• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.141-146
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• 2005

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.196.1-196.1
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• 2016

TCO(Transparent Conducting Oxide) on flat glass is used in thin-film photovoltaic cell, flat-panel display. Nowadays, Corning(R) Willow Glass(R), known as flexible substrate, has attracted much attention due to its many advantages such as reliable roll-to-roll glass processing, high-quality flexible electronic devices, high temperature process. Also, it can be an alternative to flexible polymer substrates which have their poor stability and degradation of electrical and optical qualities. For application on willow glass, the flexibility, electrical, optical properties can be greatly influenced by the TCO thin film thickness due to the inherent characterization of thin film in nanoscale. It can be expected that while thick TCO layer causes poor transparency, its sheet resistance become low. Also, rarely reports were focusing on the influence of flexible properties by varying TCO thickness on flexible glass. Therefore, it is very important to optimize TCO thickness on flexible Willow glass. In this study, Ti-ZnO thin films, with different thickness varied from 0 nm to 50 nm, were deposited on the flexible willow glass by atomic layer deposition (ALD). The flexible, electrical and optical properties were investigated, respectively. Also, these properties of Ti-doped ZnO thin films were compared with un-doped ZnO thin film. Based on the results, when Ti-ZnO thin films thickness increased, resistivity decreased and then saturated; transmittance decreased. The Figure of Merit (FoM) and flexibility was the highest when Ti-ZnO thickness was 40nm. The flexible, electrical and optical properties of Ti-ZnO thin films were better than ZnO thin film at the same thickness.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.529-529
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• 2006

Several laboratories worldwide have demonstrated the feasibility of producing amorphous silicon thin film transistor (TFT) arrays at temperatures that are sufficiently low to be compatible with flexible foils such as stainless steel or high temperature polyester. These arrays can be used to fabricate flexible high information content display prototypes using a variety of different display technologies. However, several questions must be addressed before this technology can be used for the economic commercial production of displays. These include process optimization and scale-up to address intrinsic electrical instabilities exhibited by these kinds of transistor device, and the development of appropriate techniques for the handling of flexible substrate materials with large coefficients of thermal expansion. The Flexible Display Center at Arizona State University was established in 2004 as a collaboration among industry, a number of Universities, and US Government research laboratories to focus on these issues. The goal of the FDC is to investigate the manufacturing of flexible TFT technology in order to accelerate the commercialization of flexible displays. This presentation will give a brief outline of the FDC's organization and capabilities, and review the status of efforts to fabricate amorphous silicon TFT arrays on flexible foils using a low temperature process. Together with industrial partners, these arrays are being integrated with cholesteric liquid crystal panels, electrophoretic inks, or organic electroluminescent devices to make flexible display prototypes. In addition to an overview of device stability issues, the presentation will include a discussion of challenges peculiar to the use of flexible substrates. A technique has been developed for temporarily bonding flexible substrates to rigid carrier plates so that they may be processed using conventional flat panel display manufacturing equipment. In addition, custom photolithographic equipment has been developed which permits the dynamic compensation of substrate distortions which accumulate at various process steps.

• 한국터널지하공간학회 논문집
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• 제17권6호
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• pp.695-702
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• 2015

원심모형시험은 최근의 기계적, 이론적 발전에 따라 그 활용도와 정확성이 높아지고 있다. 원심모형시험은 원지반 응력을 효과적으로 재현할 수 있으므로 주위 지반 또는 암반과 상호작용을 하는 터널과 같은 지하구조물의 거동을 모사하기 적합하다. 본 연구에서는 병렬 터널의 지진시 동적 거동을 원심모형시험을 통하여 분석하였다. 터널 모델링시 지진에 의해 발생하는 최대 가속도 저감을 위하여 Flexible segment를 고려하였으며 Flexible segment의 두께가 얇은 경우와 두꺼운 경우를 각각 고려하였다. 시험 결과 Flexible segment의 지진시 터널 구조물에 발생하는 최대 가속도 저감 효과를 확인하였다. 그러나 Flexible segment가 얇은 경우 단주기파 적용시 최대가속도의 저감효과는 없었고, 두꺼운 경우 기반암 가속도가 클 경우 보다 효과적임을 확인하였다. 또한 동일 모델에 대하여 3차원 수치해석을 수행하여 지진시 거동을 파악한 결과, 시험 결과와 유사한 경향을 보임을 확인할 수 있었다.

• 한국기계가공학회지
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• 제19권1호
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• pp.63-71
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• 2020

Recently, to improve convenience, flexible electronics are quickly being developed for a number of application areas. Flexible electronic devices comprise characters such as being bendable, stretchable, foldable, and wearable. Effectively manufacturing flexible electronic devices requires high efficiency, low costs, and simple processes for manufacturing technology. Through this study, we enabled the rapid production of multifunctional flexible bending sensors using a simple, low-cost Fused Deposition Modeling (FDM) 3D printer. Furthermore, we demonstrated the possibility of the rapid production of a range of functional flexible bending sensors using a simple, low-cost FDM 3D printer. Accurate and reproducible functional materials made by FDM 3D printers are an effective tool for the fabrication of flexible sensor electronic devices. The 3D-printed flexible bending sensor consisted of polyurethane and a conductive filament. Two patterns of electrodes (straight and Hilbert curve) for the 3D printing flexible sensor were fabricated and analyzed for the characteristics of bending displacement. The experimental results showed that the straight curve electrode sensor sensing ability was superior to the Hilbert curve electrode sensor, and the electrical conductivity of the Hilbert curve electrode sensor is better than the straight curve electrode sensor. The results of this study will be very useful for the fabrication of various 3D-printed flexible sensor devices with multiple degrees of freedom that are not limited by size and shape.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.15-20
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• 2012

