• 제목/요약/키워드: FPC(Flexible printed circuit)

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2개의 헤드를 갖는 FPC 비전 정렬 장착기의 개발 (Development of FPC Vision Aligning Mounter with Two Picker Heads)

  • 신동원
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.390-393
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    • 2005
  • he FPCs(Flexible Printed Circuit) are currently used in several electronic products like digital cameras, cellular phones because of flexible material characteristics. Because the FPC is usually small size and flexible, only one FPC should not enter chip mounting process, instead, several FPCs is placed on the large rigid pallette and go to the chip mounting process. Currently the job of mounting FPC on the pallette is carried by totally manual way. Thus, the goals of the research is develop the automatic machine of FPC mounting on pallette using vision alignment. The procedure of operating machine is firstly to measure alignment error of FPC, correct alignment errors, and finally mount well-aligned FPC on the pallette. The vision technology is used to measure alignment error accurately, and precision motion control is used in correcting errors nd mounting FPC. The two picker heads handling two FPC together is used to increase the productivity.

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머신비전을 이용한 FPC의 자동정렬 및 장착 (Automatic Alignment and Mounting of FPCs Using Machine Vision)

  • 신동원
    • 한국기계가공학회지
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    • 제6권3호
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    • pp.24-30
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    • 2007
  • The FPCs(Flexible Printed Circuit) are currently used in several electronic products like digital cameras, cellular phones because of flexible material characteristics. Because the FPC is usually small size and flexible, only one FPC should not enter chip mounting process, instead, several FPCs are placed on the large rigid pallette and enter into the chip mounting process. Currently the job of mounting FPC on the pallette is carried by totally manual way. Thus, the goals of the research is develop the automatic machine of FPC mounting on pallette using vision alignment. Instead of using two cameras or using moving one camera, the proposed vision system with only one fixed camera is adopted. Moreover, the two picker heads which can handle two FPCs simultaneously are used to make process time shortened. The procedure of operation is firstly to measure alignment error of FPC, correct alignment errors, and finally mount well-aligned FPC on the pallette. The vision technology is used to measure alignment error accurately, and precision motion control is used in correcting errors and mounting FPC.

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비전을 이용한 FPC 필름용 자동펀칭 시스템 (Automatic Punching System using Machine Vision for FPC)

  • 이성철;이영춘;김성민;심기중
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.976-979
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    • 2005
  • This paper is about the development of automatic FPC(flexible printed circuit) punching instrument for the improvement of working condition and cost saving. FPC is used to detect the contact position of keyboard and button like a cellular phone. Depending on the quality of the printed ink and position of reference punching point to the FPC, the resistance and current are varied to the malfunctioning values. The size of reference punching point is 2mm and the above. Because the punching operation Is done manually, the accuracy of the punching degree is varied with operator's condition. To improve this manual punch ing operation to the FPC, automatic FPC punching system is introduced. Test algorithms and programs showed good results to the designed automatic punching system and led to the increasement of productivity and huge cost down to law material like FPC by avoiding bad quality.

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비전 기반의 FPC용 자동 펀칭시스템 (Automatic Punching System for FPC using Machine Vision)

  • 이영춘;이성철
    • 한국정밀공학회지
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    • 제22권12호
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    • pp.77-86
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    • 2005
  • This paper is about the development of Automatic FPC(flexible printed circuit) punching instrument for the improvement of working condition and cost saving. FPC is used to detect the contact position of keyboard and button like a cellular phone. Depending on the quality of the printed ink and position of reference punching point to the FPC, the resistance and current are varied to the malfunctioning values. The size of reference punching point is 2mm and the above. Because the punching operation is done manually, The punching accuracy is varied with operator's condition. Recently, The punching accuracy has deteriorated severely to the 2mm punching reference hall so that assembly of the K/B has hardly done. To improve this manual punching operation to the FPC, automatic FPC punching system is introduced. Precise mechanical parts like a 5-step stepping motor and ball screw mechanism are designed and tested and low cost PC camera is used fur the sake of cost down instead of using high quality vision systems for the factory automation. Test algorithms and programs showed good results to the designed automatic punching system and led to the increasement of productivity and huge cost down to law material like FPC by avoiding bad quality.

비전을 이용한 펀칭위치 제어 시스템 (Punching Position Control by Vision System)

  • 이성철;이영춘;심기중
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 추계학술대회 논문집
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    • pp.981-984
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    • 2004
  • This paper is about the development of Automatic FPC punching instrument. FPC(flexible printed circuit) is used to detect the contact position of K/B and button like a cellular phone. Depending on the quality of the printed ink and position of reference punching point to the FPC, the resistance and current are varied to the malfunctioning values. The size of reference punching point is 2mm and the above. Because the punching operation is done manually, the accuracy of the punching degree is varied with operator's condition. Recently, The punching accuracy has deteriorated severely to the 2mm punching reference hall so that assembly of the K/B has hardly done. To improve this manual punching operation to the FPC, automatic FPC punching system is introduced. Precise mechanical parts like a 5-step stepping motor and ball screw mechanism are designed and tested and low cost PC camera is used for the sake of cost down instead of using high quality vision systems for the FA. Test algorithm shows good results to the designed automatic punching system.

