• Journal of the Semiconductor & Display Technology
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• v.5 no.4 s.17
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• pp.1-4
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• 2006

Recently, with rapid development of digital media like semiconductor and large flat panel display, the manufacturing equipment is required to have high precision over large travel range. Moreover it should have high product throughput. To achieve high product throughput, a controller should perform fast point-to-point motion and high precision positioning after settling in spite of external disturbances or residual vibrations. We proposed a new mode switching control algorithm with an application to dual stage for long range and high precision positioning. The proposed algorithm uses a proximate time-optimal servomechanism for the fast settling and a time-delay controller for the high precision positioning. Experimental results show that the proposed method enables smooth mode switching and improves the settling time and the precision accuracy after settling by over than 33% and 45%, respectively.

• Journal of the Semiconductor & Display Technology
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• v.5 no.4 s.17
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• pp.11-15
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• 2006

Expose equipment system that is used for manufacturing process of Flat Panel Display, is most important equipment in whole process. Expose equipment that is for making pattern of mask on substrate, consists of optical part, stage part and transport part. The stage is an important part that aligns mask and substrate for delivering pattern of mask to substrate exactly. In this paper, control system of expose stage that is able to use mask and substrate of diverse size, with PC controller using GUI interface instead of PLC control system. The existing PLC control system does not have the suitable structure for using mask of diverse size. GUI interface integration control system is based on PC. So it has the advantage of convenient use and active operation. We embodied PLC control system in integration control system based on PC, and verified utility possibility through the standard test course.

• Journal of the Semiconductor & Display Technology
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• v.11 no.4
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• pp.43-48
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• 2012

The screen printing method is much used in the flat panel display field including the LCD, PDP, FED, organic EL, and etc. for forming the high precision micro-pattern. Also A number of studies of screen printing method has been conducted as the method for the cost down through the improvement of productivity. Because of being the dot printing method of the cylindrical shape not being the line printing method like the existing PDP barrier rib and phosphor, the pillar arrays using the screen printing method is deposited in the hemispherical type not being cylindrical shape in the existing printing process conditions. In this paper, the parameters were set on the screen printing device in order to deposit the cross-sectional shape with the cone or trapezoid shape of the pillar in depositing the pillars used the screen printing device for vacuum glazing. The cross-sectional shape slope of the pillar according to the parameters was measured. And analysis the effect of the screen printing process conditions on the cross-sectional shape slope of pillars based upon the result of being measured. The processing conditions were drawn to minimize the cross-sectional shape slope of pillar.

• Journal of the Semiconductor & Display Technology
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• v.13 no.3
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• pp.35-38
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• 2014

Flat panel displays fabricated on glass substrate use amorphous Si for data processing circuit. Recent progress in display technology requires a new material to replace the amorphous Si, and ZnO is a good candidate. ZnO is a wide bandgap (3.3 eV) semiconductor with high mobility and good optical transparency. ZnO is usually grown by sputtering using ZnO ceramic target. However, ceramic target is more expensive than metal target, and making large area target is very difficult. In this work we studied characteristics of ZnO thin-film transistor grown by rf sputtering using Zn metal target and $CO_2$. ZnO film was grown at $450^{\circ}C$ substrate temperature, with -70 V substrate bias voltage applied. By using these methods, our ZnO TFT showed $5.2cm^2/Vsec$ mobility, $3{\times}10^6$ on-off ratio, and -7 V threshold voltage.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.77-77
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• 2007

The development of next generation displays such as flexible display is a major challenge. Most materials and processes in current flat panel display industry cannot be transferred to flexible substrates. Typically, indium tin oxide (ITO) thin films are brittle and need to be deposited at high temperature to achieve an optimal opto-electrical property, therefore ITO films cannot be used as a flexible electrode. Up to date, many alternative materials to ITO have been proposed such as conductive polymers, nanometals, solution deposited transparent conductive oxide(TCO) and carbon nanotubes(CNTs). CNT based transparent conductive films are fabricated on glass and polymer substrates. CNT thin films exhibit a sheet resistance ($R_s$) of nearby $10^3\;{\Omega}/sq$ with a transmittance of around 80% on the visible light range, which is attributed by excellent dispersion and interaction among CNTs, solvents and polymeric binders. This talk will present the current studies, opto-electrical properties, design criteria and its applications for CNT-based transparent conductive films.

