• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.129-129
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• 2002

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.2147-2149
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• 2000

The silent discharge is known to be one of the most effective methods for ozone generation. In this paper. in order to improve ozone concentration and energy yield, some kind of silent discharge-type reactors with different dielectric materials were prepared. Some silent discharge characteristics of these reactors were studied and discussed.

• The Korean Journal of Ceramics
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• v.5 no.3
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• pp.245-249
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• 1999

A new type of nonthermal plasma reactor utilizing ferroelectric pellets is proposed to generate nonthermal plasma efficiently, which is used for simultaneous control of various pollutant gases. Electric charges stored on ferroelctric pellets by corona discharge between a corona tip and a mesh electrode provide partial electrical discharges among ferroelectric pellets. These partial electrical discharges can enhance partial discharges around the surface of ferroelectric pellets. This method utilizes wide reacting area of ferroelectric pellets and partial discharge. Positive and negative dc voltage are applied to the corona tip to generate partial discharges, and corona currents are estimated to investigate charge storage on ferroelectric pellets as function of time and charge relaxation time constants of ferroelectric pellects. As a result, charge relaxationtime, dielectric constants of ferroelectric pellets, polarity of applied voltage and applied time influence partial discharges among ferroelectric pellect.

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.1
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• pp.45-51
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• 2005

We have developed surface micromachined Infrared ray (IR) focal plane array (FPA), in which single $SiO_{2}$ layer works as an IR absorbing plate and $Pb(Zr_{0.3}Ti_{0.7})O_{2}$ thin film served as a thermally sensitive material. There are some advantages of applying $SiO_{2}$ layer as an IR absorbing layer. First of all, the $SiO_{2}$ has good IR absorbance within $8{\sim}12{\mu}m$ spectrum range. Measured value showed about 60% absorbance of incident IR spectrum in the range. $SiO_{2}$ layer has another important merit when applied to the top of Pt/PZT/Pt stack because it works also as a supporting membrane. Consequently, the IR absorbing layer forms one body with membrane structure, which simplifies the whole MEMS process and gives robustness Ito the structure.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.17-22
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• 2006

Ferroelectric PZT thin films were formed by 2-step sputtering and their dielectric properties and conduction mechanisms were investigated. Also. donor impurity doping was tried to compensate the carriers in PZT thin films. The leakage current density was able to reduce to $10^{-7}A/cm^2$ order by 2-step sputtering with thickness control of room temp.-layer. The conduction mechanism was confirmed as bulk-limited, and optimum donor impurities on PZT thin film were taken. Especially, leakage current characteristics was improved to $10^{-8}A/cm^2$ order in donor-doped PZT thin films formed by 2-step sputtering.

• Bulletin of the Korean Chemical Society
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• v.24 no.3
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• pp.274-278
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• 2003

New banana-shaped achiral compounds, 1,3-phenylene bis [4-{4-(alkenyloxy) phenyliminomethyl}benzoate]s were synthesized by varying the length of alkenyl group; their ferroelectric properties are described. The smectic mesophases, including a switchable chiral smectic C $(Sm\;C^*)$ phase, were characterized by differential scanning calorimetry, polarizing optical microscopy and triangular wave method. The presence of vinyl groups at the terminals of linear side wings in the banana-shaped achiral molecules containing Schiff's base mesogen induced a decrease in melting temperature and formation of the switchable $(Sm\;C^*)$ phase in the melt. The smectic phases having the octenyloxy group such as $(CH_2)_6CH=CH_2$ showed ferroelctric switching, and their values of spontaneous polarization on reversal of an applied electric field were 120 nC/cm² (X=H) and 225 nC/ cm² (X=F), respectively. We could obtain ferroelectric phases by controlling the number of carbon atom in alkenyloxy chain of a bent-core molecule.

