• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.7
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• pp.448-451
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• 2014

Anodic aluminum oxides (AAO) fabricated by the two-step anodizing process have attracted much attention for the fabrication of nano template because of pore structure with high aspect ratio, low cost process and ease of fabrication. AAOs are characterized by a homogeneous morphology of parallel pores that grow perpendicular to the template surface with a narrow distribution of diameter, length and inter-pores spacing, all of which can be easily controlled by suitably choosing of the anodizing parameters such as pH of the electrolyte, anodizing voltage and duration of anodizing. In this study, AAO templates were characterized by X-ray diffraction and field-emission scanning electron microscope (FE-SEM). The dependence of the pore size change according to the amount of addition of phosphoric acid, which was used to remove the initial alumina oxide layer, was not observed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.108-111
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• 2007

It's important to measure quantitative properties about thermal-nano variation conduct of polymer for producing high quality components using NIL process. NanoScale indents can be used ad cells for molecular electronics and drug deliver, slots for integration into nanodevices, and defects for tailoring the structure and properties. In this study, it's to evaluate mechanical characteristic of polymer such as PMMA and PC at high temperature for manufacture of nano/micro size of polymer using indenter at high temperature. At high temperature mechanical properties of polymer have extreme variation. Because heating the polymer, it becomes softer than room temperature. In this case it is especially important to study for mechanical properties of polymer at high temperature.

• Journal of Korean Institute of Industrial Engineers
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• v.29 no.2
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• pp.179-189
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• 2003

Gate poly-silicon critical dimension is a prime characteristic of a metal-oxide-semiconductor field effect transistor. It is important to achieve the uniformity of gate poly-silicon critical dimension in order that a semiconductor device has acceptable electrical test characteristics as well as a semiconductor wafer fabrication process has a competitive net-die-per-wafer yield. However, on gate poly-silicon critical dimension, the complexity associated with a semiconductor wafer fabrication process entails hierarchical variance components according to run-to-run, wafer-to-wafer and even die-to-die production unit changes. Specifically, estimates of the hierarchical variance components are required not only for disclosing dominant sources of the variation but also for testing the wafer-level uniformity. In this paper, two experimental designs, a two-stage nested design and a randomized complete block design are considered in order to estimate the hierarchical variance components. Since gate poly-silicon critical dimensions are collected from fixed die positions within wafers, a factor representing die positions can be regarded as fixed in linear statistical models for the designs. In this context, the two-stage nested design also checks the wafer-level uniformity taking all sampled runs into account. In more detail, using variance estimates derived from randomized complete block designs, Duncan's multiple range test examines the wafer-level uniformity for each run. Consequently, a framework presented in this study could provide guidelines to practitioners on estimating the hierarchical variance components and testing the wafer-level uniformity in parallel for any characteristics concerned in semiconductor wafer fabrication processes. Statistical analysis is illustrated for an experimental dataset from a real pilot semiconductor wafer fabrication process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.866-869
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• 2000

The finishing process for die is an important process because it has influence on final quality of products. And it is difficult to automatize finishing process so that the process has depended on expert's skill until now. However, recently a study on development of die automatic finishing machine has been progressed, and actually this machine is applied to fabrication of die. But die automatic finishing machine has the problems such as low supply rate and high machine price. In this paper 3-axis machine was applied to the die finishing. And to improve form accuracy of die finishing path was regenerated. The finishing path considered tilting of finishing tool. and variation of machining force with contacting point between finishing and workpiece.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.1
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• pp.94-100
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• 2001

Distortion is a potential problem with all welded fabrication and should be caused dimensional changes and mismatch of joints during welding fabrication. Correction unacceptable weld distortion is extremely costly and in some case impossible. The aim of the present work is to verify the variation of the compressive force, tensile force and distortion during plastic deformation under Tungsten-inert-gas(TIG) welding, on type 304 stainless steel. Experimental results show that possibili-ty if measuring deformation during welding and good correlation was found between analytical and experimental result ad finite element methods have been used to model temperature analysis.

