• 한국전기전자재료학회논문지
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• 제24권5호
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• pp.381-386
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• 2011

This paper presents the design and reliability evaluation of metallized film capacitor for power e lectronics application. The rated voltage of development capacitor is DC 3300[V], the capacitance is 5 ${\mu}F$ and the ripple current capability is 130 $A_{rms}$. Film metallization and patterns are an important design factor that has been development enhance the electric and reliability properties of film capacitor for power electronics. In term of capacitor construction and metallized pattern is one of the parameters that can be modified to further improve the rating in the terms of maximum ripple current and lifetime. This capacitor can be used as snubber capacitor application such as power train invertor system.

• 대한전기학회논문지
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• 제43권3호
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• pp.528-531
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• 1994

Digitalization in electronic system is required the capacitor which have a large capacitance with small size, low impedance at high frequency, and high reliability. The fabrication and its properties of aluminum solid electrolytic capacitor are investigated. Employing conduction polymer film such as, polypyrrole as solid electroylte, solid type aluminum electrolytic capacitors were made. The surface of insulationg oxide is covered with conducting polymer layer prepared by chemical oxidative polymerization. Thereafter this conducting layer is covered with conducting polymer prepared by electrochemical polymerization. The dielectric properties of these capacitors were also measured and discussed. Regarding on frequency characteristics of the trial made capacitor, impedance and ESR at high frequency is lower than those of the stacked type film capacitor. It is alo confirmed that temperature coefficient of capacitance and dissipation factor of the capacitor are lower than those of film capacitor and liquid type aluminum electrolytic capacitor.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 추계학술대회 논문집
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• pp.277-280
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• 1995

We had experiment using LB method that can fabricate molecular order ultra-thin film below 100${\AA}$. LB mettled has known as main technology of information society in 21C, because it is nut only free oriention and alignment of molecular but also ability of thickness control as molecular order. In this paper, the fabricated condition and physical properities of functional ultra-thin film of molecular order was investigated and highly efficient ultra-thin film capacitor was fabricated by using ultra-thin LB film for application as electronic device. Possibility of ultra-thin film capacitor was researched by analizing rind measuring electrical properties. Polyimide ultra-thin LB film capacitor was fabricated, ensured theoretically rind experimentally its possibility in range of 10Hz∼ 1MHz through its frequency characteristics.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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• pp.244-247
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• 1996

We had experiment using LB method that can fabricate molecular order ultra-thin film below 100${\AA}$. LB method has known as main technology of information society in 21C, because it is not only free orientation and alignment of molecular but also ability of thickness control as molecular order. In this paper, the fabricated condition and physical properties of functional ultra-thin film of molecular order was investigated and highly efficient ultra-thin film capacitor was fabricated by using ultra-thin LB film for application as electronic device. Possibility of ultra-thin film capacitor was researched by analyzing and measuring electrical properties. Polyimide ultra-thin LB film capacitor was fabricated, ensured theoretically and experimentally its possibility in range of 10Hz∼lMHz through its frequency characteristics.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1991년도 추계학술대회 논문집
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• pp.73-78
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• 1991

In this study of stacked type film chip capacitor, the important parameters are heat-treated temperature, pressure and time. We measured the temperature dependence of dielectric properties and dissipation factor and the frequency dependence of dielectric properties, dissipation factor, ESR(Equivalent Series Resistance) and impedance in stacked type film capacitor. As a result, the best conditions of heat-treated temperature, pressure and time were proved to be 130$^{\circ}C$, 10kg/$\textrm{cm}^2$ and 3hrs, respectively.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2012년도 전력전자학술대회 논문집
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• pp.53-54
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• 2012

본 논문에서는, 전기 자동차용 인버터의 DC Link에 사용되는 Film Capacitor의 최적 용량 선정 방법을 제시한다. 이를 위해 Film Capacitor의 동작 온도에 따른 기대수명, 전류 내량, 전압 내량 등을 고려하며, 실제 적용사례를 들어 검증한다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1990년도 추계학술대회 논문집 학회본부
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• pp.85-87
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• 1990