• Journal of Institute of Control, Robotics and Systems
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• v.22 no.5
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• pp.382-388
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• 2016

When Flat Panel Display (FPD) is made with backlight module, such as LED TV, it inherently suffers from the non-uniform backlight luminance problem that results in un-even brightness distribution throughout the TV screen. If the luminance of each pixel location of a TV screen as a function of the driving voltage can be measured, it can be used to compensate the non-uniformity of the backlight module. We use a carefully calibrated imaging system to take pictures of a TV screen at different levels of brightness and generate the compensation functions for the driving circuitry to correct the luminance level at each pixel location. Making use of the fact that the luminance of the screen is normally brightest at around the center of the screen and gradually decreases toward the border of the screen, the luminance of the whole TV screen is approximated by a mathematical function of the pixel locations. The parameters of the function are computed in the least square sense by the values of both the pixel luminance sent from the driving circuit and the grayscale value measured from the image taken by the imaging system. To justify the correction system, a simple second order polynomial function is used to approximate the luminance across the screen. When the driving circuit voltage is corrected according to the measured function, the variance of the screen luminance is reduced to one tenth of the one measured from the un-corrected TV screen.

• Resources Recycling
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• v.25 no.2
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• pp.42-48
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• 2016

Although the generation of waste flat panel displays in Korea is expected to exceed one million sets in 2016, a comprehensive recycling technology has not yet been developed for effective recovery of valuable materials from the wastes, rendering to outshine the national prestige as a global leader in display industries. The overall aim of this study was to analyze the statistical data of various valuable materials and their ratio after dismantling 40-inch and 42-inch sized waste LCDs. The analysis results showed that plastic portion of the wastes was about 22% and the portion of PCB (Print Circuit Board) part was about 9% by weight whereas panel part was about 34% and leftovers including metals totalled about 35% by weight. Based on the analytical results, a higher value recycling process could be proposed with advanced material separation techniques.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.529-529
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• 2006

Several laboratories worldwide have demonstrated the feasibility of producing amorphous silicon thin film transistor (TFT) arrays at temperatures that are sufficiently low to be compatible with flexible foils such as stainless steel or high temperature polyester. These arrays can be used to fabricate flexible high information content display prototypes using a variety of different display technologies. However, several questions must be addressed before this technology can be used for the economic commercial production of displays. These include process optimization and scale-up to address intrinsic electrical instabilities exhibited by these kinds of transistor device, and the development of appropriate techniques for the handling of flexible substrate materials with large coefficients of thermal expansion. The Flexible Display Center at Arizona State University was established in 2004 as a collaboration among industry, a number of Universities, and US Government research laboratories to focus on these issues. The goal of the FDC is to investigate the manufacturing of flexible TFT technology in order to accelerate the commercialization of flexible displays. This presentation will give a brief outline of the FDC's organization and capabilities, and review the status of efforts to fabricate amorphous silicon TFT arrays on flexible foils using a low temperature process. Together with industrial partners, these arrays are being integrated with cholesteric liquid crystal panels, electrophoretic inks, or organic electroluminescent devices to make flexible display prototypes. In addition to an overview of device stability issues, the presentation will include a discussion of challenges peculiar to the use of flexible substrates. A technique has been developed for temporarily bonding flexible substrates to rigid carrier plates so that they may be processed using conventional flat panel display manufacturing equipment. In addition, custom photolithographic equipment has been developed which permits the dynamic compensation of substrate distortions which accumulate at various process steps.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.12 no.5
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• pp.879-886
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• 2008

This paper addresses the analysis and the design optimization of differential interconnects for Low-Voltage Differential Signaling (LVDS) applications. Thanks to the differential transmission and the low voltage swing, LVDS offers high data rates and improved noise immunity with significantly reduced power consumption in data communications, high-resolution display, and flat panel display. We present an improved model and new equations to reduce impedance mismatch and signal degradation in cascaded interconnects using optimization of interconnect design parameters such as trace width, trace height and trace space in differential flexible printed circuit board (FPCB) transmission lines. We have carried out frequency-domain full-wave electromagnetic simulations, time-domain transient simulations, and S-parameter simulations to evaluate the high-frequency characteristics of the differential FPCB interconnects. The 10% change in trace width produced change of approximately 6% and 5.6% in differential impedance for trace thickness of $17.5{\mu}m$ and $35{\mu}m$, respectively. The change in the trace space showed a little change. We believe that the proposed approach is very helpful to optimize high-speed differential FPCB interconnects for LVDS applications.

