• 한국산학기술학회논문지
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• 제12권12호
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• pp.5832-5837
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• 2011

본 논문에서는 1 ${\mu}m$ CMOS 공정을 사용하여 LED 구동회로용 과열방지회로를 제안하였다. 제안하는 과열 방지회로는 $120^{\circ}C$에서 동작하며 $90^{\circ}C$에서 차단되도록 설계하였으며, 공정 오차에 따른 과열방지회로의 특성 변화가 많이 감소되었다. 세 가지 공정변화에 따른 특성 변화를 본 결과 제안하는 과열방지회로의 시뮬레이션 결과는 기존의 BJT 전류미러 방식의 과열방지회로보다 공정에 따른 온도변화가 약 7 % 줄어드는 것을 확인하였다. 또한 가상의 LED 구동회로에 연결하였을 때 과열로부터 LED 구동회로를 보호하는 것을 확인하였다.

• 한국분말재료학회지
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• 제23권4호
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• pp.297-302
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• 2016

Ag nanoparticles are extensively studied and utilized due to their excellent catalysis, antibiosis and optical properties. They can be easily synthesized by chemical reduction methods and it is possible to prepare particles of uniform size and high purity. These methods are divided into vapor methods and liquid phase reduction methods. In the present study, Ag particles are prepared and analyzed through two chemical reduction methods using solvents containing a silver nitrate precursor. When Ag ions are reduced using a reductant in the aqueous solution, it is possible to control the Ag particle size by controlling the formic acid ratio. In addition, in the Polyol process, Ag nanoparticles prepared at various temperatures and reaction time conditions have multiple twinned and anisotropic structures, and the particle size variation can be confirmed using field emissions scanning electron microscopy and by analyzing the UV-vis spectrum.

• Korean Chemical Engineering Research
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• 제53권1호
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• pp.6-10
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• 2015

효소 전극 anode와 PEMFC용 전극 cathode를 이용하여 효소연료전지를 구동하였다. 효소 anode는 그래파이트 분말과 효소로서 글루코스 산화제, 전자매개체로서 페로센을 혼합해 압축해서 만들고 Nafion 이오노머로 코팅하였다. anode 제조조건을 변화시키며 OCV를 측정해 효소 anode 제조 최적조건을 찾았다. 효소 anode 압축 시 최적 압력은 9.0 MPa였다. 효소 anode에서 그래파이트가 60%일 때 최고의 OCV를 나타냈다. anode 기질 용액의 최적 글루코스 농도는 1.7 mol/l이었으며, anode의 효소 활성은 7일 동안 안정적으로 유지되었다.

• Korean Chemical Engineering Research
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• 제54권2호
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• pp.171-174
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• 2016

효소 전극 cathode와 PEMFC용 전극 anode를 이용하여 효소연료전지를 구동하였다. 효소 cathode는 그래파이트 분말과 효소로서 Laccase, 산화환원 매개체로서 ABTS를 혼합해 압축해서 만들고 Nafion 이오노머로 코팅하였다. cathode 제조조건을 변화시키며 OCV를 측정해 효소 cathode 제조 최적조건을 찾았다. 효소 cathode 압축 시 최적 압력은 4.0 bar 였다. 효소 cathode에서 그래파이트가 95%일 때 최고의 OCV를 나타냈다. cathode기질 용액의 최적 글루코스 농도는 0.4 mol/l이었다.

• 한국분말재료학회지
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• 제11권6호
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• pp.493-502
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• 2004

In this study, nano-sized indium oxide powder with the average particle size below 100 nm is fab-ricated from the indium chloride solution by the spray pyrolysis process. The effects of the reaction temperature, the concentration of raw material solution and the inlet speed of solution on the properties of powder were studied. As the reaction temperature increased from 850 to $1000^{\circ}C$, the average particle size of produced powder increased from 30 to 100 nm, and microstructure became more solid, the particle size distribution was more irregular, the intensity of a XRD peak increased and specific surface area decreased. As the indium concentration of the raw material solution increased from 40 to 350 g/l, the average particle size of the powder gradually increased from 20 to 60 nm, yet the particle size distribution appeared more irregular, the intensity of a XRD peak increased and spe-cific surface area decreased. As the inlet speed of solution increased from 2 to 5 cc/min., the average particle size of the powder decreased and the particle size distribution became more homogeneous. In case of the inlet speed of 10 cc/min, the average particle size was larger and the particle size distribution was much irregular compared with the inlet speed of 5 cc/min. As the inlet speed of solution was 50 cc/min, the average particle size was smaller and microstructure of the powder was less solid compared with the inlet speed of 10 cc/min. The intensity of a XRD peak and the variation of specific area of the powder had the same tendency with the variation of the average par-ticle size.