• Journal of the Korean Institute of Telematics and Electronics
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• v.23 no.6
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• pp.923-928
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• 1986

This paper describes the design and fabrication of a high performance digital tuning analog component integrated circuit that contains a television station detector and decoders(H and L types). When the comparator level sampling method is used, this integrated circuit can be used as a stable channel selector for an external circuit with very large signal variation. It has been fabricated using the SST bipolar standard process and its chip size is 2.2x2.1mm\ulcorner As a result, we have succeeded in fabricating the IC that satisfies the D.C characteristics, and the channel station detector and decoder function.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.695-698
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• 2002

Induction heating process is one of the most efficient heating process in terms of temperature control accuracy and heating time saving. In the past study, fabrication process of cellular 6061 alloys by powder metallurgical route and induction heating process was studied. To supplement the framing conditions that studied in past study, effect of induction heating capacity and holding time at foaming temperature were investigated. Under the achieved framing conditions, teamed 6061 alloys were fabricated for variation of foaming temperature, and porosities(%)-foaming temperature curves were obtained by try-error experimental method. Uniaxial compression tests were performed to investigate the relationship between porosities(%) and stress-strain curves of framed 6061 alloy. Also, energy absorption capacity and efficiency were calculated from stress-strain curves to investigated. Moreover, dependence of plateau stress on strain rate was investigated in case of cellular 6061 alloy with low porosities(%)

• Journal of Powder Materials
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• v.9 no.5
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• pp.329-335
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• 2002

Recently, the fabrication process of the W-Cu nanocomposite powders has been studied to improve the sinterability through the mechanical alloying and reduction of W and Cu oxide mixtures. In this study. the W-Cu composites were produced by mechanochemical process (MCP) using $WO_3-CuO$ mixtures with two different milling types of low and high energy, respectively. These ball-milled mixtures were reduced in $H_2$ atmosphere. The ball-milled and reduced powders were analyzed through XRD, SEM and TEM. The fine W-Cu powder could be obtained by the high energy ball-milling (HM) compared with the large Cu-cored structure powder by the low energy ball-milling (LM). After the HM for 20h, the W grain size of the reduced W-Cu powder was about 20-30 nm.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.10
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• pp.1754-1761
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• 2003

The atomic force microscopy (AFM) based lithographic technique has been used directly to machine material surface and fabricate nano components in MEMS (micro electro mechanical system). In this paper, three-dimensional molecular dynamics (MD) simulations have been conducted to evaluate the characteristic of deformation process at atomistic scale for nano-lithography process. Effects of specific combinations of crystal orientations and cutting directions on the nature of atomistic deformation were investigated. The interatomic force between diamond tool and workpiece of copper material was assumed to be derived from the Morse potential function. The variation of tool geometry and cutting depth was also evaluated and the effect on machinability was investigated. The result of the simulation shows that crystal plane and cutting direction significantly influenced the variation of the cutting forces and the nature of deformation ahead of the tool as well as the surface deformation of the machined surface.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.4
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• pp.137-141
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• 2004

In this paper, a thermopneumatic PMDS (polydimethlysiloxane) micropump with nozzle/diffuser elements is presented. The micropump is composed of nozzle/diffuser elements as dynamic valves, an actuator consisting of a circular PDMS diaphragm and a Cr/Au heater on a glass substrate. Four PDMS layers are used for fabrication of an actuator chamber, actuator diaphragm by a spin coating process, spacer layer, and nozzle/diffuser by the SU-8 molding process. The radius and thickness of the actuator diaphragm is 2 mm and 30 ${\mu}{\textrm}{m}$, respectively. The length and the conical angle of the nozzle/diffuser elements are 3.5 mm and 20$^{\circ}$, respectively. The actuator diaphragm is driven by the air cavity pressure variation caused by ohmic heating and natural cooling. The flow rate of the micropump in the frequency domain is measured for various duty cycles of the square wave input voltage. When the square wave input voltage of 5 V DC is applied to the heater, the maximum flow rate of the micropump is 44.6 ${mu}ell$/min at 100 Hz with a duty ratio of 80% under the zero pressure difference.