• Title/Summary/Keyword: Etching resistance

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Trial Maunfacture of Planar Type Micro Inductors (평면형 마이크로인덕터의 시작에 관한 연구)

  • 김종오;강희우;김영학;김동연;오호영
    • Journal of the Korean Magnetics Society
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    • v.6 no.6
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    • pp.367-374
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    • 1996
  • The developmement of electronic machine industries requires miniature of size as well as increasement of driving frequency in electronic parts, recently. To realize micro-struture of magnetic devices, in this study, we fabricated thin film inductors by using thin film manufacturing techniques such as photolithography and wet etching process, and these devices are measured at high frequency range of 1 MHz~1 GHz. The results are as follows. The accurate measuring technique by using network analyzer system having microstrip line was established. The manufactured inductors are fabricated with several ten micrometers by means of wet etching process known as easier and more economic than dry etching process. VVhen the device size of two types (spiral, meander) is the same, inductance value L and quality factor Q of spiral type devices are larger than those of meander type, but driving frequency of spiral type is lower than that of meander type due to increasement of inductance L. It is necessary to decrease resistance value R by increasing cross section of the conductor film coil. Thus high frequency measuring method would be a very useful for another measuring fields of the range over several hundreds MHz.

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FABRICATION OF Nb/Al SUPERCONDUCTING TUNNEL JUNCTION (Nb/Al SUPERCONDUCTING TUNNEL JUNCTION의 제작)

  • Cho, Sung-Ik;Park, Young-Sik;Park, Jang-Hyun;Lee, Yong-Ho;Lee, Sang-Kil;Kim, Sug-Whan;Han, Won-Yong
    • Journal of Astronomy and Space Sciences
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    • v.21 no.4
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    • pp.481-492
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    • 2004
  • We report the successful fabrication and I-V curve superconductivity test results of the Nb/Al-based superconducting tunnel junctions. STJs with side-lengths of 20, 40, 60 and $80{\mu}m$ were fabricated by deposition of polycrystalline Nb/Al/AlOx/Al/Nb 5-layer thin films incorporated on a 3-inch Si wafer. STJ was designed by $Tanner^{TM}$ L-Edit 8.3 program, and fabricated in SQUID fabrication facility, KRISS. S-layer STJ thin-films were fabricated using UV photolithography, DC magnetron sputtering, Reactive ion etching, and CVD(Chemical Vapor Deposition) techniques. Superconducting state test for STJ was succeeded in 4K with liquid helium cooling system. Their performance indicators such ie energy gap, normal resistance, normal resistivity, dynamic resistance, dynamic resistivity, and quality factor were measured from I-V curve. Fabricated Nb/Al STJ shows $11\%$ higher FWHM energy resolution than genuine Nb STJ.

Fabrication Method of High-density and High-uniformity Solder Bump without Copper Cross-contamination in Si-LSI Laboratory (실리콘 실험실에 구리 오염을 방지 할 수 있는 고밀도/고균일의 Solder Bump 형성방법)

  • 김성진;주철원;박성수;백규하;이희태;송민규
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.4
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    • pp.23-29
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    • 2000
  • We demonstrate the fabrication method of high-density and high-quality solder bump solving a copper (Cu) cross-contamination in Si-LSI laboratory. The Cu cross-contamination is solved by separating solder-bump process by two steps. Former is via-formation process excluding Cu/Ti under ball metallurgy (UBM) layer sputtering in Si-LSI laboratory. Latter is electroplating process including Ti-adhesion and Cu-seed layers sputtering out of Si-LSI laboratory. Thick photoresist (PR) is achieved by a multiple coating method. After TiW/Al-electrode sputtering for electroplating and via formation in Si-LSI laboratory, Cu/Ti UBM layer is sputtered on sample. The Cu-seed layer on the PR is etched during Cu-electroplating with low-electroplating rate due to a difference in resistance of UBM layer between via bottom and PR. Therefore Cu-buffer layer can be electroplated selectively at the via bottom. After etching the Ti-adhesion layer on the PR, Sn/Pb solder layer with a composition of 60/40 is electroplated using a tin-lead electroplating bath with a metal stoichiometry of 60/40 (weight percent ratio). Scanning electron microscope image shows that the fabricated solder bump is high-uniformity and high-quality as well as symmetric mushroom shape. The solder bumps with even 40/60 $\mu\textrm{m}$ in diameter/pitch do not touch during electroplating and reflow procedures. The solder-bump process of high-uniformity and high-density with the Cu cross-contamination free in Si-LSI laboratory will be effective for electronic microwave application.

