• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.7
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• pp.102-108
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• 1998

A new 1*4 optical waveguide power divider is proposed and fabricated. It consists of a 1*4 multi-branch structure with a beam separator and two beam expanders that can control the splitting ratios between the output ports. The proposed optical waveguide power divider is designed by employing the two dimensional finite difference beam propagation method and is fabricated by a reactive ion etching method. The splitting ratio of fabricatd device is 25.0 : 25.7 : 25.3 : 24.0 for TE mode and 25.7 : 25.2 : 24.1 : 25.0 for TM mode. Comapred with the conventional Y-branch structure, the proposed structure shortens the length of a 1*N divider by the factor 3. Thus it reduces the total propagation loss and the total radiation loss at the branch points. furthermore, the splitting ratios between the output ports may be controlled in this structure for some special applications.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.41 no.8
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• pp.99-103
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• 2004

Aperture has been employed on the ground plane in the Hairpin resonator. Aperture made by etching the part of the ground effected coupling coefficient and then quality factor of Hairpin resonator has been increased. When the hair pin oscillator using aperture has been compared with the conventional hair pin oscillator using microstrip, it has been improved the phase noise about 19dBc ＠100KHz. Oscillation frequency of the hair pin oscillator using aperture has been 5.83GHz band and output power is -4.33dBm.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.28-32
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• 2003

Aperture has been employed on the ground plane in the Hair Pin resonator. Aperture made by etching the part of the ground effected coupling coefficient and then quality factor of Hair Pin resonator has been increased. When the hair pin oscillator using aperture has been compared with the conventional hair pin oscillator using microstrip, it has been improved the phase noise about 19dBc @100KHz. Oscillation frequency of the hair pin oscillator using aperture has been 5.83GHz band and output power is -4.33dBm.

• Journal of Electrical Engineering and Technology
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• v.10 no.3
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• pp.1138-1143
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• 2015

Effects of fabrication process variations on impedance of microelectrodes integrated on a neural probe were examined through equivalent circuit modeling and SPICE simulation. Process variation and the corresponding range were estimated based on experimental data. The modeling results illustrate that the process variation induced by metal etching process was the dominant factor in impedance variation. We also demonstrate that the effect of process variation is frequency dependent. Another process variation that was examined in this work was the thickness variation induced by deposition process. The modeling results indicate that the effect of thickness variation on impedance is negligible. This work provides a means to predict the variations in impedance values of microelectrodes on neural probe due to different process variations.

• Journal of the Semiconductor & Display Technology
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• v.16 no.1
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• pp.65-69
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• 2017

This paper presents a Technology-CAD (TCAD) simulation of the characteristics of crystalline Si pillar array solar cells. The junction depth and the surface concentration of the solar cells were optimized to obtain the targeted sheet resistance of the emitter region. The diffusion model was determined by calibrating the emitter doping profile of the microscale silicon pillars. The dimension parameters determining the pillar shape, such as width, height, and spacing were varied within a simulation window from ${\sim}2{\mu}m$ to $5{\mu}m$. The simulation showed that increasing pillar width (or diameter) and spacing resulted in the decrease of current density due to surface area loss, light trapping loss, and high reflectance. Although increasing pillar height might improve the chances of light trapping, the recombination loss due to the increase in the carrier's transfer length canceled out the positive effect to the photo-generation component of the current. The silicon pillars were experimentally formed by photoresist patterning and electroless etching. The laboratory results of a fabricated Si pillar solar cell showed the efficiency and the fill factor to be close to the simulation results.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.22 no.11
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• pp.751-759
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• 2010

A newly developed type PCHE(Printed Circuit Heat Exchanger), which has a longitudinal corrugation flow channel, was fabricated using etching and diffusion bonding to evaluate its hydraulic performance. The pressure drop characteristics obtained from the experimental results are presented and the local friction factors associated with different hydraulic diameters and inclination angles are discussed. The results of a three-dimensional numerical simulation are presented, conducted using commercial CFD(Computational Fluid Dynamics) software at lower Reynolds number range. The numerical results were validated by experimental data obtained from helium gas experimental apparatus. The results of CFD prediction show fairly good agreement with the experimental data.

• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.46-50
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• 2018

The purpose of this study is to analyze effects of filtering system of cutting fluid which is used for machining silicon electrode. For the research, different sizes of filter clothes are applied to check grain size of sludge of cutting fluid. Surface roughness of machined workpiece, depth of damage inside of silicon electrode, and suspended solids of cutting fluid are experimented and analyzed. From these experiments, it is verified that filtering system of cutting fluid is very important factor for machining. Results of this study can affect various benefits to the semiconductor industry for better productivity and better atmospheric pollution in workplace.

• Journal of the Semiconductor & Display Technology
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• v.17 no.3
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• pp.85-89
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• 2018

Temperature uniformity of a wafer in a semiconductor process is a very important factor that determines the overall yield. Therefore, it is very important to confirm the temperature characteristics of the chuck surface on which the wafer is lifted. The temperature characteristics of the chuck depend on the external heat source, the shape of the cooling channel inside the chuck, the material on the chuck surface, and so on. In this study, CFD confirms the change of temperature characteristics according to the stacking order of ceramic materials and inner coolant path on the chuck surface. Finally this study suggests the best cooling condition of electrostatic chuck.

• Journal of the Semiconductor & Display Technology
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• v.20 no.1
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• pp.59-63
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• 2021

Upper electrode is one of core parts using plasma etching process at semiconductor. The purpose of this study is to analyze effects of cutting conditions for mechanical machining of silicon upper electrode. For this research, surface roughness of machined workpiece and depth of damage inside of silicon electrode are experimented and analyzed and different values of feed rate and depth of cut are applied for the experiments. From these experiments, it is verified that the surface roughness and internal damaged layer get worse according to take more fast feed rate. In conclusion, cutting condition is very important factor for machining. Results of this study can use to develop various parts which are made from single crystal silicon and affect various benefits to the semiconductor industry for better productivity.

• Journal of Dental Rehabilitation and Applied Science
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• v.18 no.4
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• pp.289-299
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• 2002

The bond strength is one of the most important factor in establishing long-term success of esthetic restorative dentistry. So, various restorative materials have been introduced to improve the esthetic and physical properties. Ormocer (organically modified ceramic) was developed as a result of such efforts. This study was performed to compare the shear bond strength of ormocer based adhesive with that of existing dentin adhesive. In this study $Admira^{(R)}$ and $Admira^{(R)}$ bond of the ormocer system are grouped together for ADM, Single $Bond^{(R)}$ which is an one-bottle adhesive and Z-250TM which is hybrid composite resin of BIS-GMA system for SIN, and $Definite^{(R)}$ of ormocer and Etch & $Prime^{(R)}$ 3.0 which is a self etching priming/ bonding agent for ETC. The results of this study were as follows. : (1) In the comparison of shear bond strength according to different adhesive system, shear bond strength was increased in the order of ETC group, SIN group, ADM group. There was no significant difference between ADM group and SIN group. However, there was a significant level of difference between ADM and ETC groups as well as SIN and ETC groups( p<0.05). (2) Examination by a scanning electron microscope showed a well established hybrid layer and resin tag in both ADM group and SIN group, while ETC group showed a minimal formation of the hybrid layer when compared with ADM and SIN groups. From the above results, it may be reasonable to start the clinical application of ormocer system, and it is recommended that ormocer system should be used along with an ormocer based adhesive because ormocer system showed the lower shear bond strength when it used with other existing self etching priming/bonding agent. The self etching priming/bonding agent showed relatively low shear bond strength, and it is considered that the further study should be needed.