• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.54-58
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• 2005

Femtosecond laser is the latest generation pulsed laser delivering shortest pulses. Any solid materials can be machined by it. Femtosecond laser micromachining allows highest precision and minimal heat influence within the workpiece. But due to the complex physical phenomena between the laser beam and the workpiece materials, it is very difficult to determine the optimal process conditions in the femtosecond laser micromachining. In this study, a method to simulate the femtosecond laser micromachining process was proposed. And femtosecond laser micro patterning processes of chromium thin film are simulated by the proposed method using a commercial FE code, LS-Dyna. Simulation results were compared with those of experiments.

• Laser Solutions
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• v.9 no.2
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• pp.11-15
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• 2006

We report experimental results on the high-speed micromachining using a femtosecond laser (800 nm, 130 fs, 1kHz) and galvanometer scanner system (Raylase, Germany). Periodic hole drilling of silicon and glass with the scan speed of 1-20 mm/s is demonstrated. Finally, we demonstrate the utility of the femtosecond laser application to ITO patterning by using a high-speed femtosecond laser scanner system.

• Journal of the Optical Society of Korea
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• v.8 no.3
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• pp.127-131
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• 2004

This paper investigates applications of femtosecond lasers for the micromachining of transparent materials and fabrication of optical devices. We show commercial micromachining examples of transparent materials which have been fabricated for various applications. Near infrared femtosecond laser processing is an attractive method to fabricate three-dimensional optical waveguides into various transparent materials. Focused femtosecond laser pulses induce a permanent refractive-index change only near the focal point. We also demonstrate a Y coupler with the splitting ratio of 1:1 written by femtosecond laser pulses into a fused silica glass. The minimum propagation loss of 0.8 ㏈/㎝ awl the refractive-index change of 0.006-0.01 at the wavelength of 1550 ㎚ were achieved by optimization of the laser fluence.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.1 s.178
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• pp.13-22
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• 2006

• Design & Manufacturing
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• v.14 no.3
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• pp.44-49
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• 2020

One of display trends today is development of high pixel density. To get high PPI, a small size of pixel must be developed. RGB pixel is arranged by evaporation process which determines pixel size. Normally, a fine metal mask (FMM; Invar alloy) has been used for evaporation process and it has advantages such as good strength, and low thermal expansion coefficient at low temperature. A FMM has been manufactured by chemical etching which has limitation to controlling the pattern shape and size. One of alternative method for patterning FMM is laser micromachining. Femtosecond laser is normally considered to improve those disadvantages for laser micromachining process due to such short pulse duration. In this paper, a femtosecond laser drilling for thickness of 16 ㎛ FMM is examined. Additionally, we introduce experimental results for controlling taper angle of hole by vibration module adapted in laser system. We used Ti:Sapphire based femtosecond laser with attenuating optics, co-axial illumination, vision system, 3-axis linear stage and vibration module. By controlling vibration amplitude, entrance and exit diameters are controllable. Using vibrating objective lens, we can control taper angle when femtosecond laser hole drilling by moving focusing point. The larger amplitude of vibration we control, the smaller taper angle will be carried out.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.235-236
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• 2013

• Journal of the Korean Society for Precision Engineering
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• v.22 no.12 s.177
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• pp.184-189
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• 2005

An experimental study of the femtosecond laser machining of Si materials was carried out. Direct laser machining of the materials for the feature size of a few micron scale has the advantage of low cost and simple process comparing to the semiconductor process, E-beam lithography, ECM and other machining process. Further, the femtosecond laser is the better tool to machine the micro parts due to its characteristics of minimizing the heat affected zone(HAZ). As a result of line cutting of Si, the optimal condition had the region of the effective energy of 2mJ/mm-2.5mJ/mm with the power of 0.5mW-1.5mW. The polarization effects of the incident beam existed in the machining qualities, therefore the sample motion should be perpendicular to the projection of the electric vector. We also observed the periodic ripple patterns which come out in condition of the pulse overlap with the threshold energy. Finally, we could machined the groove with the linewidth of below $2{\mu}m$ for the application of MEMS device repairing, scribing and arbitrary patterning.

• Laser Solutions
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• v.8 no.1
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• pp.39-44
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• 2005

We report experimental results on the periodic patterning using a Ti:sapphire femtosecond laser (800nm, 100fs, 1kHz). Periodic structures with reproducible basic patterns are produced both on the surface and inside transparent materials. Period patterning for the application to display panel is widely investigated. Also, the submicron dot and line patterns are fabricated inside fused silica glass, which is important for the formation of diffraction grating in integrated optical circuit. finally, we demonstrate the utility of the femtosecond laser application to optical memory by fabricating the three-dimensional dot patterns.

• Journal of the Optical Society of Korea
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• v.7 no.3
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• pp.166-173
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• 2003

This paper presents micromachining results on planar-lightwave-circuit (PLC) chips with Si substrate and the quartz substrate by using Ti:Sapphire femtosecond-pulsed laser. The ablation process with femtosecond laser pulses generates nothing of contamination, molten zone, microcracks, shock wave, delamination and recast layer. We also showed that the micromachine for PLC using femtosecond pulsed lasers is superior to that using nanosecond pulsed lasers. The insertion loss and the optical return loss of the 1 ${\times}$ 8 optical power splitters packaged with micromachined input- and output-port U-grooves were less than 11.0 ㏈ and more than 55 ㏈, respectively. The wavelength dependent loss (WDL) was distributed within $\pm$0.6 ㏈ and the polarization dependent loss (PDL) was less than 0.2 ㏈.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.5 s.182
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• pp.190-196
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• 2006

Transparent materials are widely used in the fields of optic parts and bio industry. We have experiment to find out the characteristics of the micromachining inside transparent materials using femtosecond laser pulses. With its non-linear effects by very high peak intensity, filament (plasma channel) was formed by the cause of the self-focusing and the self-defocusing. Physical damage could be found when the intensity is high enough to give rise to the thermal stress or evaporation. At the vicinity of the power which makes the visible damage or modification, the structural modification occurs with the slow scanning speed. According to the polarization direction to the scanning direction, the filament quality is quite different. There is a good quality when the polarization direction is parallel to the scanning direction. For fine filament, we could suggest the conditions of the high numerical aperture lens, the short shift of focusing point, the low scanning speed and the low power below 20 mW. As the examples of optics parts, we fabricated the fresnel zone plate with the $225{\mu}m$ diameter and Y-bend optical wave guide with the $5{\mu}m$ width.