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Fabrication of Aluminum Powder Disk by a Template Method and Its Etching Condition for an Electrode of Hybrid Supercapacitor (Template 방법을 이용한 Hybrid Supercapacitor 전극용 알루미늄 분말 디스크 제조와 에칭 조건 연구)

  • Jin, Chang-Soo;Lee, Yong-Sung;Shin, Kyung-Hee;Kim, Jong-Huy;Yoon, Soon-Gil
    • Journal of the Korean Electrochemical Society
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    • v.6 no.2
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    • pp.145-152
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    • 2003
  • Capacitance of a hybrid capacitor that has characteristics of both electrolyte capacitor and supercapacitor is determined by anode surface covered with oxide layer. In this study, optimal condition processes for anode to fabricate a high voltage hybrid capacitor was investigated. We mixed aluminum powder having mean particle size of $40{\mu}m$ with NaCl powders at weight ratio of 4 : 1 and prepared a disk type electrode after annealing at various temperature. After dissolving NaCl in $50^{\circ}C$ distilled water, heat treatment, eletropolishing, chemical treatment, and the first and the second etching of Al disk were conducted. In each process, capacitances and resistances of the disk measured by ac-impedance analyzer were compared to find its optimum treatment condition. Also, the surface morphology of treated disks were observed and compared by SEM. After the second etching, the Al disk was anodized at 365V to make an anode of hybrid supercapacitor that can be operated at 300V, Capacitance and resistance of the anodized Al disk electrode was compared with those of commercialized conventional aluminum electrolytic capacitor at different frequencies.

Efficiency Improvement in InGaN-Based Solar Cells by Indium Tin Oxide Nano Dots Covered with ITO Films

  • Seo, Dong-Ju;Choi, Sang-Bae;Kang, Chang-Mo;Seo, Tae Hoon;Suh, Eun-Kyung;Lee, Dong-Seon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.345-346
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    • 2013
  • InGaN material is being studied increasingly as a prospective material for solar cells. One of the merits for solar cell applications is that the band gap energy can be engineered from 0.7 eV for InN to 3.4 eV for GaN by varying of indium composition, which covers almost of solar spectrum from UV to IR. It is essential for better cell efficiency to improve not only the crystalline quality of the epitaxial layers but also fabrication of the solar cells. Fabrication includes transparent top electrodes and surface texturing which will improve the carrier extraction. Surface texturing is one of the most employed methods to enhance the extraction efficiency in LED fabrication and can be formed on a p-GaN surface, on an N-face of GaN, and even on an indium tin oxide (ITO) layer. Surface texturing method has also been adopted in InGaN-based solar cells and proved to enhance the efficiency. Since the texturing by direct etching of p-GaN, however, was known to induce the damage and result in degraded electrical properties, texturing has been studied widely on ITO layers. However, it is important to optimize the ITO thickness in Solar Cells applications since the reflectance is fluctuated by ITO thickness variation resulting in reduced light extraction at target wavelength. ITO texturing made by wet etching or dry etching was also revealed to increased series resistance in ITO film. In this work, we report a new way of texturing by deposition of thickness-optimized ITO films on ITO nano dots, which can further reduce the reflectance as well as electrical degradation originated from the ITO etching process.

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Effect of Anodizing Current Density on Anti-Corrosion Characteristics for Al2O3 Oxide Film (Al2O3 산화 피막의 내식성에 미치는 양극산화 전류밀도의 영향)

  • Lee, Seung-Jun;Jang, Seok-Gi;Kim, Seong-Jong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2016.11a
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    • pp.153-153
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    • 2016
  • Aluminum alloys have poor corrosion resistance compared to the pure aluminum due to the additive elements. Thus, anodizing technology artificially generating thick oxide films are widely applied nowadays in order to improve corrosion resistance. Anodizing is one of the surface modification techniques, which is commercially applicable to a large surface at a low price. However, most studies up to now have focused on its commercialization with hardly any research on the assessment and improvement of the physical characteristics of the anodized films. Therefore, this study aims to select the optimum temperature of sulfuric electrolyte to perform excellent corrosion resistance in the harsh marine environment through electrochemical experiment in the sea water upon generating porous films by variating the temperatures of sulfuric electrolyte. To fabricate uniform porous film of 5083 aluminum alloy, we conducted electro-polishing under the 25 V at $5^{\circ}C$ condition for three minutes using mixed solution of ethanol (95 %) and perchloric (70 %) acid with volume ratio of 4:1. Afterward, the first step surface modification was performed using sulfuric acid as an electrolyte where the electrolyte concentration was maintained at 10 vol.% by using a jacketed beaker. For anode, 5083 aluminum alloy with thickness of 5 mm and size of $2cm{\times}2cm$ was used, while platinum electrode was used for cathode. The distance between the two was maintained at 3 cm. Afterward, the irregular oxide film that was created in the first step surface modification was removed. For the second step surface modification process (identical to the step 1), etching was performed using mixture of chromic acid (1.8 wt.%) and phosphoric acid (6 wt.%) at $60^{\circ}C$ temperature for 30 minutes. Anodic polarization test was performed at scan rate of 2 mV/s up to +3.0 V vs open circuit potential in natural seawater. Surface morphology was compared using 3D analysis microscope to observe the damage behavior. As a result, the case of surface modification presented a significantly lower corrosion current density than that without modification, indicating excellent corrosion resistance.

