• 반도체디스플레이기술학회지
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• 제21권4호
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• pp.126-131
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• 2022

The number of joint disease patients is increasing every year. Currently, the most CPM(Continuous Passive Motion) equipment uses expensive imported equipment, and one CPM equipment is designed to be used only in one joint, medical personnel or hospitals who are the main users of the medical equipment need to have several types of CPMs for joint rehabilitation. To solve this problem, this paper designed a multifunctional joint medical equipment that enables rehabilitation of knee, shoulder, and elbow joints in one CPM equipment and includes general, intensive, and adaptive exercise functions for effective treatment according to the patient's condition. The patient's condition was diagnosed using a load cell and a current sensor. In this paper, effective rehabilitation methods were presented and high reliability and precision of medical equipment was confirmed through experiments using potentiometer, encoder, and PI controller.

• 반도체디스플레이기술학회지
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• 제19권4호
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• pp.18-21
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• 2020

Undetected wafer slip during the lift pin-down motion in semiconductor equipment may affect the center to edge variation, wafer warpage, and pattern misalignment in plasma equipment. Direct measuring of the amount of wafer slip inside the plasma process chamber is not feasible because of the hardware space limitation inside the plasma chamber. In this paper, we demonstrated a practice for the wafer lift pin-up and down motions with respect to the gear ratio, operating voltage, and pulse width modulation to maintain accurate wafer position using remote control linear servo motor with an experimentally designed chamber mockup. We noticed that the pin moving velocity and gear ratio are the most influencing parameters to be control, and the step-wised position control algorithm showed the most suitable for the reduction of wafer slip.

• 한국융합학회논문지
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• 제10권11호
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• pp.85-93
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• 2019

한국은 반도체 산업에서의 독보적 우위에도 불구하고, 반도체 장비 분야에서는 두각을 나타내지 못하고 있다. 세정장비는 반도체 장비 중 한 분야로, 반도체 기술의 고도화에 따라 향후 중요성이 더욱 강조되는 분야이다. 본 연구는 특허 정보를 분석하여 한국을 포함한 주요 국가별 세정장비 분야 기술경쟁력을 파악하고 국가별 중점 기술분야를 살펴보고자 하였다. 이를 위해 최근 10년 간 미국 특허청에 등록된 세정장비 특허를 검색하여, 정량적 특허분석 및 특허 동시분류 네트워크 분석을 실시하였다. 연구 결과, 미국과 일본이 이 분야 기술을 선도하고 있는 것으로 나타났으며, 한국은 이들 선도국에 비해 경쟁력이 크게 뒤쳐짐은 물론, 경쟁국인 대만이나 후발국인 중국에 비해서도 우위에 있다고 보기 어려운 상황이다. 또한 국가별 전문화가 진행되어 있어, 국가 간 협력체제가 원활치 못할 경우 기술장벽으로 작용할 가능성도 없지 않다. 따라서 국내 세정장비 산업의 발전을 위한 적극적인 연구개발과 기술역량 확충이 요구된다.

• 한국CDE학회논문집
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• 제13권4호
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• pp.273-285
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• 2008

In this paper we propose an engineering bill of materials (E-BOM) copy method that can be utilized to manage the product information for each equipment during building a product lifecycle management (PLM) system in the order-specific semiconductor equipment manufacturer. The previous works studied on an E-BOM creation and management method for the mass manufacturing and production. The method is difficult to apply to an environment in which many engineering changes occur and the different specification to each equipment is required such as semiconductor equipments and facilities adopting built-to-order instead of built for inventory. Moreover the method is known to be the major drawback to deteriorate the design efficiency. Our E-BOM copy method enables users efficiently to manage the specification of a product and shortens the product development cycle. To implement the E-BOM copy method in the PLM environment, we developed the E-BOM copy system that automatically generates new parts and their numbers according to the numbering rule while copying the E-BOM from existing semiconductor equipments and then can apply the parts for reuse to new semiconductor equipments. This system can duplicate not only 3D CAD data but also technical documents.

