된 보강재 사이에 고무를 주입하는 인젝션 방식을 사용하였다. 플렉시블 씰 제작을 통해 금형 설계 기술, 고무 인젝션 방법, 성형 공정을 확립하였다. 제작된 플렉시블 씰은 X-Ray 검사를 통해 내부 접착 상태 및 보강재/고무 배열 상태를 확인하였다.

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분포형 유연촉각센서 (Distributed Flexible Tactile Sensor)

  • 유기호;윤명종
    • 제어로봇시스템학회논문지
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    • 제10권1호
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    • pp.60-65
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    • 2004
  • A flexible tactile sensor away with 8 H 8 tactile elements is designed and fabricated. The material of the sensor is PVDF(polyvinylidene fluoride) film and flexible circuitry is used in the fabrication fur the flexibility of the sensor The experimental results on static and dynamic properties of the sensor are obtained and examined. The signals of a contact pressure to the sensor are sensed and processed in the DSP system in which the signals are digitalized and filtered. The processed signals of the sensor outputs are visualized in a personal computer for illustrating the shape and force distribution of a contact object. The reasonable performance for the detection of contact state is verified through sensing examples.

High-Performance Flexible Graphene Field Effect Transistors with Ion Gel Gate Dielectrics

  • 조정호
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2012년도 춘계학술발표대회
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    • pp.69.3-69.3
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    • 2012
  • A high-performance low-voltage graphene field-effect transistor (FED array was fabricated on a flexible polymer substrate using solution-processable, high-capacitance ion gel gate dielectrics. The high capacitance of the ion gel, which originated from the formation of an electric double layer under the application of a gate voltage, yielded a high on-current and low voltage operation below 3 V. The graphene FETs fabricated on the plastic substrates showed a hole and electron mobility of 203 and 91 $cm^2/Vs$, respectively, at a drain bias of - I V. Moreover, ion gel gated graphene FETs on the plastic substrates exhibited remarkably good mechanical flexibility. This method represents a significant step in the application of graphene to flexible and stretchable electronics.

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Apodized 시계열을 사용한 TMA의 성능 향상에 대한 분석 (Analysis for Performance Enhancement of TMA using Apodized Time Sequence)

  • 호광춘
    • 한국인터넷방송통신학회논문지
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    • 제18권4호
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    • pp.105-109
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    • 2018
  • 본 논문에서는 시간 조절 배열(time-modulated array: TMA)의 성능향성에 대하여 논의하였다. 제안한 시간 조절 배열은 전형적인 배열의 topology를 기반으로 하지만, side-band suppression을 갖는 beamforming 기능을 성취하기 위하여 위상 shifter 대신 apodized 이산 시간 스위치를 사용하였다. 16-소자 선형 배열의 apodised 시계열에 기초한 beamforming 시스템의 성능을 분석하기 위하여 수치해석을 수행하였다. 수치해석 결과 제안한 기법은 전형적인 기법들과 비교하여 낮거나 매우 낮은 수준의 side-lobe level (SLL)을 갖는 빔 패턴을 생성하며, 보다 유연하고 정확한 방법을 제공하는 것으로 나타났다.

유한요소법을 이용한 가변스트레치공정 성형변수에 따른 성형오차 경향분석 (Tendency Analysis of Shape Error According to Forming Parameter in Flexible Stretch Forming Process Using Finite Element Method)

  • 서영호;허성찬;송우진;김정;강범수
    • 소성∙가공
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    • 제19권8호
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    • pp.486-493
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    • 2010
  • A shape error of the sheet metal product made by a flexible stretch forming process is occurred by a various forming parameters. A die used in the flexible stretch forming is composed of a punch array to obtain the various objective surfaces using only one die. But gaps between the punches induce the shape error and the defect such as a scratch. Forming parameters of the punch size and the elastic pad to prevent the surface defect must be considered in the flexible die design process. In this study, tendency analysis of shape error according to the forming parameters in the flexible stretch process is conducted using a finite element method. Three forming parameters, which are the punch size, the objective curvature radius and the elastic pad thickness, are considered. Finite element modeling using the punch height calculation algorithm and the evaluation method of the shape error, which is a representative value for the formability of formed surface, are proposed. Consequently, the shape error is in proportion to the punch size and is out of proportion to the objective curvature radius and the elastic pad thickness.

