• 제목/요약/키워드: Fabrication process

검색결과 4,343건 처리시간 0.034초

자동차 금형 생산공정의 물류분석 (Performance Analysis of a Die FAbrication Process In Automotive Production)

  • 김상훈
    • 한국시뮬레이션학회:학술대회논문집
    • /
    • 한국시뮬레이션학회 1998년도 추계학술대회 및 정기총회
    • /
    • pp.36-40
    • /
    • 1998
  • Tool shop of the‘D’Motor Co.(DMC) fabricates dies for producing automotive press panels. In order to increase the production capacity of the tool shop, DMC established an FMS that consists of high-speed machines and a CMM at the tool shop in 1997. Due to the difference in machine capability among the existing machines and the new FMS it is needed to find an optimal way of allocating workloads among machines to maximize the production. In a way to solve this, we model the die fabrication process of the tool shop and analyze its performance by computer simulation. In this study, we at first identify the bottleneck processes of the die fabrication process under the current operation policy. Then, we derive some alternative operating policies applicable to the tool shop, and analyze the optimal operation policy by comparing the performance of the tool shop following each alternative policy.

  • PDF

화합물 반도체 공장의 통합생산시스템 설계에 관한 연구 (A Design of Integrated Manufacturing System for Compound Semiconductor Fabrication)

  • 이승우;박지훈;이화기
    • 산업경영시스템학회지
    • /
    • 제26권3호
    • /
    • pp.67-73
    • /
    • 2003
  • Manufacturing technologies of compound semiconductor are similar to the process of memory device, but management technology of manufacturing process for compound semiconductor is not enough developed. Semiconductor manufacturing environment also has been emerged as mass customization and open foundry service so integrated manufacturing system is needed. In this study we design the integrated manufacturing system for compound semiconductor fabrication t hat has monitoring of process, reduction of lead-time, obedience of due-dates and so on. This study presents integrated manufacturing system having database system that based on web and data acquisition system. And we will implement them in the actual compound semiconductor fabrication.

마이크로 광 조형 기술을 이용하여 미세 유체 시스템을 개발하기 위한 가상 조립 공정의 개발 (Development of Virtual Assembly Process for the Fabrication of Micro-fluidic Systems Using Micro-stereolithography Technology)

  • 강현욱;이인환;조동우
    • 한국공작기계학회:학술대회논문집
    • /
    • 한국공작기계학회 2004년도 춘계학술대회 논문집
    • /
    • pp.304-309
    • /
    • 2004
  • As it is difficult to construct a micro-fluidic system composed of micro-mixers, micro-channels and/or micro-chambers in a single process, an assembly process is typically used. The assembling and bonding of micro-parts, however, introduces other problems. In this work, a virtual assembly process was developed that can be used to design various micro-fluidic systems before actual fabrication commences. In the process, the information required for the micro-stereolithography process is generated automatically. Consequently, complex micro-fluidic systems can be fabricated in a single process, thereby avoiding the need for additional assembly or bonding processes. Using the developed process, several examples were fabricated.

  • PDF

Design and Fabrication of a Low-cost Wafer-level Packaging for RF Devices

  • Lim, Jae-Hwan;Ryu, Jee-Youl;Choi, Hyun-Jin;Choi, Woo-Chang
    • Transactions on Electrical and Electronic Materials
    • /
    • 제15권2호
    • /
    • pp.91-95
    • /
    • 2014
  • This paper presents the structure and process technology of simple and low-cost wafer-level packaging (WLP) for thin film radio frequency (RF) devices. Low-cost practical micromachining processes were proposed as an alternative to high-cost processes, such as silicon deep reactive ion etching (DRIE) or electro-plating, in order to reduce the fabrication cost. Gold (Au)/Tin (Sn) alloy was utilized as the solder material for bonding and hermetic sealing. The small size fabricated WLP of $1.04{\times}1.04{\times}0.4mm^3$ had an average shear strength of 10.425 $kg/mm^2$, and the leakage rate of all chips was lower than $1.2{\times}10^{-5}$ atm.cc/sec. These results met Military Standards 883F (MIL-STD-883F). As the newly proposed WLP structure is simple, and its process technology is inexpensive, the fabricated WLP is a good candidate for thin film type RF devices.

