• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.1507-1512
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• 2009

Flow field in a roller conveyor system, induced from the movement of a cassette in which glasses for flat panel display are loaded, is numerically studied in this paper. Contamination on the glass surface by dust particles produced from mechanical friction between roller and cassette is predicted from the analysis results of flow fields. Results show that a large swirl flow is formed under the moving cassette with constant speed. This swirl flow is confined only under the cassette because two main streams from the backward and the fan filter unit on the top ceiling are sufficiently strong. Therefore, it can be said that possibility of the contamination by the particles originated from the friction is relatively low. It is also revealed that flow direction between glass plates is changed according to the speed of the cassette movement due to the shear force of glass plates.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.10
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• pp.1976-1981
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• 2009

Transparent conducting aluminum-doped zinc oxide (AZO) thin films were deposited on Coming glass substrate using an Gun-type rf magnetron sputtering deposition technology. The AZO thin films were fabricated with an AZO ceramic target (Zn: 98wt.%, $Al_2O_3$: 2wt.%). The AZO thin films were deposited with various growth conditions such as the substrate temperature, oxygen pressure. X -ray diffraction (XRD), UV/visible spectroscope, atomic force microscope (AFM), and Hall effect measurement system were done in order to investigate the properties of the AZO thin films Among the AZO thin films prepared in this study, the one formed at conditions of the substrate temperature $100^{\circ}C$, Ar 50 sccm, $O_2$ 5 sccm and working pressure 5 motor showed the best properties of an electrical resistivity of $1.763{\times}10^{-4}\;[{\Omega}{\cdot}cm]$, a carrier concentration of $1.801{\times}10^{21}\;[cm^{-3}]$, and a carrier mobility of $19.66\;[cm^2/V{\cdot}S]$, which indicates that it could be used as a transparent electrode for thin film transistor and flat panel display applications.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.7 s.184
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• pp.130-137
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• 2006

TFT-LCD(Thin Film Transistor Liquid Crystal Display) module is representative commercial product of FPD(Flat Panel Display). Thickness of TFT-LCD module is very thin. It is adopted for major display unit for IT devices such as Cellular Phone, Camcorder, Digital camera and etc. Due to the harsh user environment of mobile IT devices, it requires complicated structure and tight assembly. And user requirements for the mechanical functionalities of TFT-LCD module become more strict. However, TFT-LCD module is normally weak to high level transient mechanical shock. Since it uses thin crystallized panel. Therefore, anti-shock performance is classified as one of the most important design specifications. Traditionally, the product reliability against mechanical shock is confirmed by empirical method in the design-prototype-drop/impact test-redesign paradigm. The method is time-consuming and expensive process. It lacks scientific insight and quantitative evaluation. In this article, a systematic design evaluation of TFT-LCD module for mobile IT devices is presented with combinations of FEA and testing to support the optimal shock proof display design procedure.

• 한국경영정보학회:학술대회논문집
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• 2008.06a
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• pp.585-589
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• 2008

LCD (Liquid Crystal Display)는 디지털 기기의 주요 구성 요소이며, 모든 크기의 FPD (Flat Panel Display) 시장에서 지배적인 시장점유율을 보인다. 그러나 많은 전문가들은 LCD 산업이 수년 내에 OLED (Organic Light Emitting Diodes), 3차원 디스플레이, 플렉서블 디스플레이와 같은 차세대 디스플레이 기술의 강력한 도전에 직면할 것이라고 예상한다. 이러한 경쟁환경에서 LCD 산업이 살아남기 위한 방안으로 본 연구에서는 LCD 산업의 경쟁력의 원천을 밝혀내고, 이를 극대화하는 전략적 방향을 제시한다. 이를 위해 먼저 LCD 산업구조와 가치사슬을 분석하여 LCD 산업의 경쟁력을 제고하기 위한 기본적인 전략적 대안을 개발한다. 이 단계에서 얻어진 통찰력을 바탕으로, 인과지도(causal loop diagram)와 시스템 다이나믹스 (system dynamics) 방법론을 활용하여 기존의 LCD 산업구조에서 판매량, 시장점유율 및 이익 등의 핵심 지표에 가장 큰 영향을 미치는 구조적 특징을 규명한다. 또한, 여기서의 다이나믹스 모형을 바탕으로, LCD 제조업자의 관점에서 프로세스 역량을 극대화할 수 있는 전략적 대안을 모색한다.

