• The Korean Journal of Cytopathology
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• v.11 no.1
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• pp.47-52
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• 2000

Diffuse sclerosing papillary carcinoma(DSPC), a variant of papillary carcinoma of the thyroid, is characterized by diffuse involvement of one or both thyroid lobes, and histologic features such as prominent sclerosis, intense lymphocytic infiltrate, numerous psammoma bodies, and squamous metaplasia together with the characteristic cytoarchitectural pattern of classical papillary carcinoma. We experienced a case of fine needle aspiration cytologic(FNAC) findings of DSPC, which was confirmed by histologic examination of the thyroidectomy specimens. The patient was 26 years old female who presented with diffuse firm enlargement of the thyroid gland with enlargement of many cervical lymph nodes. FNAC smears showed numerous psammoma bodies, many lymphocytes, metaplastic squamous cells, absence of stringy colloid, and epithelial cells showing classical features of papillary carcinoma, such as nuclear grooves, intranuclear unclusions, and ground glass chromatin pattern.

• The Korean Journal of Cytopathology
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• v.9 no.1
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• pp.117-121
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• 1998

Cytologic features of a poorly differentiated "insular" carcinoma of the thyroid are presented. In fine needle aspiration cytology, the aspirates were highly cellular and tumor cells were arranged in loose cluster or singly dispersed on focally necrotic background. Occasional microfollicles were evident. The tumor cells had poorly defined, scanty cytoplasm and most of the nuclei were fairly uniform with coarse chromatin pattern. A few large pleomorphic cells were also noted. The cytologic findings of the present case were correlated well with the histologic findings, which showed typical insular pattern and the presence of uniform cells with occasional pleomorphism.

• Proceedings of the KIEE Conference
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• 2009.04b
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• pp.259-262
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• 2009

Several universities in Korea are beginning studies related to soft stamping processes but since the studies are done with manual works thus systematic tests can't be performed due to difficulties in producing reproducible and repeatable fine patterns. Therefore, the phenomenon of destruction of the pattern forms of elastic polymers occurred during working because of inconsistent printing pressures and pinting time and there have been difficulties in maintaining flatness or producing uniform and fault-free fine structures in pinting large areas and also, there have been difficulties in multi-layered processes as patterns were changed by contacts in registering and errors in alignments. The purpose of development of this technology is to improve the process of soft lithography so that contacts between PDMS stamps and metal coated substrates in order to develop a stamp printing device that can not only shorten but also optimize processes, secure reproducibility and repeatability and is advantageous in printing large areas. Also, using this technology, this author is to develop equipment technologies and applied technologies for nano grade pattern printing processes with new concepts based on fine contact printing processes in order to apply them to diverse nano pattering processes.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.6
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• pp.145-154
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• 2002

CMP (Chemical mechanical polishing) process was used to control the fine grinding process induced mechanical damage of Cz Silicon wafer. Characterization of mechanical damage was carried out using Nomarski microscope, magic mirror and also using angle lapping and lifetime scanner evaluation after heat treatment. Magic mirror and lifetime scanner were very useful for the residual damage pattern characterization and CMP process was effective on the reduction of fine grinding induced mechanical damage.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.587-588
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• 2006

Drop-on-Demand (DOD) inkjet printing technology, especially piezo-typed, has been paid attention by industries due to its inherent nature of unbeatable material usage and low cost manufacturing cost. Despite of these key advantages over any other competing manufacturing technologies, the primary disadvantage has been considered as its limited capability to produce fine resolution patterns with a commercially available DOD inkjet print head. Although the main effort has been focused on the production of a DOD inkjet print head with smaller nozzles to overcome this challenging issue, an alternative approach could be taken and it would enable to expand the employment of DOD inkjet printing technology to applications requiring fine patterns further more.

• The Korean Journal of Cytopathology
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• v.7 no.1
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• pp.92-96
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• 1996

Extrathoracic metastases of thymomas are extremely rare, occurring in less than 2% of cases. We present a case of metastatic thymoma in the liver diagnosed by aspiration biopsy. A fine-needle aspirate from a hepatic mass of a 65-year old man who had a history of malignant thymoma locally invading pericardium was examined. Nests of epithelial cells with few scattered lymphocytes were present. The nuclei of the epithelial cells were round to oval and appeared relatively uniform and regular, with fine chromatin pattern. They had one or two, small but lather conspicuous nucleoli. Unlike previous reports on the findings of the aspiration cytology of thymomas, the characteristic biphasic pattern was not present in this case.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.05a
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• pp.362-365
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• 2004

'Coil' occupies a much important position in delivering driving force of optical pick-up actuators. Up to now the main stream has been a winding coil type actuator, but actuators using FP-Coil(Fine Pattern Coil) have been considered for the more compacted and simple manufacturing process and have variously spreaded the application fields by product. We have tried to design actuators using PCB-Coil(Printed Circuit Board Coil) which has benefits in terms of price and manufacturing process. Especially this research has two main things those are to reduce the vibration of sub-resonance and to assure the do sensitivity in the performance of asymmetric optical pick-up actuator with PCB-Coil.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2003.11a
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• pp.220-225
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• 2003

Recent issue of optical actuator is applying to mobile device. It leads actuator to become smaller than conventional type. This paper proposes the design of micro actuator plate spring and analysis of its vibration characteristic. Considering natural frequency of spindle motor, 1st and 2nd eigenfrequency of micro actuator must avoid its natural frequency. First, magnetic circuit is designed by using fine pattern coil and magnetic force is acquired by simulation program. Then, concept design is achieved by topology optimization. From concept design, micro actuator plate spring is embodied through DOE(design of experiment). Finally, considering vibration characteristic simultaneously, optimal plate spring design is determined by RSM(response surface method).

• Transactions of Materials Processing
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• v.12 no.4
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• pp.382-387
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• 2003

In this study, to achieve the optimal conditions for mechanical hyper-fine pattern fabrication process, deformation behaviors of the materials during indentation were studied with numerical method by ABAQUS S/W. Brittle materials (Si, Pyrex glass 7740) were used as specimens, and forming conditions to reduce the elastic recovery and pile-up were proposed. The indenter was modeled a rigid surface. Minimum mesh sizes of specimens are 1-10nm. Comparisons between the experimental data and numerical result demonstrated that the finite element approach is capable of reproducing the loading-unloading behavior of a nanoindentation test.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.67-67
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• 2002

패키지 기술의 개발은 저비용, 고성능, 높은 패키징 효율의 추세로 가고 있다. 이러한 추세에 따라 기판재료의 개발 및 구조의 변형이 요구된다. 패키지의 한 형태인 MCM(Multi-Chip Module)에 연성기판을 사용할 경우 fine pattern이 가능하고 부피가 작기 때문에 패키지의 효율이 좋고 또한 reel to reel process에 적용이 가능하기 때문에 대량생산의 이점을 가지고 있다. 연성기판은 좋은 전기적 특성을 가진 polyimide와 구리 층으로 구성된다. 그러나 polyimide와 구리 계층 사이에 약한 접착력과 구리로의 polyamic acid의 diffusion, 다층 기판의 제조의 어려움 등의 문제점을 남겨두고 있다. 본 연구는 일반적인 polyimide/copper가 구조가 가지고 있는 문제점을 해결하고 구리 패턴을 제작하기 위해 에칭을 쓰는 것을 배제함으로 fine pattern을 이루어 내었으며 전기도금으로 완전하게 채워진 pluged via을 사용함으로 각층간의 연결에 신뢰성을 부여하였다. 또한, 연성기판의 구조적인 문제점인 해결하여 다층 연성기판을 제조하려고 한다.