레이저 소결 적층 시스템과 실험 계획법을 이용한 3차원 바이오 세라믹 인공지지체의 제작 (Fabrication of 3D Bioceramic Scaffolds using Laser Sintering Deposition System and Design of Experiment)

  • 이창희;사민우;김종영
    • 한국기계가공학회지
    • /
    • 제18권12호
    • /
    • pp.59-66
    • /
    • 2019
  • In this study, we developed a novel laser sintering deposition system (LSDS) based on solid free-form fabrication (SFF) technology as it has the potential to fabricate complex geometries with controllable architecture for bone tissue engineering applications. The 3D biphasic calcium phosphate (BCP) scaffolds were fabricated with a pore size of 800㎛, a line width and height of 1000㎛, and an overall size of 8.2×8.2×8.0 mm3 according to the design of experiment (DOE) results. Additionally, an optimized manufacturing process using response surface analysis was established to fabricate 3D BCP scaffolds. The fabricated 3D BCP scaffolds were sintered at 950℃, 1050℃, 1150℃, and 1250℃ according to sintering processes with a furnace. As the sintering temperature increased, the porosity increased. Through the compressive strength test, the 3D BCP scaffolds sintered at 1050℃ presented good results of about 0.76 MPa. These results suggest that fabrication methods for 3D bioceramic scaffolds using LSDS may meet the basic requirements for bone tissue engineering.

Inductively coupled plasma etching of SnO2 as a new absorber material for EUVL binary mask

  • 이수진
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2010년도 제39회 하계학술대회 초록집
    • /
    • pp.124-124
    • /
    • 2010
  • Currently, extreme ultraviolet lithography (EUVL) is being investigated for next generation lithography. EUVL is one of competitive lithographic technologies for sub-22nm fabrication of nano-scale Si devices that can possibly replace the conventional photolithography used to make today's microcircuits. Among the core EUVL technologies, mask fabrication is of considerable importance due to the use of new reflective optics having a completely different configuration compared to those of conventional photolithography. Therefore, new materials and new mask fabrication process are required for high performance EUVL mask fabrication. This study investigated the etching properties of SnO2 (Tin Oxide) as a new absorber material for EUVL binary mask. The EUVL mask structure used for etching is SnO2 (absorber layer) / Ru (capping / etch stop layer) / Mo-Si multilayer (reflective layer) / Si (substrate). Since the Ru etch stop layer should not be etched, infinitely high selectivity of SnO2 layer to Ru ESL is required. To obtain infinitely high etch selectivity and very low LER (line edge roughness) values, etch parameters of gas flow ratio, top electrode power, dc self - bias voltage (Vdc), and etch time were varied in inductively coupled Cl2/Ar plasmas. For certain process window, infinitely high etch selectivity of SnO2 to Ru ESL could be obtained by optimizing the process parameters. Etch characteristics were measured by on scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) analyses. Detailed mechanisms for ultra-high etch selectivity will be discussed.

  • PDF

Small Form Factor 광 디스크 드라이브용 초소형 집적형 광픽업 개발 (Development of Integrated Optical Pickup for Small Form Factor Optical Disc Drive)

  • 조은형;손진승;이명복;서성동;김해성;강성묵;박노철;박영필
    • 정보저장시스템학회논문집
    • /
    • 제2권3호
    • /
    • pp.163-168
    • /
    • 2006
  • Small form factor optical pickup (SFFOP) corresponding to BD specifications is strongly proposed for the next-generation portable storage device. In order to generate SFFOP, small sized optical pickup has been fabricated. We have developed a small sited optical pickup that is called the integrated optical pickup (IOP). The fabrication method of this system is mainly dependant on the use of the wafer based micro fabrication technology, which has been used in MEMS process such as photolithography, reactive ion etching, wafer bonding, and packaging process. This approach has the merits for mass production and high assembling accuracy. In this study, to generate the small sized optical pickup for high recording capacity, IOP corresponding to BD specifications has been designed and developed, including three main parts, 1) design, fabrication and evaluation of objective lens unit, 2) design and fabrication of IOP and 3) evaluation process of FES and TES.

