• 제목/요약/키워드: Fine pattern

검색결과 612건 처리시간 0.026초

Electroforming을 이용한 PDP용 EMI 메시 개발 (EMI Mesh Development for the PDP using Electroforming)

  • 권혁홍;범민욱;임성룡;황춘섭;박동식;이태환
    • 한국생산제조학회지
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    • 제20권1호
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    • pp.108-113
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    • 2011
  • There are a lot of PDP TV for a plasma discharge pulse voltage generated by the use of electromagnetic waves. EMI mesh film is near Infrared ray caused by malfunction of the remote control intended to prevent this phenomenon. In this study, the formation of fine pattern by making the mold is imprinted on the film sheet. EMI mesh film has been granted by filling in the conductive material region imprinted with electroforming in the manufacture of resistance. The fine patterns fabricated with electroforming facility thickness of homogenization process technology were established to optimize the working conditions.

세침 흡인 생검으로 진단된 폐의 전이성 선양 낭포암종 1예 보고 (Metastatic Adenoid Cystic Carcinoma of the Lung Diagnosed by Fine Needle Aspiration Biopsy)

  • 박소연;이광길
    • 대한세포병리학회지
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    • 제1권2호
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    • pp.175-178
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    • 1990
  • A case of metastatic adenoid cystic carcinoma of the lung, originated from the trachea, was diagnosed by fine needle aspiration. Although the cytologic features of adenoid cystic carcinoma have been well described, it is easy to confuse adenoid cystic carcinoma with more common primary small cell neoplasms of the lung, i.e., small cell carcinoma, well differentiated adenocarcinoma, and carcinoid tumor of the lung. The features distinguishing adenoid cystic carcinoma from these neoplasms include 1) tight, globular, honeycomb pattern of cells, 2) acellualr basement membrane material in the lumen, and 3) cells lacking true nuclear melding and having bland chromatin pattern. The morphologic feature of metastatic adenoid cystic carcinoma in this case was so distinctive as to permit a definite diagnosis by aspiration cytology.

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미세 선폭 프린팅을 위한 롤투롤 장비 개발 (Development of Roll-to-Roll Printing System for Fine Line-width Printing)

  • 김충환;류병순;임규진;이명훈;이택민;윤소남;최병오
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2006년도 춘계학술대회 논문집
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    • pp.583-584
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    • 2006
  • Printing technology has begun to get into the spotlight in many ways due to the low cost effectiveness to existent semi-conductor process. It also has very useful application areas, not only paper printing but also patterning for LCD color tilter, Photovoltaic patterning, RFID antenna, OLED, and so on. In this study, an apparatus of gravure offset printing was developed for fine line width printing. The pattern was composed of $20{\mu}m$ size of continuous lines of which pitch size was $40{\mu}m$. The printed pattern shows that it is possible to make around $20{\mu}m$ line-width printing pattern. The roll-to-roll printing system for fine line-width printing based on primary experiment is presented. For testing of multi-layer printing, the system was designed to be capable of printing two different materials from each printing unit using gravure-offset printing method and have a function of alignment of two printed materials.

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Novel Low-Volume Solder-on-Pad Process for Fine Pitch Cu Pillar Bump Interconnection

  • Bae, Hyun-Cheol;Lee, Haksun;Eom, Yong-Sung;Choi, Kwang-Seong
    • 마이크로전자및패키징학회지
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    • 제22권2호
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    • pp.55-59
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    • 2015
  • Novel low-volume solder-on-pad (SoP) process is proposed for a fine pitch Cu pillar bump interconnection. A novel solder bumping material (SBM) has been developed for the $60{\mu}m$ pitch SoP using screen printing process. SBM, which is composed of ternary Sn-3.0Ag-0.5Cu (SAC305) solder powder and a polymer resin, is a paste material to perform a fine-pitch SoP in place of the electroplating process. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder; the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. The Si chip and substrate with daisy-chain pattern are fabricated to develop the fine pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si substrate has 6724 under bump metallization (UBM) with a $45{\mu}m$ diameter and $60{\mu}m$ pitch. The Si chip with Cu pillar bump is flip chip bonded with the SoP formed substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of underfill. The optimized interconnection process has been validated by the electrical characterization of the daisy-chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and micro bump interconnection using a screen printing process.

The fabrication of electrodes with low resistance and fine pattern for PDP

  • Cho, Soo-Je;Ryu, Byung-Gil;Park, Myung-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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    • pp.107-108
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    • 2000
  • We propose the method which is possible to fabricate the electrodes with the fine pattern and low resistance by photolithography and electroplating. The widths of pattern fabricated were 30, 50, 70 and 100um and the thickness could be up to $10{\mu}m$. The resistivity of the copper electrode electroplated was below $2.0{\mu}{\Omega}$ cm which is about half of photosensitive silver electrode. Dielectric layer was coated on the electrodes by screen printing and the pores harmful to the discharge were not formed after heat treatment. In the viewpoint of resistance and patterning, this method has much higher potential for large area display than other methods like screen printing, photosensitive conductive paste method and sputtering.