• Journal of the Korean Institute of Gas
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• v.22 no.1
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• pp.78-85
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• 2018

In this study, we analyzed risks of the fabrication process equipment and cleanroom for semiconductor/flat panel display (FPD) manufacturing facilities and studied the fundamental safety measures for the risk factors. We examined the explosion proof design models considering the specificity of equipment and environment, and planned to utilize the findings to provide technical standards and grounds for designing and manufacturing related equipment. We believe that this study will contribute to the establishment of technical standards for semiconductor/FPD industry and businesses in many different ways by providing optimized modeling of high-risk explosion site detection, developing safety standards and hazard countermeasures and voluntary activation of safety certification system for operation of fabrication process equipment.

• Journal of IKEEE
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• v.23 no.1
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• pp.107-111
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• 2019

In FPD WET equipment, heaters are used a lot. There are many electric accidents caused by short circuit and overheating due to the use of heater, so it is necessary to have a safe electric system and interlock. Therefore, in this paper, we propose an electrical schematic and interlock for FPD WET equipment. In this paper, a hardware interlock such as a level sensor, an overheat protector, and an SSR heater sink is inserted, and the electric system is composed of ELB - MC - SSR - EOCR - heater. When the interlock occurs, the magnetic contactor (MC) is turned off and the power of the heater is cut off.EOCR, an electric overcurrent protection device, has an interlock to shut down the MC when there is an abnormality in the heater while checking the overcurrent, undercurrent and disconnection. These circuit configurations and interlocks are likely to be useful not only for WET equipment but also for any equipment in which the heater is placed.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1311-1312
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• 2008

차세대 대형 FPD(Flat Panel Display)로 각광받는 PDP(Plasma Display Panel)는 cost, 소비전력, 효율 등의 문제점이 있다. 본 연구에서는 저가격화를 실현하기 위하여 종래 사용되었던 투명전극인 ITO(Indium-Tin Oxide)전극 대신 금속(Ag) 전극만을 사용하여 공정을 간소화한 Fence 전극구조를 제안하였다. 그리고 소비전력의 감소와 효율의 향상을 위해 격벽쪽의 전극을 제거하여 방전경로상의 저항을 증가시켜 방전전류를 감소시키는 동시에 하전입자의 격벽손실을 줄이는 4-inch Test Panel을 제작하여 전기광학적 특성 실험을 하였다. 제안한 구조의 돌기길이를 변화시켜 방전개시전압, 휘도, 소비전력, 효율 등을 측정, 비교하여 power가 14%감소하여 효율을 11% 향상 시킬 수 있었다.

• Laser Solutions
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• v.14 no.2
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• pp.17-23
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• 2011

Active thin films are ubiquitous in the manufacture of all forms of flat panel display (FPD). One of the most widely employed thin films is indium tin oxide (ITO) and metal films used electrically conductive materials in display industries. ITO is widely used for fabrication of LCD, OLED device, and many kinds of optical applications because of transparency in visible range and its high conductivity and metal films are also widely employed as electrodes in various electric and display industries. It is important that removing specific area of layer, such as ITO or metal film on substrate, to fabricate and repair electrode in display industries. In this work, we demonstrate efficient selective ablation process to ITO and aluminum film on glass using a femtosecond laser (${\lambda}p=1025nm$) respectively. The femtosecond laser with wavelength of 1025nm, pulse duration of 400fs, and the repetition rate of 100kHz was used for selectively removing ITO and Al on glass in the air. We can successfully remove the ITO and Al films with various pulse energies using a femtosecond laser.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.544-547
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• 2006

In this study, the characteristics of large area internal linear ICP sources of $1,020mm{\times}920mm$ (substrate area is $880mm{\times}660mm$) were investigated using a multiple linear antennas with U-type parallel connection. Using the multiple linear antennas with U-type parallel connection, a high plasma density of $2{\times}10^{11}/cm^3$ and a high power transfer efficiency of about 88% could be obtained at 5kW of RF power and with 20mTorr Ar. A low plasma potential of less than 26V and a low electron temperature of $2.6{\sim}3.2eV$ could be also obtained. The measured plasma uniformity on the substrate size of 4th generation $(880mm{\times}660mm)$ was about 4%, therefore, it is believed that the multiple linear antennas with U-type parallel connection can be successfully applicable to the large area flat panel display processing.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.45-48
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• 2006

Effectiveness and its possibility of ELA (Excimer Laser Annealing) for advanced Si TFT system on insulator are described. Currently, extensive study is carried out to realize an advanced SoG (System on Glass) based on LTPS (Low Temperature Poly-Si) technique. By reducing further the process temperature and by improving the fabrication process of LTPS, addressing TFT circuits for FPD (Flat Panel Display) can be mounted onto a flexible plastic as well as onto a glass substrate. Functional devices on the insulating panels are developed to be formed by using ELA. Although technical issues are remained for the fabrication process, Si transistors including 3D TFT structure formed by ELA is expected as a functional Si system on insulator in the ubiquitous IT era.