• 한국분말재료학회지
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• 제23권1호
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• pp.8-14
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• 2016

A bulk-type Ta material is fabricated using the kinetic spray process and its microstructure and physical properties are investigated. Ta powder with an angular size in the range $9-37{\mu}m$ (purity 99.95%) is sprayed on a Cu plate to form a coating layer. As a result, ~7 mm-sized bulk-type high-density material capable of being used as a sputter material is fabricated. In order to assess the physical properties of the thick coating layer at different locations, the coating material is observed at three different locations (surface, center, and interface). Furthermore, a vacuum heat treatment is applied to the coating material to reduce the variation of physical properties at different locations of the coating material and improve the density. OM, Vickers hardness test, SEM, XRD, and EBSD are implemented for analyzing the microstructure and physical properties. The fabricated Ta coating material produces porosity of 0.11~0.12%, hardness of 311~327 Hv, and minor variations at different locations. In addition, a decrease in the porosity and hardness is observed at different locations upon heat treatment.

• 한국분말재료학회지
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• 제19권6호
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• pp.398-404
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• 2012

This paper describes the spherical ammonium diuranate gel particles which are the intermediated material of the $UO_2$ microsphere for an VHTR(very high temperature reactor) nuclear fuel. The characteristics of the intermediate-ADU gel particles prepared by AWD(ageing, washing, and drying) and FB(fluidized-bed) apparatus were examined and compared in a sol-gel fabrication process. The electrical conductivity of washing filtrate from the FB treating and the surface area of dried-ADU gel particles were higher than those of AWD treating. Also, an internal pore volume in dried-ADU gel particles showed a more decrease in AWD treatment than FB treatment because of decomposition of PVA affected by the washing time. However, the internal microstructures of ADU gel particles were similar regardless of the process variation.

• 한국전기전자재료학회논문지
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• 제14권2호
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• pp.152-157
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• 2001

For the fabrication of YBa$_2$Cu$_3$O$_{x}$ thick film using diffusion process between $Y_3$BaCuO$_{5}$ and BaO+CuO, each material was selected as substrate and doping material. In this paper, we investigated the characteristic of YBa$_2$Cu$_3$O$_{x}$ thick film due to both addition of CeO$_2$into substrate and initial particle size of doping material. Through X-ray diffraction patterns and SEM photographs, the variation of composition and thickness of the formed phase was observed. It was from the experiment obtained that the addition of CeO$_2$into $Y_2$BaCuO$_{5}$ substrate and the initial particle size of doping material play important part in promoting the reaction between substrate and doping material.aterial.

• 한국기계가공학회지
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• 제3권1호
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• pp.15-21
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• 2004

The machining process of ceramics can be characterized by cracking and brittle fracture. In the machining of ceramics, edge chipping and crack propagation are the principal reasons to cause surface integrity deterioration. Such phenomenon can cause not only poor dimensional and geometric accuracy, but also possible failure of the ceramic parts. Thus, traditional ceramics are very difficult-to-cut materials. To overcome such problems, in this paper, h-BN powder, which gives good cutting property, is added for the fabrication of machinable ceramics by volume of 5, 10, 15, 20, 25 and 30%. The objectives of this paper is to evaluate the fracture phenomenon of the tungsten carbide tool and the variation of surface integrity of the manufactured machinable ceramics under various cutting conditions during end mill machining With CNC machining center.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권3호
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• pp.116-121
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• 2006

Most high-k materials are well known not to be etched easily, Some problems such as low etch rate poor sidewall angle, plasma damage, and process complexity were emerged from the high-density DRAM fabrication. Chemical mechanical polishing (CMP) by a damascene process was proposed to pattern this high-k material was polished with some commercial silica slurry as a function of pH variation. Sufficient removal rate with adequate selectivity to realize the pattern mask of tera-ethyl ortho-silicate (TEOS) film for the vertical sidewall angle were obtained. The changes of X-ray diffraction pattern and dielectric constant by CMP process were negligible. The planarization was also achieved for the subsequent multi-level processes. Our new CMP approach will provide a guideline for effective patterning of high-k material by CMP technique.