• 실천공학교육논문지
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• 제7권2호
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• pp.125-134
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• 2015

본 연구는 반도체산업에서 반도체 장비의 유지보수를 위한 전문기술인력을 효과적으로 양성할 수 있는 반도체장비 유지보수 기능인력 양성 프로그램을 개발하고자 하는데 그 목적이 있다. 연구의 목적을 달성하기 위하여 반도체장비유지보수 분야의 국내외 실태 조사, 문헌조사를 통하여 반도체장비유지보수 관련 교육훈련 수요 예상 인력을 파악했으며, 직무분석을 통하여 반도체 장비 유지보수 기능 인력의 직무 및 교육내용을 분석하였다. 이러한 결과를 토대로 반도체 장비 유지 보수 기능인력 양성을 위한 교육프로그램을 제시하였다.

• 반도체디스플레이기술학회지
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• 제18권4호
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• pp.40-45
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• 2019

The smart factory has developed with the help of several technologies such as automation, artificial intelligence, big data, smart sensors and communication protocols. The Internet of things(IOT) among communication protocols has become the key factor for the seamless integration of various manufacturing equipment. Therefore, it is important that the IOT cooperate with the standards of communication protocols proposed by the SEMI in the semiconductor industry. In this paper, we suggest a novel reference model of the communication protocols for semiconductor equipment by introducing an IOT service layer. With the IOT service layer, we can use the functions and the additional services provided by the IOT standards that give the inter-operability between factory machines and host computers. We implement the standard of the communication protocols for semiconductor equipment with the IOT service layer by using ns3 simulator. It concludes that it is necessary to provide the platform for the IOT service layer to deploy efficiently the proposed reference model of the communication protocols.

• 반도체디스플레이기술학회지
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• 제7권2호
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• pp.39-43
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• 2008

Productivity is one of the performance indices of the semiconductor equipment in manufacturing viewpoint. Among many ways tried and adopted for improvement of the productivity of the FAB equipment, variation of equipment configuration was considered and its effect on the throughput was analyzed. Parallel machine cycle charts that were generated based on the equipment log were used in the analysis. Efficiency of the equipment due to change of the structure and the probability of the usage in the manufacturing process were examined. The results showed that the modification of the control algorithm in the equipment and the redistribution of the process time for each process and transfer module along to the change in the structure enhance the throughput of the equipment.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2008년도 춘계학술대회논문집
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• pp.569-574
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• 2008

Nowadays, the equipment for a semiconductor process is required to raise accuracy and productivity. Therefore, the natural frequency of the equipment has been lowered because it has been precise, rapid, large, and light. In order to improve the efficiency of production, it is necessary for the equipment to increase the operation speed, which causes inevitable vibration problems. In this paper, influence analysis of ball-screw in the equipment and evaluation method for the vibration on the base are presented based on the analyses of dynamic characteristics for the mechanical structure through the modal test.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 1998년도 춘계학술대회논문집; 용평리조트 타워콘도, 21-22 May 1998
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• pp.302-307
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• 1998

In the production of semiconductor wafer, optical and electron microscopes, ion-beam, laser device must maintain their alignments within a sub-micrometer. This equipment requires a vibration free environment to provide its proper function. Especially, lithography and inspection devices, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved giga and tera class semiconductor wafers. This high technology equipments require very strict environmental vibration standard, vibration criteria, in proportion to the accuracy of the manufacturing, inspecting devices. The vibration criteria of high sensitive equipment should be represented in the form of exactness and accuracy, because this is used as basic data for the design of building structure and structural dynamics of equipment. The study on the evaluation of the factors affecting the permissible vibration criteria is required to design the efficient isolation system of the semiconductor manufacturing of equipment. This paper deals with the properties of the effected factor for vibration criteria of high sensitive equipment.

• 반도체디스플레이기술학회지
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• 제2권3호
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• pp.13-18
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• 2003

A remote monitoring system of the semiconductor equipment is used to monitor or control operations of the equipment. Most of the conventional monitoring systems are based on the client-server model with the general purpose PC. Basically, it implies the difficulties in the system reliability and cost down due to its size and complexity. To overcome these difficulties, we suggest an embedded web server which is based on the low-cost microprocessor. It is designed for the monitoring or controlling a dedicated equipment only. To evaluate the feasibility of the suggested embedded web server, we have implemented a test-board with ATMega103 and programmed the basic modules using the AVR-GCC. Finally, we have tested its operations on the MS Explorer 6.0 environment.