마이크로광조형을 이용한 대면적의 타원형 마이크로 렌즈 어레이 제작 (Fabrication of Elliptical Micro-lens Array with Large Surface Using ${\mu}SL$)

  • 박인백;이수도;권태완;최재원;이석희
    • 한국정밀공학회지
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    • 제25권2호
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    • pp.123-130
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    • 2008
  • A 3D structure production method for microstereolithography is a useful way that produces complex structures with flexible processes and low cost. Several UV curable resins were blended and the optimal resin for micro-lens fabricate was selected through viscosity, workability and transmission tests. It consists of 1, 6 - Hexanediol diacrylate with 15 Apha and Isobornyl acrylate for reducing some shrinkage. When fabricating a micro-lens array on large surface, some distortion of shape occurred because of the surface tension between cured part. To overcome this problem, the optimal processing conditions were derived from considering amount of the resin and surface tension. Large surface Micro-lens array, which are a type of elliptical convex and consist of 18,000 micro-lens in the range of 2cm*2cm were fabricated. The focal length to the X-axis and Y-axis were calculated. To verify the performance, measure an energy distribution of transmitted light from the Large surface Micro-lens array.

Interconnection Technology Based on InSn Solder for Flexible Display Applications

  • Choi, Kwang-Seong;Lee, Haksun;Bae, Hyun-Cheol;Eom, Yong-Sung;Lee, Jin Ho
    • ETRI Journal
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    • 제37권2호
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    • pp.387-394
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    • 2015
  • A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

Development of Direct Printed Flexible Tactile Sensors

  • Lee, Ju-Kyoung;Lee, Kyung-Chang;Kim, Hyun-Hee
    • 한국산업융합학회 논문집
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    • 제20권3호
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    • pp.233-243
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    • 2017
  • This paper proposes a structure of direct-printed flexible tactile-sensor. These flexible tactile sensors are based on pressure-sensing materials that allow pressure to be measured according to resistance change that in turn results from changes in material size because of compressive force. The sensing material consists of a mixture of multi walled carbon nanotubes (MWCNTs) and TangoPlus, which gives it flexibility and elasticity. The tactile sensors used in this study were designed in the form of array structures composed of many lines so that single pressure points can be measured. To evaluate the performance of the flexible tactile sensor, we used specially designed signal-processing electronics and tactile sensors to experimentally verify the sensors' linearity. To test object grasp, tactile sensors were attached to the surface of the fingers of grippers with three degrees of freedom to measure the pressure changes that occur during object grasp. The results of these experiments indicate that the flexible tactile sensor-based robotic gripper can grasp objects and hold them in a stable manner.

가변금형을 이용한 스트레치 성형장치 개발 (Development of Stretch Forming Apparatus using Flexible Die)

  • 서영호;허성찬;박중원;구태완;송우진;김정;강범수
    • 소성∙가공
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    • 제19권1호
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    • pp.17-24
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    • 2010
  • A stretch forming method has been widely used in sheet metal forming process. Especially, this process has been adopted in aircraft and high-speed train industries for skin structure forming having a variety of curvature. Until now, solid dies, which are designed with respect to the specific shapes and manufactured as a single piece, have been usually applied to stretch forming process. Therefore, a great number of solid dies has to be developed according to the shapes of the curved skin structure. Accordingly, a flexible die is proposed in this study. It replaces the conventional solid dies with a set of height adjustable punch array. A usefulness of the flexible die is verified through a formability comparison with the solid die using finite element method considering an elastic recovery and the stretch forming apparatus with the flexible die is developed.

Highly Sensitive Flexible Organic Field-Effect Transistor Pressure Sensors Using Microstructured Ferroelectric Gate Dielectrics

  • 김도일;이내응
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.277.2-277.2
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    • 2014
  • For next-generation electronic applications, human-machine interface devices have recently been demonstrated such as the wearable computer as well as the electronic skin (e-skin). For integration of those systems, it is essential to develop many kinds of components including displays, energy generators and sensors. In particular, flexible sensing devices to detect some stimuli like strain, pressure, light, temperature, gase and humidity have been investigated for last few decades. Among many condidates, a pressure sensing device based on organic field-effect transistors (OFETs) is one of interesting structure in flexible touch displays, bio-monitoring and e-skin because of their flexibility. In this study, we have investigated a flexible e-skin based on highly sensitive, pressure-responsive OFETs using microstructured ferroelectric gate dielectrics, which simulates both rapidly adapting (RA) and slowly adatping (SA) mechanoreceptors in human skin. In SA-type static pressure, furthermore, we also demonstrate that the FET array can detect thermal stimuli for thermoreception through decoupling of the input signals from simultaneously applied pressure. The microstructured highly crystalline poly(vinylidene fluoride-trifluoroethylene) possessing piezoelectric-pyroelectric properties in OFETs allowed monitoring RA- and SA-mode responses in dyanamic and static pressurizing conditions, which enables to apply the e-skin to bio-monitoring of human and robotics.

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