• 제목/요약/키워드: Epitaxial layer

검색결과 336건 처리시간 0.023초

InP 식각정지층을 갖는 InAlAs/InGaAs/GaAs MHEMT 소자의 항복 전압 개선에 관한 연구 (Simulation Study on the Breakdown Enhancement for InAlAs/InGaAs/GaAs MHEMTs with an InP-Etchstop Layer)

  • 손명식
    • 반도체디스플레이기술학회지
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    • 제12권3호
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    • pp.23-27
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    • 2013
  • This paper is for enhancing the breakdown voltage of MHEMTs with an InP-etchstop layer. Gate-recess structures has been simulated and analyzed for the breakdown of the devices with the InP-etchstop layer. The fully removed recess structure in the drain side of MHEMT shows that the breakdown voltage enhances from 2V to almost 4V and that the saturation current at gate voltage of 0V is reduced from 90mA to 60mA at drain voltage of 2V. This is because the electron-captured negatively fixed charges at the drain-side interface between the InAlAs barrier layer and the $Si_3N_4$ passivation layer deplete the InGaAs channel layer more and thus decreases the electron current passing the channel layer. In the paper, the fully-recessed asymmetric gate-recess structure at the drain side shows the on-breakdown voltage enhancement from 2V to 4V in the MHEMTs.

Design and Analysis of GAIVAE System and Application to the Growth of Semiconductor Thin Films -On the Growth of GaAs on Si-

  • Kang, Ey-Goo;Sung, Man-Young;Park, Sung-Hee
    • Journal of Electrical Engineering and information Science
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    • 제3권1호
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    • pp.110-116
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    • 1998
  • A single-crystalline epitaxial film of GaAs has been grown on Si using a gs assisted-ionized vapour beam eptaxial technique. The native oxide layer on the silicon substrate was removed at 550$^{\circ}C$ by use of an accelerated arsenic ion beam, instead of a high-temperature desorption. During the growth the substrate temperature was maintained at 550$^{\circ}C$. Transmission electron microscopy and electron diffraction data suggest that the GaAs layer is an epitaxially grown single-crystalline layer. The possibility of growing device quality GaAs on Si is able demonstrated through fabrication of GaAs MODFET on Si substrates.

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Electrochemical Metallization방법을 이용한 GaN Schottky Diode의 제작과 전기적 특성 향상 및 분석 (Electrical Characteristics of n-GaN Schottky Diode fabricated by using Electrochemical Metallization)

  • 이철호;;이명재;곽성관;김동식;정관수;강태원
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
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    • pp.205-208
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    • 2001
  • Schottky barrier diodes are fabricated on a intrinsic GaN(4${\mu}{\textrm}{m}$) epitaxial structure grown by rf plasma molecular beam epitaxy (MBE) on sapphire substrates. First, We make Ohmic electrodes (Ti/Al/Ti/Au) by evaporator. Next, we contact RuO$_2$ by dipping in the solution (RuCl$_3$.HClO$_4$), and then we deposit Ni/Au on the surface of RuO$_2$ by evaporator. We study the electrical characteristics of GaN Schottky barrier diodes made by these methods. Measurements are C-V, I-V, SEM, EDX, and XRD for the characteristics of devices. Thickness of RuO$_2$ layer depends on supplied voltage and dipping time. Device of thinner RuO$_2$ layer have a good Schottky characteristics compare with device of thicker RuO$_2$ layer

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GaAs on Si결정(結晶)의 성장(成長)과 그 특성해석(特性解析) (Analysis and Growth of GaAs on Si)

  • 정세진;성만영
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1990년도 하계학술대회 논문집
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    • pp.250-253
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    • 1990
  • A single-crystalline epitaxial film of GaAs has been grown on Si using an ionized cluster beam technique. The native oxide layer on the silicon substrate was removed at $550^{\circ}C$ by use of an accelerated arsonic ion beam, instead of a high-temperature desorption. During the growth the substrate temperature was maintained at $550^{\circ}C$. Transmission electron microscopy and electron diffraction data suggest that the eats layer is an epitaxially grown single-crystalline layer.

