• 제목/요약/키워드: Excimer

검색결과 426건 처리시간 0.031초

엑시머 레이저광의 회절에 의한 저온 다결정 실리콘 박막 트랜지스터의 소오스/드레인 접합부 결함 생성 (Junction Defects of Self-Aligned, Excimer Laser Annealed Poly-Si TFTs)

  • 강수혁;박기찬;이민철;한민구
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2002년도 추계학술대회 논문집 전기물성,응용부문
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    • pp.130-133
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    • 2002
  • 엑시머 레이저를 이용한 저온($450^{\circ}C$ 이하) 다결정 실리콘 박막 트랜지스터 제작 시, 소오스/드레인 이온 주입에 의한 실리콘 박막의 격자 손상은 엑시머 레이저 어닐링(Excimer Laser Annealing; ELA) 방법으로 치유한다. 그러나 게이트 전극 모서리에서의 레이저광 회절 현상으로 인해 소오스/드레인 접합부에 도달하는 레이저 에너지 밀도가 감소하여 다량의 결정 결함이 치유되지 못한 채 남게 된다. 이러한 결정 결함은 박막 트랜지스터의 전계 효과 이동도를 저하시키는 요인이 된다. 새롭게 제안한 사선 입사 엑시머 레이저 어닐링(Oblique Incidence Excimer Laser Annealing; OI-ELA) 방법으로 소오스/드레인 접합부의 결정 결함을 제거하고 다결정 박막 트랜지스터의 특성을 향상시켰다.

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엑시머 레이저를 이용한 저온 다결정 실리콘 박막 트랜지스터의 특성 (Characteristics of low temperature poly-Si thin film transistor using excimer laser annealing)

  • 강수희;김영훈;한진우;서대식;한정인
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.430-431
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    • 2006
  • This letter reports the fabrication of polycrystalline silicon thin-film transistors (poly-Si TFT) on flexible plastic substrates using amorphous silicon (a-Si) precursor films by sputter deposition. The a-Si films were deposited with mixture gas of argon and helium to minimize the argon incorporation into the film. The precursor films were then laser crystallized using XeCl excimer laser irradiation and a four-mask-processed poly-Si TFTs were fabricated with fully self-aligned top gate structure.

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X-Ray Emission Spectroscopic Analysis for Crystallized Amorphous Silicon Induced by Excimer Laser Annealing

  • John, Young-Min;Kim, Dong-Hwan;Cho, Woon-Jo;Lee, Seok;Kurmaev, E.-Z.
    • Journal of the Optical Society of Korea
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    • 제5권1호
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    • pp.1-4
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    • 2001
  • The results of investigating $SiL_{2,3}$/ X-ray emission valence spectra of amorphous silicon films irradiated by excimer laser are presented. It is found that laser annealing leads to crystallization of amorphous silicon films and the crystallinity increases with the laser energy density from 250 to 400 mJ/$\textrm{cm}^2$. The vertical structure of the film is investigated by changing the accelerating voltage on the X-ray tube, and the chemical and structural state of Si$_3$N$_4$ buffer layer is found not to be changed by the excimer laser treatment.

Excimer-Laser Annealing for Low-Temperature Poly-Si TFTs

  • Kim, Hyun-Jae
    • Journal of Information Display
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    • 제4권4호
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    • pp.1-3
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    • 2003
  • For excimer laser annealing (ELA), energy density, number of pulses, beam uniformity, and condition of initial amorphous Si (a-Si) films are significant factors contributing to the final microstructure and the performance of low-temperature polycrystalline Si (LTPS) TFTs. Although the process and equipment have been significantly improved, the environmental factors associated with initial amorphous Si (a-Si) films and process conditions are yet to be optimized.

New High Stability Excimer Laser for LTPS Manufacturing

  • Herbst, Ludolf;Paetzel, Rainer;Simon, Frank;Fechner, Burkhard
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.540-543
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    • 2006
  • LTPS TFT backplanes for AM OLED displays have advantages in regard to reliability and performance compared to TFT backplanes based on amorphous silicon. However, the requirements for homogeneous laser crystallization during LTPS process are much higher than for LCD backplanes. Most important is the energy stability of the laser source. In this paper we describe a new excimer laser which meets the requirements of LTPS manufacturing process with high homogeneity.

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Microstructural investigation of excimer laser-crystallized metallic thin films

  • Zhong, R.;Wiezorek, J.M.K.;Leonard, J.P.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.1739-1743
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    • 2006
  • Recent advances in the microstructural modification of metal films using excimer laser projection irradiation and lateral resolidification are discussed. Pure copper films have been directionally resolidified into large sheet-like grains when properly encapsulated for suppression of liquid-phase dewetting. A survey and quantitative assessment of the defects found in these icrostructures, typical for rapidly solidified metals, is presented.

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엑사이머 레이져를 이용한 실리콘웨이퍼의 미세가공

  • 윤경구;이성국;황경현
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 춘계학술대회 논문집
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    • pp.1058-1062
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    • 1997
  • Development of laser induced chemical etching technologt with KrF laser are carried out in this study for micromachining of silicon wafer. The paper is devoted to experimental identification of excimer laser induced mechanism of silicon under chlorine pressures(0.02~500torr). Experimental results on pulsed KrF excimer laser etching of silicon in chorine atmosphere are presented. Etching rate dependency on laser fluence and chlorine pressure are discussed on the basis of experimental analysis, it is concluded that accurate digital micro machining process of silicon wafer can achieved by KrF laser induced chemical etching technology.

Excimer Laser를 이용한 노광기술-I. 광노광 기술의 추이 및 성능개선방안

  • 이종현;김보우
    • ETRI Journal
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    • 제11권4호
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    • pp.128-138
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    • 1989
  • 광을 이용한 축소투영 노광기술은 고 NA와 단파장화에 의하여 현재 $0.5\mum$의 패턴형성을 가능하게 하고 있으며, 향후 excimer laser를 이용한 stepper는 64M DRAM 제조를 위한 핵심 노광장비가 될 것이다. 본 논문에서는 광을 이용한 노광장비의 성능개선을 위하여 노광방식에 따라 장비를 분류하고 MTF, coherence 등 패턴형성에 있어서의 주요개념을 정리하였다. 그리고 광노광 장비의 성능변수인 해상도, 촛점심도, 노광영역 및 정렬에 영향을 미치는 요소를 분석한 후 그 성능에대한 개선방안을 도출하였다.

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방전여기 KrF 엑사이머 레이저의 에비전리 영향에 관한연구 (A Study on preionization effect of discharge excited KrF excimer laser)

  • 김상욱;최부연;이주희
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1990년도 하계학술대회 논문집
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    • pp.459-461
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    • 1990
  • Me performed an experiment about preionization electron number density of charge transfer type KrF excimer laser. At the total pressure of 1.8 and 2.2 atm with helium (He) buffer gas, the experimental range of the electron number density is 8-9 ${\times}$ 10 cm The distance between electrode and preionization pin is 15 mJ at charging voltage of 27kV,gas pressure of 2.2 atm,gas mixture of F /Kr/He = 0.3/396.7(%).

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