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Effects of Citric Acid as a Complexing Agent on Material Removal in Cu CMP (Cu CMP에서 Citric Acid가 재료 제거에 미치는 영향)

  • Jung Won-Duck;Park Boum-Young;Lee Hyun-Seop;Jeong Hea-Do
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.19 no.10
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    • pp.889-893
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    • 2006
  • Chemical mechanical polishing (CMP) achieves surface planrity through combined mechanical and chemical means. The role of slurry is very important in metal CMP. Slurry used in metal CMP normally consists of oxidizers, complexing agents, corrosion inhibitors and abrasives. This paper investigates the effects of citric acid as a complexing agent for Cu CMP with $H_2O_2$. In order to study chemical effects of citric acid, X-ray photoelectron spectroscopy (XPS) was peformed on Cu sample after etching test. XPS results reveal that CuO, $Cu(OH)_2$ layer decrease but $CU/CU_2O$ layer increase on Cu sample surface. To investigate nanomechanical properties of Cu sample surface, nanoindentation was performed on Cu sample. Results of nanoindentation indicate wear resistance of Cu surface decrease. According to decrease of wear resistance on Cu surface removal rate increases from $285\;{\AA}/min\;to\;8645\;{\AA}/min$ in Cu CMP.

Effects of Acid-etching, CO2 and Nd:YAG Lasing on the Dentin Surface (산부식과 CO2 및 Nd:YAG 레이저 조사에 따른 상아질 표면의 변화)

  • Lee, Jae-Hak;Park, June-Sang;Ko, Myung-Yun
    • Journal of Oral Medicine and Pain
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    • v.25 no.1
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    • pp.129-144
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    • 2000
  • The purpose of this study was to examine dentin surface changes of extracted sound third molar specimens which were etched with 10% maleic acid and irradiated at $7-140J/cm^2$ with $CO_2$ and at $156-280J/cm^2$ with Nd:YAG laser. The results were as follows. 1. Dentin surfaces etched with 10% maleic acid and then irradiated at below of $42J/cm^2$ with $CO_2$ laser showed the retentive morphology for resin restoration. 2. Dentin surfaces irradiated at below of $42J/cm^2$ with $CO_2$ laser showed the increased acid-resistance. 3. Dentin surfaces irradiated at $218-280J/cm^2$ with Nd:YAG laser showed the retentive morphology. 4. Dentin surfaces irradiated at $218-280J/cm^2$ with Nd:YAG laser and etched 10% maleic acid and then $218-280J/cm^2$ with Nd:YAG laser showed the increased acid-resistance.

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Improvement of Organic Electroluminescent Device Performance by $O_2$ Plasma Treatment of ITO Surface (ITO 박막의 $O_2$ 플라즈마 처리에 의한 휴지전기발광소자의 특성 향상)

  • Yang, Ki-Sung;Kim, Doo-Seok;Kim, Byoung-Sang;Shin, Hoon-Kyu;Kwon, Young-Soo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.04b
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    • pp.137-140
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    • 2004
  • We treated $O_2$ plasma on ITO thin film using RIE (Reactive Ion Etching) system, and analyzed the ingredient of ITO thin film according to change of processing conditions. The ingredient analysis of ITO thin film was used by EDS (Energy Dispersive Spectroscopy) and XPS (X-ray Photoelectron Spectroscopy) to compare and analyze the ingredient of bulk and surface. We measured electrical resistivity using Four-Point-Probe and calculated sheet resistance, and ITO surface roughness was measured by using AFM (Atomic Force Microscope). Finally, we fabricated OLEDs (Organic Light-Emitting Diodes) device using substrate that was treated optimum ITO surface. The result of the study for electrical and optical properties using I V L System (Flat Panel Display Analysis System), we confirmed that electrical properties (I-V) and optical properties (L-V) were improved.

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Spot Welding of Aluminum Alloys Using Servogun (서보건을 이용한 알루미늄 합금의 저항 점용접)

  • 임창식;장희석
    • Journal of Welding and Joining
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    • v.22 no.4
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    • pp.43-49
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    • 2004
  • Conventional method for electrode force application in resistance spot welding(RSW) processes is to use pneumatic cylinder. However, due to its inherent problems in pneumatic power system such as compressibility of air and poor transient response characteristics, new electrode force system with servo control are recently introduced in RSW machine. This machine is called “servogun”. The purpose of this study is to evaluate performance of servogun in case of spot welding of aluminum alloy. Aluminum alloy(A5052) sheets are spot welded using pneumatic gun and servogun. Both results are compared by means of macro cross-section etching test and tensile shear strength test. Numerous previous research have reported nugget with many voids and cracks are not uncommon defects in spot welds with aluminum alloy. The experimental results show similar defects in case of pneumatic gun. In contrast, use of servogun considerably reduced generation of voids and cracks. In case of step-wise increased forging force at the end of welding cycle with servogun, crack-free and void-free nuggets have been observed. The performance of servogun has been also verified by series of tensile shear test. Higher strength values have been achieved with servogun in comparison to that of pneumatic gun.