• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.4
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• pp.275-280
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• 1999

The glass-to-glass electrostatic bonding process in vacuum environment was developed and the tubeless-packaged FED was fabricated based on the bonding process. The fabricated tubeless-packaged FED showed stable field emission characteristics and potential applicability to the FED tubeless packaging and vacuum in-line sealing.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.5
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• pp.29-35
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• 2009

Field emission displays(FED) are currently being study as a potential flat technology. The purpose of this project shows the research result of vacuum packaging technology for the development of FED. For FED vacuum packaging, the bonding of glass/glass, the exhaust of vacuum and getter technology have been studied for vacuum packaging technology The simulation and vacuum sealing, and glass/glass bonding are also extensively studied. The glass/glass bonding is formed by using the frit glass and the Inside pressure of complete panel showed of $2{\times}10^{-5}$[Torr]. As a getter result, the increase of pressure has been showed the decrease of outgassing effect by using thin film getter.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.103-106
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• 1999

In this paper, we suggest the FED packaging technology that have 4mm thickness, using sodalime glass-to-sodalime glass electrostatic bonding. It based on conventional silicon-glass bonding. The silicon film was deposited an around the exhausting hole on FED backside panel. And then, the silicon film of panel was successfully bonded with capping(bare) glass in vacuum environment and the FED panel was vacuum-sealed. In this method, we could achieve more 153 times increased conductance and 200 times increased vacuum efficiency than conventional tube packaging method. The vacuum level in panel, by SRG test, was maintained about low 10$_{-4}$ Torr during above two months And, the light emission was observed to 0.7-inch tubeless packaged FED. Then anode current was 34 $\mu$ A. Emission stability was constantly measured for 10 days.

• The monthly packaging world
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• s.230
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• pp.77-81
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• 2012

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.11a
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• pp.39-42
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• 1999

• The Journal of Economics, Marketing and Management
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• v.3 no.4
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• pp.21-27
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• 2015

With the recent increasing interest in sustainability management, the latest environmental report tends to be substituted by the expanded sustainability management report. In this work, I would like to introduce the management pattern of a global enterprise that values environmental soundness (environmental friendly) and implements eco-friendly measures. The enterprise chosen in this study is FedEx. In this article, FedEx case is presented how companies can adopt environmental friendly management in their businesses. FedEx has maintained an eco-friendly management since the introduction of the company's eco-friendly transport trucks in 2003, following its development in 2000. In 2005, it installed a solar power plant that can supply up to 80% of the electricity consumed by Oakland Logistics Center in California, USA. FedEx has published the "Global Enterprise Citizenship Report," which contains its business developments in 2009. FedEx has worked hard to minimize the influence caused by packaging of goods to the environment and appealed to customers to use recycled products as much as they can. FedEx also encourages customers to use packaging materials efficiently. A considerable amount of energy has been expended in the eco-friendly programs of FedEx. Although thousands of FedEx vehicles and aircraft operate daily with using large amounts of electricity and fuel, FedEx focuses on energy savings and global environment protection.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.61-61
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• 1999

• Information Display
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• v.2 no.3
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• pp.73-82
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• 2001

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.9
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• pp.656-661
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• 1999

As a fundamental study for FED tubeless packaging, sodalime-sodalime electrostatic bonding was performed by using on the developed bonding mechanism. Thebonding properties of the bonded sodalime-sodalime structure were investigated through SEM and SIMS analyses. Mo-tip FEA was vacuum-packaged by the developed bonding process and the packaged device generated the field emission current.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.32-33
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• 1998