• Design & Manufacturing
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• v.8 no.1
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• pp.27-30
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• 2014

Alloy tool steel such as SKD11 and SKD61 or high speed tool like SKH51 are used as materials for semiconductor dies. Cavities, curl blocks, pot blocks and housings are made from those materials. To make those parts from alloy tool steel or high speed tool, one utilizes discharge machining, and mechanical machining including machining center, milling, drilling, forming grinding and others. In the process of cutting machining and polishing, the die materials become unsuitable for machining owing to bubbles and foreign substances in them, which hinders production process. Therefore, this study focuses on die material selection criteria, and on analysis and comparison of material characteristics to help companies to solve their problems, make die manufacture less burdensome and extend die life.

• Transactions of Materials Processing
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• v.11 no.4
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• pp.355-362
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• 2002

In this study, an axi-symmetric finite element program for elastic analysis of the die set shrink fitted in cold extrusion was developed. The geometrical constraint according to shrink fit was enforced by employing the Lagrange multiplier method. The numerical results for strain and stress distributions in the die set including single and multi stress rings assembled by shrink fit were compared well with the Lame's equation for thick-walled solution available in the literature. To extend the applicability of the analysis program developed, various cases without or with stress ring and with pre-stress applied on stress ring were numerically investigated as well. This numerical approach enables the optimization study to determine optimal dimensions of die set to improve tool life for practical use in industry.

• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.587-594
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• 2016

Various surface treatments and thin film coating processes on the surface of injection die steel have been developed to extend the life. Most of previous studies were mainly focused on investigating the wear and static bonding behavior of thin films. In this study complex surface treatments of DLC coating combined with ion nitriding were applied to increase fatigue life and wear resistance. Ion nitriding, DLC coating, and DLC coating following nitriding on the surface of Fe-3.0Ni-0.7Cr-1.4Mn-X steel were investigated to uncover the beneficial effect which is applicable to injection die. The effect of various surface treatments and coating conditions on high cycle fatigue resistance was studied. Surface morphology change during fatigue tests were observed with AFM. Fatigue life of the die steel increased by 10 to 1,000 times at the various level of stress amplitudes in the condition of DLC coating following the ion nitriding for 3 hrs comparing with the only DLC coated condition.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1997.03a
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• pp.155-158
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• 1997

The investigation deals with of a intermediate process condition hving a bolt-shaped final product where it is required to extend tool-life in forging. In this study, optimization of the design variables is conducted by a genetic algorithm, where the fitness values are evaluated on the basis of FEM analysis model. The approach is applied to the determination of the intermediate process conditions which are optimal with regard to minimization of peak die pressure.

• Korean Journal of Metals and Materials
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• v.48 no.7
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• pp.651-659
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• 2010

When high-speed interrupted cutting is carried out for die and mold steels with high hardness, CBN tools manifested a significantly longer wear life than carbide, ceramic, or cermet tools in an experiment of face milling characteristics. In addition, it was also found that they secured a stable surface roughness within a range of 1.6 S~6.3 S, an acceptable range for precision machining for polished machining parts. And it makes them acceptable in the precision machining field, except in industries where very high machining accuracy is required. In the high hardness interrupted cutting, it was advantageous to perform a negaland treatment and a honning treatment on the tools' cutting edge to extend tool life and surface roughness. Also, severe crater development was found on the sloped face in CBN tools following high-speed machining. This caused the cutting edge to be weakened and damaged, and ultimately resulted in a shorter tool life. Finally, as a result of EDX mapping inspection, Cr component was detected evenly on the entire crater wear area, which can be included only in STD 11.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Journal of Hospice and Palliative Care
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• v.25 no.1
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• pp.42-49
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• 2022

As population aging increases the burden of cancer, the quality of death of patients with cancer is emerging as an important issue alongside their quality of life. To improve the quality of death, it is necessary to prepare for death, allowing patients to die comfortably and with dignity at the end. Considering these issues, I aim to discuss the practical aspects of notifying the patient of the terminal phase of cancer and planning for end-of-life care (i.e., advance care planning). When cancer treatment that can extend the patent's lifespan becomes difficult, the patient enters a treatment transition period. Treatment is shifted from life-prolonging care to life-enhancing care, and end-of-life care must be well planned. Medical providers often worry too much about whether the patient will be disappointed or psychologically traumatized when notified of the terminal phase of their cancer, thus delaying plans for end-of-life care. In fact, patients can accept their condition and prepare for end-of-life care better than we expect. During the treatment transition period, notification of terminal status should be given, and a well-prepared advance care plan should be established early when the patient has decision-making ability. In addition to conveying information, it is always necessary to be sensitive to whether the patient and caregiver understand the information and respond to their emotions.

• Tribology and Lubricants
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• v.31 no.4
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• pp.157-162
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• 2015

In this study, an ultrasonic nanocrystalline surface modification (UNSM) technique is applied to tungsten carbide-cobalt (WC-Co) to extend the service life of carbide parts used in press mold. The UNSM technique modifies the structure, reduces the surface roughness, increases the surface hardness, induces the compressive residual stress, and increases the wear resistance of materials by introducing severe plastic deformation. The surface roughness, hardness, and compressive residual stress of WC after UNSM treatment improve by about 42, 10, and 71%, respectively. A wear test under dry conditions is used to assess the effectiveness of the UNSM technique on the friction and wear behavior of WC. The UNSM technique is found to reduce the WC friction coefficient by approximately 21% and enhance the wear resistance by approximately 85%. The improved friction and wear behavior of WC may be mainly attributed to the increased hardness and compressive residual stress. Moreover, the WC specimen is treated by UNSM technique using three different WC, silicon nitride (Si₃N₄) and stainless steel (STS304) balls. The surface treated by WC balls shows the highest hardness when compared with treatment by stainless steel and silicon nitride balls. According to the obtained results, the UNSM technique is believed to increase the durability of the carbide component by improving the friction and wear behavior.