• Korean Chemical Engineering Research
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• 제47권3호
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• pp.332-336
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• 2009

초소형 전자소재 접착용 고분자 소재 접착제는 접착소재와 칩 또는 기판 간의 열팽창계수 차이에 의한 박리, 크래킹과 접착력 부족 등의 문제점이 발생된다. 이러한 결점의 보완을 위하여 무기입자 및 첨가물을 통해 접착제의 열팽창계수를 낮추거나, 접착제의 유연성을 부여하는 방법 등이 사용되고 있다. 실록산/실리카/에폭시 나노복합재에서 실록산과 실리카의 첨가가 열적, 기계적 물성에 미치는 효과를 확인하기 위한 실험을 진행하였다. 3-glycidoxypropyltrimethoxysilane(GPTMS)로 처리하여 친수성의 나노실리카 입자를 소수성 입자로 변성시켜 고분자 매트릭스와의 상용성 문제를 해결하고자 하였다. 표면처리하지 않은 실리카인 $Aerosil^{(R)}$200을 첨가한 AMS/Aerosil/에폭시 나노복합재의 유리전이온도는 125에서 $118^{\circ}C$로 감소하였고, 모듈러스는 2,225에서 2,523 MPa까지 증가하였다. 표면처리한 M-silica를 첨가한 AMS/M-silica/에폭시 나노복합재 또한 비슷한 경향이었으며, 유리전이온도가 124에서 $120^{\circ}C$로 감소했고 모듈러스는 1,981에서 2,743 MPa까지 증가하였다. 실리카의 표면개질 유무에 상관없이 열팽창계수는 감소하는 추세를 보였다.

• Composites Research
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• 제26권2호
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• pp.129-134
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• 2013

극저온 환경에 노출되는 구조체의 접착조인트의 경우 피접착물과 접착물 사이에서 열팽창계수 차이로 인해 계면에서 잔류응력이 발생하게 되는데 이에 의해 접착조인트 내부에 미소균열, 층간분리 등의 형태로 파손이 발생할 우려가 있다. 본 연구에서는 높은 비강성, 낮은 열팽창계수의 특성을 지닌 메타 아라미드 섬유를 에폭시 기지재의 보강재로 사용하였다. 표면처리 공정을 간소화하기 위해 전기방사법의 고분자 혼합법(polymer blend method)으로 코어-쉘 구조의 메타 아라미드/에폭시 나노섬유를 제조하였다. 극저온 환경에서 계면특성이 향상된 코어-쉘 구조의 나노섬유를 보강한 에폭시 접착제의 전단물성을 확인하기 위해 환경챔버를 이용하여 $-150^{\circ}C$의 저온에서 단일 겹치기 실험(single lap joint test)을 진행하였다. 또한, DCB(double cantilever beam) 실험을 통해 파괴인성을 측정하였다. 그 결과, 극저온에서 일반 메타 아라미드 나노섬유에 비해 코어-쉘 구조의 메타 아라미드/에폭시 나노섬유를 보강한 접착제 시편이 우수한 계면특성으로 인해 물성이 크게 향상되었음을 확인하였다.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집A
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• pp.370-376
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• 2001

When an adhesive joint is exposed to high environmental temperature, the tensile load capability of the adhesive joint decreases because the elastic modulus and failure strength of structural adhesive decrease. The thermo-mechanical properties of structural adhesive can be improved by addition of fillers to the adhesive. In this paper, the elastic modulus and failure strength of adhesives as well as the tensile load capability of tubular single lap adhesive joints were experimentally and theoretically investigated with respect to the volume fraction of filler (alumina) and the environmental temperature. Also the tensile modulus of the fille containing epoxy adhesive was predicted using a new equation which considers filler shape, filler content and environmental temperature. The tensile load capability of the adhesive joint was predicted by using the effective strain obtained from the finite element analysis and a new failure model, from which the relation between the bonding length and the crack length was developed with respect to the volume fraction of filler.

