• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.17 no.5
• /
• pp.76-81
• /
• 2008

Nanoimprint lithography(NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. Among NILs, significant efforts from both academia and industry have been put in UV NIL research and development because of its ability to pattern at room temperature and at low pressure. In UV NIL, there may be in-line set-up error of the stamp and the substrate. To compensate this error, the dummy blocks are put on the stamp and pressurized uniformly. Contact problems between the stamp and the photoresist layer on the substrate are often happened, which results in the non-uniform residual layer In this paper, the pressurization method on the dummy block is investigated by the finite element method. A new method is recommended and evaluated far the uniform stamp deformation.

• Structural Engineering and Mechanics
• /
• v.57 no.4
• /
• pp.703-716
• /
• 2016

In this paper, we have investigated shear horizontal wave propagation in a layered structure, consisting of granular macromorphic rock (Dionysos Marble) substrate underlying a viscoelastic layer of finite thickness. SH waves characteristics are affected by the material properties of both substrate and the coating. The effects of microstructural parameter "characteristic length" of the substrate, along with heterogeneity, internal friction and thickness of viscoelastic layer are studied on the dispersion curves. Dispersion equation for SH wave is derived. Real and damping phase velocities of SH waves are studied against dimensionless wave number, for different combinations of various parameters involved in the problem.

• Current Optics and Photonics
• /
• v.1 no.6
• /
• pp.637-641
• /
• 2017

We present dielectric constant measurements of thin films using THz metamaterials fabricated on a quartz substrate. The resonance shifts of the metamaterials exhibit saturation behavior with increasing film thickness. The saturation frequency shift varies with the real part of the dielectric constant, from which the numerical expression for the particular metamaterial design was extracted. We first performed finite-difference time-domain simulations to find an explicit relationship between the saturated frequency shift and the dielectric constant of a thin film, which was confirmed by the experimental results from conventional techniques. In particular, the quartz substrate enables us to determine their values more accurately, because of its low substrate index. As a result, we extracted the dielectric constants of various films whose values have not been addressed previously without precise control of the film thickness.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.5 no.1
• /
• pp.17-23
• /
• 2005

This paper describes the simulation of a micromachined dome-shaped-diaphragm acoustic transducer built on a $1.5{\mu}m$ thick silicon nitride diaphragm ($2,000{\mu}m$ in radius, with a circular clamped boundary on a silicon substrate) with electrodes and piezoelectric ZnO film in a silicon substrate. Finite element analysis with ANSYS 5.6 has been performed to analyze the static and dynamic behaviors of the transducer under both pressure and voltage loadings.

• Proceedings of the IEEK Conference
• /
• 1999.06a
• /
• pp.881-884
• /
• 1999

In this paper, resonant frequency, electromagnetic field distribution, and resonant mode of a microstrip substrate-mounted dielectric resonator are investigated. A dielectric resonator is excited by the microstrip line. The data are obtained using the finite difference time-domain (FDTD) and compared with the experimental results and theoretical solutions the previous published paper.

• Journal of Adhesion and Interface
• /
• v.5 no.2
• /
• pp.14-26
• /
• 2004

For reliable determination of mechanical characteristics of adhesively bonded joints used e.g. as input data for computer-aided design of complex components, the thick-adherend tensile-shear test according to ISO 11003-2 is the most important material testing method. Although the total displacement of the joint is measured across the polymer layer directly in the overlap zone in order to minimize the influence of the stepped adherends, the substrate deformation must be taken into account within the framework of the evaluation of the shear modulus and the maximum shear strain, at least when high-strength adhesives are applied. In the standard ISO 11003-2 version of 1993, it was prescribed to perform the substrate deformation correction by means of testing a one-piece reference specimen. The authors, however, pointed to the excessive demands on the measuring accuracy of the extensometers connected with this technique in industrial practice and alternatively proposed a numerical deformation analysis of a dummy specimen. This idea of a mathematical correction was included in the revised ISO 11003-2 version of 2001 but in the simplified form of an analytical method based on Hooke's law of elasticity for small strains. In the present work, it is shown that both calculation techniques yield considerably discordant results. As experimental assessment would require high-precision distance determination (e.g. laser extensometer), finite element analyses of the deformation behavior of the bonded joint are performed in order to estimate the accuracy of the obtained substrate deformation corrections. These simulations reveal that the numerical correction technique based on the finite element deformation modeling of the reference specimen leads to considerably more realistic results.

• Tribology and Lubricants
• /
• v.37 no.6
• /
• pp.240-245
• /
• 2021

Ceramic coatings with high hardness and excellent chemical stability have been successfully applied to various machine elements, tools, and implants. However, in the case of monolayer coating on soft substrates, a high-stress concentration at the interface between the coating and the substrate causes delamination of the coating layer. Recently, to overcome this problem, multilayer coatings with a metal layer with a low modulus of elasticity added between the ceramic and the substrate have been widely applied. This study presents the third part of a recent study and focuses on the effect of the number of coating layers on the Brinell hardness of multilayered coating with TiN/Ti, following the two previous studies on a new Brinell hardness test method for a coated surface and on the influence of substrate and coating thickness. Indentation analyses are performed using finite element analysis software, von Mises stress and equivalent plastic strain distributions, load-displacement curves, and residual indentation shapes are presented. The number of TiN/Ti layers considerably affect the stress distributions and indentation shapes. Moreover, the greater the number of TiN/Ti layers, the higher is the Brinell hardness. The stress and plastic strain distributions confirm that the multilayer coatings improve the wear resistance. The results are expected to be used to design and evaluate various coating systems, and additional study is required.

• Journal of the Microelectronics and Packaging Society
• /
• v.31 no.1
• /
• pp.23-28
• /
• 2024

Electronic products utilizing flexible devices experience harsh mechanical deformations in real-use environments. As a result, researches on the mechanical reliability of these flexible devices have attracted considerable interest among researchers. This study employed previous bending strain models and finite element analysis to predict the maximum bending strain of metal films deposited on flexible substrates. Bending experiments were simulated using finite element analysis with variations in the material and thickness of the thin films, and the substrate thickness. The results were compared with the strains predicted by existing models. The distribution of strain on the surface of film was observed, and the error rate of the existing model was analyzed during bending. Additionally, a modified model was proposed, providing mathematical constants for each case.

• Journal of the Microelectronics and Packaging Society
• /
• v.6 no.4
• /
• pp.23-33
• /
• 1999

A finite element method was employed fort thermal and stress analyses of an IGBT module of 3-phase full bridge. The effect of material parameters such as substrate material, substrate area, solder thickness on the temperature and stress distributions of the module packages has been investigated. Thermal analysis results have also been compared by setting of boundary conditions such as equivalent heat transfer coefficient or constant temperature at a base metal surface of the package. The increase of ceramic substrate area up to 3 times does little contribution to the reduction(8.9%) of thermal resistance, while contributed a lot to the reduction(60%) of thermal stress. Thicker solder resulted in higher thermal resistance but did slightly reduced thermal stresses. It is revealed by the stress analysis that maximum stress was induced at the region of copper pads which are bonded with ceramic substrate.

• Korean Journal of Metals and Materials
• /
• v.47 no.3
• /
• pp.202-208
• /
• 2009

The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.