Silicon nitride film was deposited on a silicon wafer using a laser CVD(LCVD) technique, which is based on direct photolysis of $SiH_4/NH_3$ gas mixture by ArF laser beam(${\lambda}=193\;nm$). The refractive index of deposited SiN film is 1.9 at the temperature of $300^{\circ}C$, pressure of 5 torr. The breakdown field strength of LCVD SiN film was 10MV/cm. In IR spectrum, the absorption peak of Si-H, N-H, and Si-N is detected and it is shown that hydrogen is included in SiN film. From analysis of absorption band. it is calculated that density of Si-H, N-H bond is higher than $5{\times}10^{22}cm^{-3}$. LCVD MIS capacitor and PECVD MIS capacitor have injection-type hysteresis but it is known that hysteresis loss of LCVD MIS capacitor is smaller than that of PECVD MIS capacitor. It means that Interface state density of LCVD capacitor is smaller than that of PECVD capacitor. In addition, the flatband voltage($V_{FB}$) of LCVD is smaller than that of PECVD capacitor. And it means that fixed charged density($Q_{FIX}$) of LCVD capacitor is smaller than that of PECVD MIS capacitor.

• 한국전자파학회논문지
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• 제17권9호
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• pp.860-865
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• 2006

본 논문에서는 가변형 $Bi_2O_3-ZnO-Nb_2O_5(BZN)$ Pyrochlore 박막을 이용한 고가변형 inter-digital capacitor를 제안하였다. 가장자리 전계 효과를 이용한 가변성의 향상과 DC 전압의 감소를 위해 inter-digital capacitor의 전극이 박막 내부에 삽입되었다. 2.5D simulator를 이용한 설계 결과, 제 안된 구조의 inter-digital capacitor(IDC)가 일반적인 구조의 IDC에 비해 가변성이 10 % 향상되었다. 제안된 IDC는 설계 결과를 바탕으로 실리콘 기판 위에 BZN 박막을 이용하여 제작되었다. BZN 박막은 reactive RF magnetron sputtering 방법을 이용하여 증착되었다. 제작된 inter-digital capacitor는 5.8 GHz와 18 V의 DC 인가 전압에서 최대 가변율이 50 %였다.

• 한국ITS학회 논문지
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• 제7권5호
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• pp.97-105
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• 2008

반도체 공정의 미세화 및 마이크로 시스템 기술의 발전 그리고 소형 무선PAN 및 이동통신 장치들의 급증으로 인하여 전자부품들의 소형화와 직접화에 대한 요구가 지속적으로 증가되고 있다. 본 연구에서는 휴대형 무선PAN 및 이동통신용 전자회로 설계에 다양한 목적으로 널리 사용되고 있는 기저대역의 수동소자들 중 미세 커패시터의 안정성과 전기적 특성을 확보하기 위하여, 유전체인 AIN을 사용하여 MIM구조로 제작된 미세 박막 커패시터 소자의 전기적인 특성을 분석하고 기저대역에서의 성능을 평가한다. 또한 제작된 미세 박막형 커패시터의 용량제어 방법을 제시함으로서 기저대역에서 범용으로 사용할 수 있는 미세 박막 커패시터의 모델을 제시하고자 한다. 또한, 주파수 대역에 따른 MIM구조의 AIN 커패시터 특성을 분석함으로서 향후 임베디드 소자와 집적화를 위한 고정밀의 미세수동 소자로서의 활용방안을 제시하고자한다.

• 반도체디스플레이기술학회지
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• 제19권1호
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• pp.42-48
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• 2020

As global warming accelerates, eco-friendly electric cars are being developed to reduce carbon dioxide emissions, and power conversion inverters are used to drive motors. Among inverter components, DC-link capacitor is heated by high current usage, which causes problems such as performance and life-saving of inverter. Although metal cases with good thermal performance have been used to solve this problem, it is difficult to apply them in practice due to insulation problems with other parts. In this paper, the Heat-Generation influence factor of DC-link capacitor is analyzed. Variables on heat-generation are set at 3 levels for film width, inductance, and film thickness. Box-Behnken to 13 tests using the design and minimal deviations, e.g. through the experiment three times by each level. The surface of the film k type by attaching the sensor current is measured temperature. Capacitance was set to a minimum level of 200 ㎌ and had a frequency of 16 kHz with Worst case, ambient temperature of 85℃ and a ripple current of 50 Ams was applied. The temperature at the measurement point was collected in the data logger after sampling at 1 minute intervals for 2 hours after saturation with the ambient temperature. This experiment confirmed that setup factors are correlated with heat-generation.