• 한국재료학회지
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• 제20권12호
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• pp.681-685
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• 2010

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

• 대한기계학회논문집A
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• 제32권11호
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• pp.918-923
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• 2008

Since crack detection for laminated composites in-service is effective to improve the structural reliability of laminated composites, it have been tried to detect cracks of laminated composites by various nondestructive methods. An electric potential method is one of the widely used approaches for detection of cracks for carbon fiber composites, since the electric potential method adopts the electric conductive carbon fibers as reinforcements and sensors and the adoption of carbon fibers as sensors does not bring strength reduction induced by embedding sensors into the structures such as optical fibers. However, the application of the electric method is limited only to electrically conductive composite materials. Recently, a piezoelectric method using piezoelectric characteristics of epoxy adhesives has been successfully developed for the adhesive joints because it can monitor continuously the damage of adhesively bonded structures without producing any defects. Polymeric materials for the matrix of composite materials have piezoelectric characteristics similarly to adhesive materials, and the fracture of composite materials should lead to the fracture of polymeric matrix. Therefore, it seems to be valid that the piezoelectric method can be applied to monitoring the damage of composite materials. In this research, therefore, the feasibility study of the damage monitoring for composite materials by piezoelectric method was conducted. Using carbon fiber epoxy composite and glass fiber composite, charge output signals were measured and analyzed during the static and fatigue tests, and the effect of fiber materials on the damage monitoring of composite materials by the piezoelectric method was investigated.

• 반도체디스플레이기술학회지
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• 제15권1호
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• pp.12-16
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• 2016

Toluene-free pressure sensitive adhesives were synthesized by using butyl acrylate (BA), 2-hydroxy ethyl acrylate, methyl methacrylate, acrylic acid (AA) as monomers and ethyl acetate as a solvent. The polymerization recipes were designed by changing 1, 3, 5 part per hundreds monomer (phm) of AA content on the basis of 100 BA parts. Two crosslinking agents, ethyl glycol diglycidyl ether (EDGE) and isophorone diisocyanate (IPDI) were added to the synthesized polymers to increase adhesion due to crosslinking. In the measurement of properties, holding power, peel strength, and initial tackiness increased with AA content due to crosslinking between carboxyl group in AA and epoxy group in EDGE and isocyanate group in IPDI. In the comparison of two crosslinking agents, EDGE showed better in the three properties than IPDI by better reaction of epoxy group of EDGE to carboxyl group of AA.

• 비파괴검사학회지
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• 제30권3호
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• pp.236-243
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• 2010

Fiber Bragg grating(FBG) sensor arrays can be used to monitor the mechanical behavior of the large composite structures such as wind turbine rotor blades and aircrafts. However, brittle FBG sensors, especially multiplexed FBG sensors are easily damaged when they are installed in the flexible structures. As a protection of brittle FBG sensors, epoxy packaged FBG sensors have been presented in this paper. Finite element analysis and experiments were performed to evaluate the effects of adhesives, packaging materials and the bonding layer thickness on the strain transmission. Two types of epoxy were used for packaging FBG sensors and the sensor probes were attached with various bonding layer thickness. It was observed that thin bonding layer with high elastic modulus ratio of the adhesive to packaging provided good strain transmission. However, the strain transmission was significantly decreased when elastic modulus of the adhesive was much lower than the packaged FBG sensor probe's one.

• 박물관보존과학
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• 제15권
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• pp.26-37
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• 2014

국립중앙박물관 보존과학부에서는 국보 제193호 봉수형유리병의 구조적 안정성을 향상시키고 봉수형유리병 본연의 색과 투명도를 되살리기 위하여 재보존처리를 하기로 하였다. 재보존처리에 앞서 유리 재질 보존에 적합한 재료를 선정하기 위하여 에폭시 수지, 아크릴 수지, 광경화성 수지, 물유리에 대한 재료 실험을 하였다. 이 결과 접착제로는 시아노아크릴레이트 수지, 아크릴 수지, 광경화성 수지가, 복원 재료로는 아크릴 수지가 적합할 것으로 판정되었다. 단, 사용 방법에 있어 시아노아크릴레이트 수지는 단독 사용을 피하고 에폭시 수지는 착탈식으로 보존처리해야 한다.

• 한국재료학회지
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• 제22권9호
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.