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Synthesis and Characterization of a Novel Silicon-Containing Epoxy Resin  

Park Soo-Jin (Advanced Materials Division, Korea Research Institute of Chemical Technology)
Jin Fan-Long (Advanced Materials Division, Korea Research Institute of Chemical Technology)
Lee Jae-Rock (Advanced Materials Division, Korea Research Institute of Chemical Technology)
Publication Information
Macromolecular Research / v.13, no.1, 2005 , pp. 8-13 More about this Journal
Abstract
A novel silicon-containing epoxy resin, the diglycidylether of bisphenol A-silicon (DGEBA-Si), was synthesized and characterized. The properties of the DGEBA-Si epoxy resin cured with 4,4-diaminodiphenyl methane (DDM), including its cure behavior, glass transition temperature, thermal stability, and mechanical strength were investigated. The char yield of the DGEBA-Si/DDM system was higher than that of a commercial DGEBA/DDM system, indicating that the DGEBA-Si epoxy resin showed good flame-retardance. The cured DGEBA-Si/DDM specimens possessed lower glass transition temperatures and higher mechanical properties than DGEBA/DDM specimens. These features were attributed to the introduction of siloxane groups into the main chain of the epoxy resin, which resulted in the improved flexibility of the cured DGEBA-Si/DDM system.
Keywords
synthesis; silicon; epoxy; thermal properties; mechanical properties.;
Citations & Related Records

Times Cited By Web Of Science : 11  (Related Records In Web of Science)
Times Cited By SCOPUS : 8
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1 H. Lee and K. Nevile, Handbook of Epoxy Resin, McGraw- Hill, New York, 1967
2 C. S. Wu, Y. L. Liu, and Y. S. Chiu, Polymer, 43, 4277 (2002)
3 T. Nishikubo, A. Kameyama, Y. Kimura, and K. Fukuyo, Macromolecules, 28, 4361 (1995)
4 D. J. Liaw, Polymer, 38, 5217 (1997)
5 S. T. Lin and S. K. Huang, J. Polym. Sci.; Part A: Polym. Chem., 34, 1907 (1996)
6 X. Z. Song, S. X. Zheng, J. Y. Huang, P. P. Zhu, and Q. P. Guo, J. Appl. Polym. Sci., 79, 598 (2001)
7 S. J. Park, M. K. Seo, J. R. Lee, and D. R. Lee, J. Polym. Sci.; Part A: Polym. Chem., 39, 187 (2001)   DOI   ScienceOn
8 Y. W. Chen-Yang, H. F. Lee, and C. Y. Yuan, J. Polym. Sci.; Part A: Polym. Chem., 38, 972 (2000)
9 M. J. Alcon, M. A. Espinosa, M. Galia, and V. Cadiz, Macromol. Rapid Commun., 22, 1265 (2001)   DOI   ScienceOn
10 J. Frohlich, R. Thomonn, and R. Mulhaupt, Macromolecules, 36, 7205 (2003)
11 B. J. P. Jansen, S. Rastogi, H. E. H. Meijer, and P. J. Lemstra, Macromolecules, 32, 6290 (1999)
12 S. J. Park, F. L. Jin, and J. R. Lee, Mater. Sci. Eng. A, 374, 109 (2004)
13 T. Y. Lo and S. K. Huang, J. Appl. Polym. Sci., 69, 1523 (1998)
14 B. Mouanda, Polymer, 38, 5301 (1997)
15 S. J. Park and H. C. Kim, J. Polym. Sci.; Part B: Polym. Phys., 39, 121 (2001)   DOI   ScienceOn
16 C. D. Doyle, Anal. Chem., 33, 77 (1961)
17 S. J. Park and H. C. Kim, J. Polym. Sci.; Part B: Polym. Phys., 39, 121 (2001)   DOI   ScienceOn
18 C. S. Wu, L. L. Liu, and Y. S. Chiu, Polymer, 43, 4277 (2002)
19 Y. S. Choe and W. H. Kim, Macromol. Res., 10, 259 (2002)
20 C. S, Wu, Y. L. Liu, and Y. S. Chiu, Polymer, 43, 4277 (2002)
21 G. H. Hsiue, W. J. Wang, and F. C. Chang, J. Appl. Polym. Sci., 73, 1231(1999)
22 D. Ratna, Macromol. Res., 12, 11 (2004)