• Journal of the Semiconductor & Display Technology
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• v.19 no.1
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• Textile Coloration and Finishing
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• v.30 no.2
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• pp.98-106
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• 2018

In this study, graphene oxide(GO) was synthesized by using Hummer's method. Then, GO was used as a additive for epoxy resin nanocomposites that were prepared by mixing Tetraglycidyl diamino diphenyl methane(TGDDM) and hardner(MDEA+M-MIPA). Thermal and mechanical properties of epoxy resin nanocomposites were confirmed by analytical methods such as TG-DTA, DMA, fracture toughness, tensile strength, and flexural strength. The fracture surfaces of epoxy resin nanocomposites with different content of the GO were observed by a Scanning Electron Microscope(SEM). The mechanism for mechanical properties of epoxy resin nanocomposites was analyzed by modeling of nanocomposites with different GO weight. Due to the GO, both the heat resistance and the glass transition temperature of the epoxy resin nanocomposites were improved. Interestingly, when 0.1wt.% of GO was added to the epoxy resin/hardner mixture, the properties of mechanical increased compared with the neat epoxy resin. This results were caused by an aggregation between the GO.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2012.11a
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• pp.255-257
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• 2012

Epoxy resin without any hardener can harden in the presence of hydroxide ions in cement mortars and concretes at ambient temperature. The purpose of present study is to examine the hardening properties of hardener-free epoxy-modified mortars by curing conditions. The hardener-free epoxy-modified mortars using diglycidyl ether of A epoxy resin are prepared with various polymer-cement ratios, and subjected to initial moist/dry curing, initial steam(90℃) curing, initial steam/heat(80℃, 100℃) curing.As a result, degree of hardening of epoxy resin in initial moist/dry cured, initial steam cured and initial steam/heat(80℃) cured hardener-free epoxy-modified mortars is decreased with increasing polymer-cement ratio. However, it is markedly improved with additional dry-curing periods. On the other hand, regardless of the polymer-cement ratio and dry curing periods, degree of hardening of hardener-free epoxy-modified mortars with initial steam/heat(100℃) cure is over 95%.

• Proceedings of the Korea Concrete Institute Conference
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• 2004.11a
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• pp.813-816
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• 2004

This study was performed to investigate bonding performance of epoxy resins for repairing of cracks in concrete, as a part of project to establish quality control standard for epoxy resins. In the slant shear strength test for hard and soft type epoxy, hard type was higher about 3 times than soft one. From the results, it is thought that hard type is suitable for load carrying. Injection of epoxy resin in the notch made flexural strength increase about $47\%$ over the specimen that epoxy resin is not injected. There were no differences in bonding performances with viscosity. Application of epoxy resin on the wet concrete surface made slant shear strength decrease about $46\%$, but similar performance to the case of application on the dry surface appeared by using epoxy resin for wet condition.

• Journal of Adhesion and Interface
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• v.16 no.1
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• pp.22-28
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• 2015

In this study, Waterborne polyurethanes (WPU) using Epoxy group were synthesized with polyester polyol, epoxy resin, 4,4-dicyclohexylmethane diisocyanate ($H_{12}MDI$), dimethylol propionic acid (DMPA) to improve the hydrolysis resistance and adhesion. In addition, the properties of the synthesized waterborne polyurethane was evaluated through DSC, UTM, adhesion strength. Tg of the synthesized waterborne polyurethane is shown in the vicinity of $-50^{\circ}C$. Tg were increased with as epoxy resin contents increased. The tensile strength was increased as the content of epoxy resin increases, elongation was decreased. Optimum adhesion and hydrolysis-resistance strength were obtained when polyol : epoxy ratio was 99 : 1.

• Macromolecular Research
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• v.13 no.1
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• pp.8-13
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• 2005

A novel silicon-containing epoxy resin, the diglycidylether of bisphenol A-silicon (DGEBA-Si), was synthesized and characterized. The properties of the DGEBA-Si epoxy resin cured with 4,4-diaminodiphenyl methane (DDM), including its cure behavior, glass transition temperature, thermal stability, and mechanical strength were investigated. The char yield of the DGEBA-Si/DDM system was higher than that of a commercial DGEBA/DDM system, indicating that the DGEBA-Si epoxy resin showed good flame-retardance. The cured DGEBA-Si/DDM specimens possessed lower glass transition temperatures and higher mechanical properties than DGEBA/DDM specimens. These features were attributed to the introduction of siloxane groups into the main chain of the epoxy resin, which resulted in the improved flexibility of the cured DGEBA-Si/DDM system.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.39-45
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• 2006

This study was investigated the thermal properties of underfill with various epoxy resins using thermal analysis methods such as differential scanning calorimetry (DSC), thermo gravimetry analysis (TGA), dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). And, the adhesion strength of the underfills/FR-4 substrate was evaluated. The glass transition temperature (Tg) of underfill which was composed the cycolaliphatic epoxy resin was lower than that of underfill which was not composed the cycolaliphatic epoxy resin. The thermal degradation of underfill was composed of two processes, which involved chemical reactions between the degrading polymer and oxygen from the air atmosphere. The coefficient of thermal expansion (CTE) of underfill which was composed the cycolaliphatic epoxy resin was higher than that of underfill which was not composed the cycolaliphatic epoxy resin. The excessive curing temperatures caused a weak boundary layer of epoxy resin, which resulted in a deterioration of mechanical properties in the epoxy resin and thus led to poor adhesion property between the underfill/FR-4 substrate.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.3
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• pp.211-216
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• 2016

In several industrial fields, epoxy resin is widely used as an adhesive for co-curing and manufacturing various structures. Controlling the manufacturing process is required for ensuring robust bonding performance and the stability of the structures. A fiber optic sensor is suitable for the cure monitoring of epoxy resin owing to the thready shape of the sensor. In this paper, a fiber Bragg grating (FBG) sensor was applied for the cure monitoring of epoxy resin. Based on the experimental results, it was demonstrated that the FBG sensor can monitor the status of epoxy resin curing by measuring the strain caused by volume shrinkage and considering the compensation of temperature. In addition, two types of epoxy resin were used for the cure-monitoring; moreover, when compared to each other, it was found that the two types of epoxy had different cure-processes in terms of the change of strain during the curing. Therefore, the study proved that the FBG sensor is very profitable for the cure-monitoring of epoxy resin.

• Journal of the Korean Society for Precision Engineering
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• v.3 no.3
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• pp.22-29
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• 1986

In Korea, all the photoelastic materials are imported from foreign countries. The cost of these materials are expensive and problems in importing have been restrained research and development in this field. To reduce these problems, the domestic EPOXY RESIN which is made of bisphenol type epoxy resin have been investigated in this study to find to find a photoelastic characterics by tensile test and to measure photoelastic sensitivity coefficient and transition temperature and the optimum using condition was also investigated.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1572-1574
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• 2000

In this paper, study on the properties of the thermal degradated epoxy resin which is used in cast resin transformer is performed to investigate the problems of the decreasing insulation characteristics and crack in the cast resin transformer. In the test, contact angle, weight loss, surface resistivity and relative dielectric constant are measured. As the results of the above measurements, the epoxy resin has increased to 150$^{\circ}C$ in the contact angle and surface resistivity but at the above 150$^{\circ}C$ the values have decreased. The relative dielectric constants have increased in the thermal treated samples with the degradation temperature. Consequently, the insulation properties of the epoxy resin which is used in cast resin transformer have increased by the 150$^{\circ}C$ but decreased in the above 150$^{\circ}C$.