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MEMS 기술과 유연인쇄회로기판 기술을 이용한 단일지점 검침 심전도 센서 (One point detection electrocardiography sensor using MEMS and flexible printed circuit technology)

  • 김홍래;이충일;이충근;이명호;김현준;최의중;김용준
    • 센서학회지
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    • 제18권5호
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    • pp.359-364
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    • 2009
  • This paper presents flexible electrocardiography(ECG) sensors using micro electro mechanical systems(MEMS) and flexible printed circuit(FPC) technology. By using FPC technology, ECG sensors which consisted of an outer hook-shaped electrode and an inner circular-shaped electrode were fabricated on the polyimide substrate. Thereafter, the bipolar ECG sensor was miniaturized using MEMS technology. The ECG measurement capability was examined by attaching the sensor to the human chest and wrist. Performance of the proposed sensors was then compared with ECG measured by commercial Ag/AgCl electrodes. It was verified that ECG could be measured using proposed sensors at only single body.

다기능 케이블을 위한 연성 회로 기판에 내장된 공통 모드 필터 (Common Mode Filter Embedded in Flexible Printed Circuit Board for Multi-Function Cable)

  • 변진도;정상운;이근형;이해영
    • 한국전자파학회논문지
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    • 제19권3호
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    • pp.343-351
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    • 2008
  • 본 논문에서는 FPC(Flexible Printed Circuit) 케이블에 적층된 나선형 인덕터를 내장하여 다기능 케이블을 위한 공통 모드 필터를 제안하였다. 공통 모드 필터가 내장된 FPC 케이블은 별도의 SMD(Surface Mounted Device) 필터 없이 연성 케이블과 공통 모드 차단 특성을 가짐으로서, 다기능 케이블이라는 새로운 개념을 제시한다. 내장된 공통 모드 필터는 광대역의 공통 모드 차단 대역을 가지고 손실이 큰 페라이트와 같은 자성 물질을 사용하지 않아 차동 모드 삽입 손실 및 반사 손실이 향상되었다. 3-turn 인덕터를 가진 공통 모드 필터는 공통 모드차단 대역이 $0.4{\sim}3.12GHz$이며, 페라이트를 적용한 상용 LTCC(Low Temperature Co-fire Ceramic) 공통 모드 필터에 비해 3 GHz에서 1.95 dB, 8 GHz에서 6.97 dB의 향상된 차동 모드 삽입 손실을 갖는다.

Development of an Array-Type Flexible Tactile Sensor Using PVDF and Flexible Circuitry

  • Kwon, Tae-Kyu;Yu, Kee-Ho;Yun, Myung-Jong;Lee, Seong-Cheol
    • 센서학회지
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    • 제11권4호
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    • pp.200-208
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    • 2002
  • This paper represents the development of an array-type flexible tactile sensor using PVDF(polyvinylidene fluoride) film and flexible circuitry. The tactile sensor which has $8{\times}8$ taxels is made by using PVDF film and FPC(flexible printed circuit) technique. Experimental results on static and dynamic properties are obtained by applying arbitrary forces and frequencies generated by the shaker. In the static characteristics, the threshold and the linearity of the sensor are investigated. Also dynamic response of the sensor subjected to the variable frequencies is examined. The signals of a contact force to the tactile sensor are sensed and processed in the DSP system in which the signals are digitalized and filtered. Finally, the signals are integrated for taking the force profile. The processed signals of the outputs of the sensor are visualized on a personal computer, the shape and force distribution of the contacted object are obtained using two and three-dimensional image in real time. The reasonable performance for the detection of contact state is verified through the experiment.

Process Optimization for Flexible Printed Circuit Board Assembly Manufacturing

  • Hong, Sang-Jeen;Kim, Hee-Yeon;Han, Seung-Soo
    • Transactions on Electrical and Electronic Materials
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    • 제13권3호
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    • pp.129-135
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    • 2012
  • A number of surface mount technology (SMT) process variables including land design are considered for minimizing tombstone defect in flexible printed circuit assembly in high volume manufacturing. As SMT chip components have been reduced over the past years with their weights in milligrams, the torque that once helped self-centering of chips, gears to tombstone defects. In this paper, we have investigated the correlation of the assembly process variables with respect to the tombstone defect by employing statistically designed experiment. After the statistical analysis is performed, we have setup hypotheses for the root causes of tombstone defect and derived main effects and interactions of the process parameters affecting the hypothesis. Based on the designed experiments, statistical analysis was performed to investigate significant process variable for the purpose of process control in flexible printed circuit manufacturing area. Finally, we provide beneficial suggestions for find-pitch PCB design, screen printing process, chip-mounting process, and reflow process to minimize the tombstone defects.

리페어 FPC 본더 개발 (Development of Repair FPC Bonder)

  • 안정우;서지원
    • 반도체디스플레이기술학회지
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    • 제4권4호
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    • pp.27-31
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    • 2005
  • This article contains the development of FPC bonder that used for repair or trial product. Nowadays, in FPO module process (including PDP) accept the thermo-compress bonding method when attach FPC(Flexible Printed Circuit Board), TCP(Tape Carrier Package) and COF(Chip on the FPC) by ACF(Anisotropic Conductive Film). This system consists of ACF attachment part, pre-bonding part, main bonding part, loading / unloading part. This composition is a stand-alone system, not an in-line system. Hereafter, this composition should be developing into in-line system in all area of FPD industry.

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