• Korean Journal of Materials Research
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• v.12 no.1
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• pp.75-81
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• 2002

The ferroelectric properties of Pb(Zr,Ti)O$_3$[PZT] films degrade when the films with Pt top electrodes are annealed in hydrogen containing environment. This is due to the reduction activity of atomic hydrogen that is generated by the catalytic activity of the Pt top electrode. At the initial stage of hydrogen annealing, oxygen vacancies are formed by the reduction activity of hydrogen mainly at the vicinity of top Pt/PZT interface, resulting in a shift of P-E (polarization-electric field) hysteresis curve toward the negative electric field direction. As the hydrogen annealing time increases, oxygen vacancies are formed inside the PZT film by the inward diffusion of hydrogen ions, as a result, the polarization degrades significantly and the degree of P-E curve shift decreases gradually. The direction and the magnitude of the remnant polarization in the PZT film affect the motion of hydrogen ions which determines the degradation of polarization characteristics and the shift in the P-E hysteresis curve of the PZT capacitor during hydrogen annealing. When the remnant polarization is formed in the PZT film by applying a pre-poling voltage prior to hydrogen annealing, the direction of the P-E curve shift induced by hydrogen annealing is opposite to the polarity of the pre-poling voltage. The hydrogen-induced degradation behavior of the PZT capacitor is also affected by the internal field that has been generated in the PZT film by the charges located at the top interface prior to hydrogen annealing.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05a
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• pp.53-56
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• 2004

The a-Si:H TFT using ferroelectric of SrTi $O_3$as a gate insulator is fabricated on glass. Dielectric characteristics of ferroelectric are superior to $SiO_2$and S $i_3$ $N_4$. Ferroelctric increases on-current, decreases thresh old voltage of TFT and also improves breakdown characteristics. The a-SiN:H has optical band gap of 2.61 eV, refractive index of 1.8~2.0 and resistivity of 10$^{13}$ - 10$^{15}$ $\Omega$cm, respectively. Insulating characteristics of ferroelectrics are excellent because dielectric constant of ferroelectric is about 60~100 and breakdown strength is over 1MV/cm. TFT using ferroelectric has channel length of 8~20${\mu}{\textrm}{m}$ and channel width of 80~200${\mu}{\textrm}{m}$. And it shows that drain current is 3.4$mutextrm{A}$ at 20 gate voltage, $I_{on}$ / $I_{off}$ is a ratio of 10$^{5}$ - 10$^{8}$ and $V_{th}$ is 4~5 volts, respectively. In the case of TFT without ferroelectric, it indicates that the drain current is 1.5 $mutextrm{A}$ at 20 gate voltage and $V_{th}$ is 5~6 volts. With the improvement of the ferroelectric thin film properties, the performance of TFT using this ferroelectric has advanced as a gate insulator fabrication technology is realized.zed.d.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.3
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• pp.576-581
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• 2005

In this paper. the a-Si:H TFT using ferroelectric of $SrTiO_3$ as a gate insulator is fabricated on glass. High k gate dielectric is required for on-current, threshold voltage and breakdown characteristics of TFT Dielectric characteristics of ferroelectric are superior to $SiO_2$ and $Si_3N_4$. Ferroelectric increases on-current and decreases threshold voltage of TFT and also ran improve breakdown characteristics.$SrTiO_4$ thin film is deposited by e-beam evaporation. Deposited films are annealed for 1 hour in N2 ambient at $150^{\circ}C\~600^{\circ}C$. Dielectric constant of ferroelectric is about 60-100 and breakdown field is about IMV/cm. In this paper, the TFT using ferroelectric consisted of double layer gate insulator to minimize the leakage current. a-SiN:H, a-Si:H (n-type a-Si:H) are deposited onto $SrTiO_3$ film to make MFNS(Metal/ferroelectric/a-SiN:H/a-Si:H) by PECVD. In this paper, TFR using ferroelectric has channel length of$8~20{\mu}m$ and channel width of $80~200{\mu}m$. And it shows that drain current is $3.4{\mu}A$at 20 gate voltage, $I_{on}/I_{off}$ is a ratio of $10^5\~10^8,\;and\;V_{th}$ is$4\~5\;volts$, respectively. In the case of TFT without having ferroelectric, it indicates that the drain current is $1.5{\mu}A$ at 20gate voltage and $V_{th}$ is $5\~6$ volts. If properties of the ferroelectric thin film are improved, the performance of TFT using this ferroelectric thin film can be advanced.