In electronics industry, the coming electronic devices will be expected to be high integration and convergence electronics. And also, it will be expected that the coming electronics will be flexible, bendable and wearable electronics. Therefore, the demands and interests of bonding technology between flexible substrate and chip for mobile electronics, e-paper etc. have been increased because of weight and flexibility of flexible substrate. Considering fine pitch for high density and thermal damage of flexible substrate during bonding process, the micro solder bump technology for high density and low temperature bonding process for reducing thermal damage will be required. In this study, we researched on bonding technology of chip and flexible substrate by using 25um Cu pillar bumps and Sn-Bi solder bumps were formed by electroplating. From the our study, we suggest technology on Cu pillar bump formation, Sn-Bi solder bump formation, and bonding process of chip and flexible substrate for the coming electronics.

• Wind and Structures
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• 제21권1호
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• pp.25-40
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• 2015

Oscillating motions of flexible cylinders are associated to some extent with the aerodynamic response of plants. Tandem motions of reeds with flexible stems in a colony are experimentally investigated using an array of flexible cylinders made of polydimethylsiloxane (PDMS). Consecutive images of flexible cylinders subjected to oncoming wind are recorded with a high-speed camera. To quantify oscillating motions, the average bending angle and displacement of flexible cylinders are evaluated using point-tracking method and spectral analysis. The tandem motions of flexible cylinders are closely related to the flow characteristics around the cylinders. Thus, the dynamic motions of a tandem arrangement of flexible cylinders are investigated with varying numbers of cylinders arranged in-line, numbers of cylinders in a group (behaving like a single body), and Reynolds numbers (Re). When the number of cylinders in a group increases, the damping effect caused by the support of downstream cylinders is pronounced. These results would be provide useful information on the tandem-arranged design of complex structures and energy harvesting devices.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.178-178
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• 2009

전자제품의 고속화, 고집적화, 고성능이 요구되어짐에 따라 IC's 성능 향상을 통해 패키징 기술의 소형화를 필요로 하고 있어 소재나 칩 부품을 이용해 커패시터나 저항을 구현하여 내장시키는 임베디드 패시브 기술에 대한 연구가 많이 진행되어 지고 있다. 본 연구에서는 3D 패키징이 가능한 flexible 소재에 능, 수동 소자를 내장하기 위한 다층 flexible 기판 공정 기술에 대한 연구를 수행하였다. 기판제작을 위해 flexible 소재에 미세 형성이 가능한 폴리머 필름을 접착하였고 flexible 위에 후막 저항체 패턴을 퍼|이스트를 이용하여 형성하였다. 또한, 능동소자 내장을 위해 test chip을 제작하여 플립칩 본더를 이용해 flexible 기판에 접합한 후에 bonding film을 이용한 build up 공정을 통해 via를 형성하고 무전해 도금 공정을 거쳐 전기적인 연결을 하였다. 위의 공정을 통해 앓고 가벼울 뿐만 아니라 자유롭게 구부러지는 특성을 갖고 있는 능, 수동 소자 내장형 flexible 기판의 변형에 따른 전기적 특성을 평가하였다.

• 소성∙가공
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• 제18권7호
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• pp.556-564
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• 2009

Flexible forming process for sheet material using reconfigurable die is introduced based on numerical simulation. In general, this flexible forming process using the reconfigurable die has been utilized for manufacturing of curved thick plates used for hull structures, architectural structures and so on. In this study, numerical simulation of sheet metal forming process is carried out by using flexible dies model instead of conventional matched die set. The numerical simulation and experimental verification for sheet metal forming process using a flexible forming machine that is more suitable for thick plate forming process are carried out to confirm the appropriateness of the simulation process. As an elastic cushion, urethane pads are utilized using hyperelastic material model in the simulation for smoothing the forming surface which is discrete due to characteristics of the flexile die. In the flexible forming process for sheet metal, effect of a blank holder is also investigated according to blank holding methods. Formability in view of occurrence of dimples is compared with regard to the various punch sizes. Consequently, it is confirmed that the flexible forming for sheet material using urethane pad has enough capability and feasibility for manufacturing of smoothly curved surface instead of conventional die forming method.

• 한국실내디자인학회논문집
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• 제16권1호
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• pp.65-72
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• 2007

Various residential patterns, which can accommodate ever-changing modem lifestyles, are increasingly needed. On the residents' demand for flexible space, mote research should be conducted on the apartments built by the concept of flexible space. In this study, apartments of 40-60 pyeong in size built in the region of Seoul, between 1998 and 2007, are analyzed in terms of the flexible types and the unit plan composition. To reflect the changes in people's perception of residential quality-preference for a residence with a good view, over for the direction that a residence faces, more rooms are placed on the front bay. From the analyses of this study, flexible unit plans are classified into 6 types; and it was found that, as the size of apartments gets larger, the livingroom and the dinning room tend to be placed on the front bay. After grouping rooms with a similar function into the spatial zones of the master bedroom, children's room, the livingroom, and the dinning room, flexible types are analyzed in terms of the location of rooms. The results of this study will be able to contribute to establishing flexible housing culture that can accommodate the changing needs of residents.