  • PDF

Production automation system for three-dimensional template pieces used to evaluate shell plate completeness

  • Son, Seunghyeok;Kim, Byeongseop;Ryu, Cheolho;Hwang, Inhyuck;Jung, ChangHwan;Shin, Jong-Gye
    • International Journal of Naval Architecture and Ocean Engineering
    • /
    • 제12권1호
    • /
    • pp.116-128
    • /
    • 2020
  • In the shipbuilding industry, three-dimensional (3D) templates play a key role in the completeness evaluation of shell plates with a large curvature in the shell-plate fabrication process. Currently, the information of 3D templates from a ship computer-aided design system is limited; thus, manufacturers depend on their experience to produce the templates manually. This results in the inaccuracy of templates in addition to increased production time. Therefore, if the pieces of the 3D templates can be produced automatically with accurate information, the lead time of the fabrication process can be reduced. In this study, we define a new type of template piece and develop methods for extending a boundary template and converting manufacturing information into numerical control machine input. In addition, based on the results of the study, we propose a production automation system for 3D template pieces. This system is expected to reduce the lead time of the fabrication process.

MEA 제조 방법에 따른 상대습도 변화가 PEMFC 내구성에 미치는 영향 (Effect of various MEA fabrication methods on the PEMFC durability testing at high and low humidity conditions)

  • 김근호
    • 한국신재생에너지학회:학술대회논문집
    • /
    • 한국신재생에너지학회 2010년도 추계학술대회 초록집
    • /
    • pp.86.2-86.2
    • /
    • 2010
  • In order to improve polymer electrolyte membrane fuel cell (PEMFC) durability, the durability of membrane electrode assemblies (MEA), in which the electrochemical reactions actually occur, is one of the vital issues. Many articles have dealt with catalyst layer degradation of the durability-related factors on MEAs in relation to loss of catalyst surface area caused by agglomeration, dissolution, migration, formation of metal complexes and oxides, and/or instability of the carbon support. Degradation of catalyst layer during long-term operation includes cracking or delamination of the layer which result either from change in the catalyst microstructure or loss of electronic or ionic contact with the active surface, can result in apparent activity loss in the catalyst layer. Membrane degradation of the durability-related factors on MEAs can be caused by mechanical or thermal stress resulting in formation of pinholes and tears and/or by chemical attack of hydrogen peroxide radicals formed during the electrochemical reactions. All of these effects, the mechanical damage of membrane and degradation of catalyst layers are more facilitated by uneven stress or improper MEA fabrication process. In order to improve the PEMFC durability, therefore, it is most important to minimize the uneven stress or improper MEA fabrication process in the course of the fabrication of MEA. We analyzed the effects of the MEA fabrication condition on the PEMFC durability with MEA produced using CCM (catalyst coated membrane) method. This paper also investigated the effects of MEA fabrication condition on the PEMFC durability by adding additional treatment process, hot pressing and pressing, on the MEA produced using CCM method.

  • PDF

롤투롤 임프린트 공정 중 균일한 레진 코팅을 위한 닥터블레이드형 디스펜서 설계 및 제작 (Design and Fabrication of Doctor Blade Type Dispensers for Uniform Resin Coating during Roll to Roll Imprinting Process)

  • 손희철;김성우;이지훈;박철우;곽문규
    • 한국정밀공학회지
    • /
    • 제32권10호
    • /
    • pp.897-902
    • /
    • 2015
  • This study reports on a uniform resin coating method by using a doctor blade type dispenser. For high productivity, continuous imprint-lithography has been studied, and developed fabrication systems are used in several applications such as anti-reflection films, dry adhesives, and water collecting surfaces. In the continuous fabrication field, researchers have typically focused on patterning and demolding procedures. During the roll-to-roll fabrication process, however, the uniform resin coating process is also important in order to obtain a high quality product, which can be evaluated by uniform thickness, precise geometric expressions, and a thin residual layer. To achieve these, a doctor blade type dispenser was designed and fabricated. As a result, thickness of coated resin was well controlled by modulating the flow rate of the resin and blading gap. In addition, a very thin layer coating process (${\sim}10{\mu}m$) was achieved by softly contacting the blade on the substrate.