• Electrical & Electronic Materials
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• v.12 no.7
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• pp.7-11
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• 1999

Fully sealed field emission display in size of 4.5 inch has been fabricated using single-wall carbon nanotubes-organic vehicle com-posite. The fabricated display were fully scalable at low temperature below 415$^{\circ}C$ and CNTs were vertically aligned using paste squeeze and surface rubbing techniques. The turn-on fields of 1V/${\mu}{\textrm}{m}$ and field emis-sion current of 1.5mA at 3V/${\mu}{\textrm}{m}$ (J=90${\mu}{\textrm}{m}$/$\textrm{cm}^2$)were observed. Brightness of 1800cd/$m^2$ at 3.7V/${\mu}{\textrm}{m}$ was observed on the entire area of 4.5-inch panel from the green phosphor-ITO glass. The fluctuation of the current was found to be about 7% over a 4.5-inch cath-ode area. This reliable result enables us to produce large area full-color flat panel dis-play in the near future. Carbon nanotubes (CNTs) have attracted much attention because of their unique elec-trical properties and their potential applica-tions [1, 2]. Large aspect ratio of CNTs together with high chemical stability. ther-mal conductivity, and high mechanical strength are advantageous for applications to the field emitter [3]. Several results have been reported on the field emissions from multi-walled nanotubes (MWNTs) and single-walled nanotubes (SWNTs) grown from arc discharge [4, 5]. De Heer et al. have reported the field emission from nan-otubes aligned by the suspension-filtering method. This approach is too difficult to be fully adopted in integration process. Recently, there have been efforts to make applications to field emission devices using nanotubes. Saito et al. demonstrated a car-bon nanotube-based lamp, which was oper-ated at high voltage (10KV) [8]. Aproto-type diode structure was tested by the size of 100mm $\times$ 10mm in vacuum chamber [9]. the difficulties arise from the arrangement of vertically aligned nanotubes after the growth. Recently vertically aligned carbon nanotubes have been synthesized using plasma-enhanced chemical vapor deposition(CVD) [6, 7]. Yet, control of a large area synthesis is still not easily accessible with such approaches. Here we report integra-tion processes of fully sealed 4.5-inch CNT-field emission displays (FEDs). Low turn-on voltage with high brightness, and stabili-ty clearly demonstrate the potential applica-bility of carbon nanotubes to full color dis-plays in near future. For flat panel display in a large area, car-bon nanotubes-based field emitters were fabricated by using nanotubes-organic vehi-cles. The purified SWNTs, which were syn-thesized by dc arc discharge, were dispersed in iso propyl alcohol, and then mixed with on organic binder. The paste of well-dis-persed carbon nanotubes was squeezed onto the metal-patterned sodalime glass throuhg the metal mesh of 20${\mu}{\textrm}{m}$ in size and subse-quently heat-treated in order to remove the organic binder. The insulating spacers in thickness of 200${\mu}{\textrm}{m}$ are inserted between the lower and upper glasses. The Y\ulcornerO\ulcornerS:Eu, ZnS:Cu, Al, and ZnS:Ag, Cl, phosphors are electrically deposited on the upper glass for red, green, and blue colors, respectively. The typical sizes of each phosphor are 2~3 micron. The assembled structure was sealed in an atmosphere of highly purified Ar gas by means of a glass frit. The display plate was evacuated down to the pressure level of 1$\times$10\ulcorner Torr. Three non-evaporable getters of Ti-Zr-V-Fe were activated during the final heat-exhausting procedure. Finally, the active area of 4.5-inch panel with fully sealed carbon nanotubes was pro-duced. Emission currents were character-ized by the DC-mode and pulse-modulating mode at the voltage up to 800 volts. The brightness of field emission was measured by the Luminance calorimeter (BM-7, Topcon).