• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.126-131
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• 2022

The number of joint disease patients is increasing every year. Currently, the most CPM(Continuous Passive Motion) equipment uses expensive imported equipment, and one CPM equipment is designed to be used only in one joint, medical personnel or hospitals who are the main users of the medical equipment need to have several types of CPMs for joint rehabilitation. To solve this problem, this paper designed a multifunctional joint medical equipment that enables rehabilitation of knee, shoulder, and elbow joints in one CPM equipment and includes general, intensive, and adaptive exercise functions for effective treatment according to the patient's condition. The patient's condition was diagnosed using a load cell and a current sensor. In this paper, effective rehabilitation methods were presented and high reliability and precision of medical equipment was confirmed through experiments using potentiometer, encoder, and PI controller.

• Journal of the Semiconductor & Display Technology
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• v.19 no.4
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• pp.18-21
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• 2020

Undetected wafer slip during the lift pin-down motion in semiconductor equipment may affect the center to edge variation, wafer warpage, and pattern misalignment in plasma equipment. Direct measuring of the amount of wafer slip inside the plasma process chamber is not feasible because of the hardware space limitation inside the plasma chamber. In this paper, we demonstrated a practice for the wafer lift pin-up and down motions with respect to the gear ratio, operating voltage, and pulse width modulation to maintain accurate wafer position using remote control linear servo motor with an experimentally designed chamber mockup. We noticed that the pin moving velocity and gear ratio are the most influencing parameters to be control, and the step-wised position control algorithm showed the most suitable for the reduction of wafer slip.

• Journal of the Korea Convergence Society
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• v.10 no.11
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• pp.85-93
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• 2019

Despite its matchless position in the global semiconductor industry, Korea has not distinguished itself in the semiconductor equipment sector. Semiconductor cleaning equipment is one of the semiconductor fabrication equipment, and it is expected to be more important along with the advancement of semiconductor fabrication processes. This study attempts to analyze technology competitiveness of major countries in the sector including Korea, and explore specialty sub-areas of the countries. For this purpose, we collected patents of semiconductor cleaning equipment during the last 10 years from the US patent database, and implemented quantitative patent analysis and co-classification network analysis. The result shows that, the US and Japan have been leading the technological progress in this sector, and Korea's competitiveness has lagged behind not only the leading countries but also its competitors and even latecomers. Therefore, intensive R&D and developing technological capabilities are needed for advancing the country's competitiveness in the sector.

• Korean Journal of Computational Design and Engineering
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• v.13 no.4
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• pp.273-285
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• 2008

In this paper we propose an engineering bill of materials (E-BOM) copy method that can be utilized to manage the product information for each equipment during building a product lifecycle management (PLM) system in the order-specific semiconductor equipment manufacturer. The previous works studied on an E-BOM creation and management method for the mass manufacturing and production. The method is difficult to apply to an environment in which many engineering changes occur and the different specification to each equipment is required such as semiconductor equipments and facilities adopting built-to-order instead of built for inventory. Moreover the method is known to be the major drawback to deteriorate the design efficiency. Our E-BOM copy method enables users efficiently to manage the specification of a product and shortens the product development cycle. To implement the E-BOM copy method in the PLM environment, we developed the E-BOM copy system that automatically generates new parts and their numbers according to the numbering rule while copying the E-BOM from existing semiconductor equipments and then can apply the parts for reuse to new semiconductor equipments. This system can duplicate not only 3D CAD data but also technical documents.

• Journal of Practical Engineering Education
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• v.7 no.2
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• pp.125-134
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• 2015

The purpose of this study is to develop semiconductor equipment maintenance technician train program for the effective train of professional maintenance technician in the semiconductor industry. To achieve the purpose, both of the actual condition survey and the literature investigation had been proceeded for the prediction of educational train manpower requirements in the field of semiconductor equipment maintenance in and outside the country. In addition, tasks and education contents were also analyzed through job analysis. Based on the result, we suggest that the education program for semiconductor equipment maintenance technician train.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.40-45
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• 2019

The smart factory has developed with the help of several technologies such as automation, artificial intelligence, big data, smart sensors and communication protocols. The Internet of things(IOT) among communication protocols has become the key factor for the seamless integration of various manufacturing equipment. Therefore, it is important that the IOT cooperate with the standards of communication protocols proposed by the SEMI in the semiconductor industry. In this paper, we suggest a novel reference model of the communication protocols for semiconductor equipment by introducing an IOT service layer. With the IOT service layer, we can use the functions and the additional services provided by the IOT standards that give the inter-operability between factory machines and host computers. We implement the standard of the communication protocols for semiconductor equipment with the IOT service layer by using ns3 simulator. It concludes that it is necessary to provide the platform for the IOT service layer to deploy efficiently the proposed reference model of the communication protocols.

• Journal of the Semiconductor & Display Technology
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• v.7 no.2
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• pp.39-43
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• 2008

Productivity is one of the performance indices of the semiconductor equipment in manufacturing viewpoint. Among many ways tried and adopted for improvement of the productivity of the FAB equipment, variation of equipment configuration was considered and its effect on the throughput was analyzed. Parallel machine cycle charts that were generated based on the equipment log were used in the analysis. Efficiency of the equipment due to change of the structure and the probability of the usage in the manufacturing process were examined. The results showed that the modification of the control algorithm in the equipment and the redistribution of the process time for each process and transfer module along to the change in the structure enhance the throughput of the equipment.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2008.04a
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• pp.569-574
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• 2008

Nowadays, the equipment for a semiconductor process is required to raise accuracy and productivity. Therefore, the natural frequency of the equipment has been lowered because it has been precise, rapid, large, and light. In order to improve the efficiency of production, it is necessary for the equipment to increase the operation speed, which causes inevitable vibration problems. In this paper, influence analysis of ball-screw in the equipment and evaluation method for the vibration on the base are presented based on the analyses of dynamic characteristics for the mechanical structure through the modal test.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1998.04a
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• pp.302-307
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• 1998

In the production of semiconductor wafer, optical and electron microscopes, ion-beam, laser device must maintain their alignments within a sub-micrometer. This equipment requires a vibration free environment to provide its proper function. Especially, lithography and inspection devices, which have sub-nanometer class high accuracy and resolution, have come to necessity for producing more improved giga and tera class semiconductor wafers. This high technology equipments require very strict environmental vibration standard, vibration criteria, in proportion to the accuracy of the manufacturing, inspecting devices. The vibration criteria of high sensitive equipment should be represented in the form of exactness and accuracy, because this is used as basic data for the design of building structure and structural dynamics of equipment. The study on the evaluation of the factors affecting the permissible vibration criteria is required to design the efficient isolation system of the semiconductor manufacturing of equipment. This paper deals with the properties of the effected factor for vibration criteria of high sensitive equipment.

• Journal of the Semiconductor & Display Technology
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• v.2 no.3
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• pp.13-18
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• 2003

A remote monitoring system of the semiconductor equipment is used to monitor or control operations of the equipment. Most of the conventional monitoring systems are based on the client-server model with the general purpose PC. Basically, it implies the difficulties in the system reliability and cost down due to its size and complexity. To overcome these difficulties, we suggest an embedded web server which is based on the low-cost microprocessor. It is designed for the monitoring or controlling a dedicated equipment only. To evaluate the feasibility of the suggested embedded web server, we have implemented a test-board with ATMega103 and programmed the basic modules using the AVR-GCC. Finally, we have tested its operations on the MS Explorer 6.0 environment.