• Journal of the Korea Society of Computer and Information
• /
• v.26 no.2
• /
• pp.79-88
• /
• 2021

In this paper, we propose a API Gateway technique for the expansion of human resource management module, one of the ERP functions. The institution has introduced ERP (Enterprise Resource Planning) based on its efforts to transform all human and physical resources into business competitiveness and its response to the digital knowledge informatization environment, and listed it as multiple success factors. Human resource management is one of the factors that have been dealt with. However, ERP's Human Resources Management Module remains in the role of functional personnel management. How to utilize human resources begins with navigating and recognizing human resources. The proposed API Gateway technique leverages blockchain networks to design and implement APIs for human resource sharing and navigation, including the possibility of extending ERP's human resource management module. Secondly, it was designed and implemented using a smart contract that behaves like an API for preventing information forgery. The proposed method will not only be used as a tool that can actively utilize human resources, but will also be a complete resource for utilizing big data technology.

• Journal of the Korea Institute of Building Construction
• /
• v.23 no.3
• /
• pp.241-249
• /
• 2023

The objective of this research was to engineer a tile module that could efficiently curtail the incidence of tile defects during the construction phase. To assess the potential diminution in defect manifestation, we executed experiments centered on surface condition, the variation in mass before and after the freeze-thaw test, and adhesive strength. Our findings demonstrated that thermal contraction and expansion induced a relatively escalated frequency of defects in the underwater setting for the aluminum mesh, while the steel mesh saw a higher defect incidence in the air environment. Additionally, it was noted that the adhesive strength exhibited a trend towards augmentation as the mesh size dwindled. Collectively, these results suggest that the employment of smaller mesh sizes can foster improved adhesive strength, consequently diminishing tile defects. Further exploration and development of the tile module, informed by these insights, can substantially enhance the efficacy of the construction process.

• Journal of the Korean Institute of Telematics and Electronics
• /
• v.15 no.1
• /
• pp.19-22
• /
• 1978

A modular microcomputer system based on the Intel 8080 microprocessor is designed. Each module communicate via common bus system. The different modules can be placed anywhere on the bus. Address for memory and I/O modules are determined by switch registers situated on the modules. The system is intended to be used as a base equipment for continuing study, expansion, development and for teaching students.

• Proceeding of Spring/Autumn Annual Conference of KHA
• /
• 2006.11a
• /
• pp.216-219
• /
• 2006

A change is performed in socially a lot of places by elevations about the quality of life. Most construction balls are created mainly to spaces for an individuality or a specific community, but a space for public convenience is the situation that will gain gradually. While these public space increases, there is a public toilet to an increasing trend too. Think about Cubic Puzzle that it is one total space, and put one function to each Module. The small-scale Cubic space achieves a lot of changes by any energies, and a small-scale space compounds through energies to affect mobile and expansion, and the changed Cubic space does diversification of suitable mobile toilet space configuration to a local need in order to look.

• Proceedings of the Computational Structural Engineering Institute Conference
• /
• 2000.04b
• /
• pp.397-404
• /
• 2000

The research of the computer-aided analysis and design of steel structures has continuously evolved. Despite the importance of connection in steel structures, the design process of connections is inefficient in present. The purpose of this study is to help engineer in connection design process. In this paper, prototype of automatic connection design module in integrated system for steel structures is proposed. The main methodology is based on bottom-up approach to simplify and formalize product model. Expert system is used to help engineer for selecting steel connection type. Object-oriented analysis and modeling will improve the expansion of knowledge-base. The design for connection was done according to the design specifications of connections of AISC

• Journal of the Korean Institute of Telematics and Electronics B
• /
• v.31B no.1
• /
• pp.57-63
• /
• 1994

The logic function synthesis using ULM U$_h$ is constructed based on canonic Reed-Muller expansion coefficient for a given function. This paper proposes the fast synthesis algorithm using ULM U$_h$ for ternary function. By using circuit cost and synthesis method of proposed in this paper, order of control input variable minimum number of ULM U$_h$ can be decided in the synthesis of n-variable ternary function. Accordingly, this method enables to optimum circuit realization for ternary function synthesis using ULM ULM U$_h$ and can be applied to ternary function synthesis using ULM U$_h$. The complexity of search for select the order of all control input variables is (n+2)(n-1)/2.

• Journal of the Korean Society of Industry Convergence
• /
• v.3 no.1
• /
• pp.69-75
• /
• 2000

Multichip packages are comprised of dissimilar materials which expand at different rates on heating. The differential expansion must be accommodated by the various structural elements of the package. A types of heat exposures occur operation cycles. This study presents a finite element analysis simulation of flip-chip among multichip. The effects of geometries and material properties on the reliability were estimated during the analysis of temperature and thermal stress of flip-chip. From the results, it could be obtained that the more significant parameters to the reliability of flip-chip arc chip power cycle, heat convection and height of solder bump.

• Communications of the Korean Mathematical Society
• /
• v.35 no.2
• /
• pp.417-445
• /
• 2020

The purpose of this article is to continue the study of q, 𝜔-special functions in the spirit of Wolfgang Hahn from the previous papers by Annaby et al. and Varma et al., with emphasis on q, 𝜔-Apostol Bernoulli and Euler polynomials, Ward-𝜔 numbers and multiple q, 𝜔power sums. Like before, the q, 𝜔-module for the alphabet of q, 𝜔-real numbers plays a crucial role, as well as the q, 𝜔-rational numbers and the Ward-𝜔 numbers. There are many more formulas of this type, and the deep symmetric structure of these formulas is described in detail.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.33 no.4
• /
• pp.380-387
• /
• 2009

The reliability concerns of solder interconnections in flip chip PBGA packages are produced mainly by the mismatch of coefficient of thermal expansion(CTE) between the module and PCB. Finite element analysis has been employed extensively to simulate thermal loading for solder joint reliability and deformation of packages in electronic packages. The objective of this paper is to study the thermo-mechanical behavior of FC-PBGA package assemblies subjected to temperature change, with an emphasis on the effect of the finite element model, material models and temperature conditions. Numerical results are compared with the experimental results by using $moir{\acute{e}}$ interferometry. Result shows that the bending displacements of the chip calculated by the finite element analysis with viscoplastic material model is in good agreement with those by $moir{\acute{e}}$ inteferometry.

• Journal of Korea Society of Digital Industry and Information Management
• /
• v.7 no.2
• /
• pp.47-58
• /
• 2011

Snoop was suitably designed for wired and wireless network as having snoop agent module in BS(Base Station) which is connecting to both wired and wireless network in order to supplement the problems of TCP. This study examined performance difference by using the web traffic taken wide possession in current internet traffic. The web traffic has greater amount of traffic, shorter life time, and smaller size than other traffics. This study found that snoop producing performance improvement of wireless network in the network mixed with the wired and wireless lead performance loss when transmitting web traffic. This study found that in case of web traffic is transmitted it bring a performance improvement of web traffic as computing BWE((Bandwidth Expansion), and also found that this study prove of performance improvement by decreasing local retranmission.