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거친 오차 추정과 미세 오차 추정을 활용한 블라인드 적응 알고리즘 (Blind Adaptation Algorithms Using Coarse Error Estimation and Fine Error Estimation)

  • 오길남
    • 한국산학기술학회논문지
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    • 제13권8호
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    • pp.3660-3665
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    • 2012
  • 블라인드 등화에서 등화 초기에는 눈모형을 빠르게 여는 것이 필요하고, 이후에는 등화기 출력 신호의 오차 레벨을 낮추는 것이 중요하다. 본 논문에서는 특별하게 정해지는 신호점을 사용한 거친 오차 추정과 원 신호점을 사용한 미세 오차 추정을 동시에 산출하고, 두 오차 추정을 활용하는 방식을 제안한다. 두 오차 추정은 각각 눈모형이 닫힌 상태에서 눈모형을 빠르게 열거나, 눈모형이 열리기 시작한 이후 정상상태에서 오차 레벨을 낮추는데 효과적이다. 등화기의 수렴 상태에 따라 두 오차 추정 중 하나를 선택하거나, 두 오차 추정의 상대적 신뢰도에 따라 두 오차를 가중 결합하여 새로운 오차를 산출하는 두 블라인드 등화 알고리즘을 제안하고 그 성능을 비교한다.

초음파 진동을 이용한 RFID 미세패턴 성형 (Fabrication of RFID Micro-pattern using Ultrasonic Vibration)

  • 오명석;이봉구;박명규
    • 한국생산제조학회지
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    • 제26권3호
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    • pp.344-349
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    • 2017
  • In this study, we developed a process technology to fabricate RFID tag antennas using a one-sheet inlay micro-pattern forming process by press-molding RFID tag antennas on insulation sheet layers, such as polymer films, using ultrasonic longitudinal vibration. In addition, a fine pattern applicable for RFID tag antennas was manufactured using a $25{\mu}m$ thick thin-plate square wire; this is in contrast to the method that uses a conventional round wire. The developed ultrasonic indentation process can be used to fabricate fine pattern of the RFID antenna using one piece of equipment. The simplified manufacturing process technology has a shorter manufacturing time and is more economical. The developed RFID tag antenna forming technique involves pressing the $25{\mu}m$ square wire directly on the thin sheet insulation sheet of maximum thickness $200{\mu}m$, using a 60 kHz ultrasonic tool horn.

In-line Automatic Defect Repair System for TFT-LCD Production

  • Arai, Takeshi;Nakasu, Nobuaki;Yoshimura, Kazushi;Edamura, Tadao
    • Journal of Information Display
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    • 제10권4호
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    • pp.202-205
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    • 2009
  • An automated circuit repair system was developed for enhancing the yield of nondefective liquid crystal panels, focusing on the resist patterns on the circuit material layer of thin-film transistor (TFT) substrates prior to etching. The developed system has an advantage over the parallel conventional system: In the former, the repair conditions depend on the type of resist whereas in the latter, the repair parameters must be fine-tuned for each circuit material. The developed system consists of a resist pattern defect inspection system and a pattern repair system for short and open defects. The repair system performs fine corrections of abnormal areas of the resist pattern. The open-repair system is equipped with a syringe to dispense resist. To maintain a stable resist diameter, a thermal insulator was installed in the syringe system. As a result, the diameter of the dispensed resist became much more stable than when no thermal insulator was used. The resist diameter was kept within the target of $400{\pm}100{\mu}m$. Furthermore, a prototype system was constructed, and using a dummy pattern, it was confirmed that the system worked automatically and correctly.

미술의 요소와 원리에 근거한 만 2세 표준보육과정 교사용 지도서 미술활동 분석 (An Analysis of the Fine Arts Activities on the Standard Childcare Curriculum Guidebook(for 2 years) for Teachers Based on the Elements and Principle of Fine Arts)

  • 김순희;이순복
    • 한국보육지원학회지
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    • 제14권4호
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    • pp.63-83
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    • 2018
  • Objective: The purpose of this study was to analyze how the elements and principles of fine arts were reflected in art related activities in the teacher's manual on standard childcare curriculum for a period of 2 years. Methods: The analysis criteria for the elements of fine arts were modified and complemented based on Kim and Gang(2011) and the same was done for the principles of fine arts based on Lee et al(2015). Results: First, as a result of analyzing the art contents according to life theme in art related activities, 'artistic expression' appeared the most in all nine life themes. Second, as a result of analyzing the art related contents in the standard childcare curriculum for 2 years based on the elements of fine arts, plane, texture, shape, color, volume, line, spot, space, composition, light and shade appeared in order. Third, as a result of analyzing the art related contents on the principles of fine arts, movement, emphasis, variety, unity, rhythm, proportion, balance and pattern appeared in order. Conclusion/Implications: The results of this research suggest that the childcare activities have to be devoloped in order to provide the balanced experiences with fine arts activities.