• Transactions on Electrical and Electronic Materials
• /
• 제15권2호
• /
• pp.69-72
• /
• 2014

White LEDs, based on blue LED chips coated with a yellow emitting phosphor (YAG:Ce), have several disadvantages. In this paper, we report the improvement in CRI [Color Rendition Index] using $GdAl_5O_{12}:Ce$ (GdAG:Ce) and related phosphors for blue LEDs. A modified combustion synthesis route using mixed fuel was used for synthesis route. By using this procedure, we formed the desired compounds in a single step. LEDs were then fabricated by coating the blue LED chips (CREE 470 nm, 300 micron) with the GdAG:Ce phosphor dispersed in epoxy resin. The CRI typically between 65~70 for the YAG:Ce based LED was improved to 87 for LEDs fabricated from the Gd(Al,Ga)G phosphors.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 2001년도 추계학술대회(한국공작기계학회)
• /
• pp.75-79
• /
• 2001

In the recent years, as the research and the development of micro and precision machinery become active, the interest of micro actuators using SMA(Shape Memory Alloy) has been increased. The dynamic characteristic analysis of SMA is necessary for actuator application and many common researches report the material characteristics of SMA sufficiently. However, the research on dynamic characteristics is very deficient. In this paper, the helical spring are fabricated with NiTi SMA wire of high resistivity, The force, response speed, temperature, and displacement are measured by digital force gauge, infrared thermometer, and laser displacement sensor so that the dynamic characteristics of this SMA is analyzed. Also, bidirectional actuator was fabricated and experimented for its performance.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 하계학술대회 논문집
• /
• pp.127-130
• /
• 2001

Si thin films on p-type (100) Si substrate have been fabricated by pulsed laser deposition technique using a Nd:YAG laser. The pressure of the environmental gas during deposition was 1 Torr. After deposition, Si thin film has been annealed again at 400-840$^{\circ}C$ in nitrogen ambient. Strong blue photoluminescence (PL) have been observed at room temperature. We report the PL properties of Si thin films depending on the variation of the annealing temperature.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 2003년도 추계학술대회
• /
• pp.47-52
• /
• 2003

In the recent years, as the research and the development of micro and precision machinery become active, the interest of micro actuators using SMA(Shape Memory Alloy) has been increased. The dynamic characteristic analysis of SMA is necessary for actuator application and many common researches report the material characteristics of SMA sufficiently. However, the research on dynamic characteristics is very deficient. In this paper, the helical spring are fabricated with NiTi SMA wire of high resistivity. The force, response speed, temperature, and displacement are measured by digital force gauge, infrared thermometer, and laser displacement sensor so that the dynamic characteristics of this SMA is analyzed. Also, bidirectional actuator was fabricated and experimented fir its performance.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 2003년도 춘계학술대회 논문집
• /
• pp.346-351
• /
• 2003

In the recent years, as the research and the development of micro and precision machinery become active, the interest of micro actuators using SMA(Shape Memory Alloy) has been increased. The dynamic characteristic analysis of SMA is necessary for actuator application and many common researches report the material characteristics of SMA sufficiently. However, the research on dynamic characteristics is very deficient. In this paper, the helical spring are fabricated with NiTi SMA wire of high resistivity. The force, response speed, temperature, and displacement are measured by digital force gauge, infrared thermometer, and laser displacement sensor so that the dynamic characteristics of this SMT is analyzed. Also, bidirectional actuator was fabricated and experimented for its performance

• 전자공학회논문지A
• /
• 제33A권6호
• /
• pp.164-171
• /
• 1996

We report the experimental resutls on AlGaAs/GaAs heterojunction bipolar transistors (HBTs) with carbon-doped base structure. To characterize the output power, load-pull mehtod was employed. By characterizing the devices with HP8510C, we extracted the small-signal equivalent circuit. The HBTs were fabricated employing wet mesa etching and lift-off process of ohmic metals. the implementation of polyimide into the fabriction process was accomplished to obtain the lower dielectric constant resultig in significant reduction of interconnect routing capacitance. The fabricated HBTs with an emitter area of 6${\times}14{\mu}m^{2}$ exhibited current gain of 45, BV$_{CEO}$ of 10V, cut-off frequency of 30GHz and power gain of 1 3dBm. To extract the small signal equivalent circuit, the de-embedded method was applied for parasitic parameters and the calculation of circuit equations for intrinsic parameters.

• 한국광학회지
• /
• 제10권6호
• /
• pp.494-499
• /
• 1999

전기적으로 굴절율 변조값을 조절할 수 있는 부피형 홀로그램 매질(HPDLC)을 제작하였다. HPDLC는 4가 acrylate monomer를 기초로 한 전폴리머(prepolymer)와 액정 혼합물 E7 등으로 구성되어져 있다. 제작된 매질의 광학적 특성을 조사하기 위해 액정 농도, 전기장의 세기에 따른 회전효율을 측정하고, 홀로그래피 방법으로 상을 기록한 후 재생된 상을 전기적으로 조절할 수 있음을 보였다.

• The Journal of Advanced Prosthodontics
• /
• 제8권4호
• /
• pp.329-332
• /
• 2016

Fabricating a surveyed prosthesis beneath an existing partial removable dental prosthesis (PRDP) is a challenging and time-consuming procedure. The computer-aided design/computer-assisted manufacturing (CAD/CAM) technology was applied to fabricate a retrofitted, surveyed zirconia prosthesis to an existing PRDP. CAD/CAM technology enabled precise and easy replication of the contour of the planned surveyed crown on the existing abutment tooth. This technology ensured excellent adaptation and fit of newly fabricated crown to the existing PRDP with minimal adjustments. In this case report, a seventy-year-old male patient presented with fractured existing surveyed crown. Because the existing PRDP was serviceable, new crown was fabricated to the existing PRDP.

• 한국전기전자재료학회논문지
• /
• 제16권12S호
• /
• pp.1237-1241
• /
• 2003

In this paper, we report a novel RF-MEMS packaging technology with lightweight, small size, and short electric path length. To achieve this goal, we used the ultra thin silicon substrate as a packaging substrate. The via holes lot vortical feed-through were fabricated on the thin silicon wafer by wet chemical processing. Then, via holes were filled and micro-bumps were fabricated by electroplating. The packaged RF device has a reflection loss under 22 〔㏈〕 and a insertion loss of -0.04∼-0.08 〔㏈〕. These measurements show that we could package the RF device without loss and interference by using the vertical feed-through. Specially, with the ultra thin silicon wafer we can realize of a device package that has low-cost, lightweight and small size. Also, we can extend a 3-D packaging structure by stacking assembled thin packages.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
• /
• pp.923-926
• /
• 2009

We fabricated large-area OLED lighting device using screen printing. In order to operate full area of large-area OLED uniformly, each cell in OLED panel was designed to work separately. We connected OLED panel with a PCB electrically using jig pins so that each cell could be operated individually. In this presentation, we report a few important issues on the fabrication of large-area OLED for lighting applications.