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MOVPE 단결정층 성장법 III. 원자층 성장법 (Metal-Organic Vapor Phase Epitaxy III. Atomic Layer Epitaxy)

  • 정원국
    • 한국표면공학회지
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    • 제23권4호
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    • pp.197-207
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    • 1990
  • Atomic layer epitaxy is a relatively new epitaxial pprocess chracterized by the alternate and separate exposure of a susbstrate surface to the reactants contaning the constituent element of a compound semicoductror. The ideal ALE is expected to provide sevral advantageous as petcts for growing complicated heterostrutures such as relativly easy controls of the layer thinkness down to a monolayer and in forming abrupt heterointerfaces though monolayer self-saturatio of the growth. In addition, since ALE is stongly dependent on the surface reaction, the growth can also be controlled by photo-excitation which provides activation can be energies for each step of the reaction paths. The local growth acceleration by photo-excitation can be exploited for growing several device strures on the same wafer, which provides another important practical advantage. The ALE growth of GaAs has advanced to the point the laser opertion has been achieved from AlGs/GaAs quantun well structures where thee active layers were grown by thermal and Ar-laser assisted ALE. The status of the ALE growth of GaAs and other III-V compounds will be reviewed with respect to the growth saturation behavior and the electrical properties of the grown crystals.

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Single-phase Gallium Nitride on Sapphire with buffering AlN layer by Laser-induced CVD

  • Hwang Jin-Soo;Lee Sun-Sook;Chong Paul-Joe
    • Bulletin of the Korean Chemical Society
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    • 제15권1호
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    • pp.28-33
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    • 1994
  • The laser-assisted chemical vapor deposition (LCVD) is described, by which the growth of single-phase GaN epitaxy is achieved at lower temperatures. Trimethylgallium (TMG) and ammonia are used as source gases to deposit the epitaxial films of GaN under the irradiation of ArF excimer laser (193 nm). The as-grown deposits are obtained on c-face sapphire surface near 700$^{\circ}$C, which is substantially reduced, relative to the temperatures in conventional thermolytic processes. To overcome the lattice mismatch between c-face sapphire and GaN ad-layer, aluminum nitride(AlN) is predeposited as buffer layer prior to the deposition of GaN. The gas phase interaction is monitored by means of quadrupole mass analyzer (QMA). The stoichiometric deposition is ascertained by X-ray photoelectron spectroscopy (XPS). The GaN deposits thus obtained are characterized by X-ray diffractometer (XRD), scanning electron microscopy (SEM) and van der Pauw method.

실리콘 기판과 $CoSi_2$ 버퍼층 위에 HVPE로 저온에서 형성된 GaN의 에피텍셜 성장 연구 (GaN epitaxy growth by low temperature HYPE on $CoSi_2$ buffer/Si substrates)

  • 하준석;박종성;송오성;;장지호
    • 한국결정성장학회지
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    • 제19권4호
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    • pp.159-164
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    • 2009
  • 실리콘 기판에 GaN 에피성장을 확인하기 위해, P형 Si(100), Si(111) 기판 전면에 버퍼층으로 40 nm 두께의 코발트실리사이드를 형성시켰다. 형성된 코발트실리사이드 층에 연속으로 HVPE(hydride vapor phase epitaxy)로 하나는 $850^{\circ}C$-12분 + $1080^{\circ}C$-30분(공정I)과, 또 하나 조건은 $557^{\circ}C$-5분 + $900^{\circ}C$-5분(공정II) 조건으로 각각 나누어 진행하여 보았다. GaN의 에피성장을 광학현미경, 주사전자현미경, 주사탐침현미경, 그리고 HR-XRD로 확인하였다. 공정I로는 GaN의 에피성장이 진행되지 않았으며, 공정II에서는 에피성장이 진행되었다. 특히 공정 II는 열팽창에 의해 실리콘 기판과의 자가정렬적인 기판분리 현상을 보였으며, XRD로 GaN의 0002 방향의 결정성 (crystallinity)을 ${\omega}$-scan으로 확인한 결과(100)면 방향의\ 실리콘과 코발트실리사이드를 버퍼층으로 활용하고 저온에서 HVPE를 진행한 조합이 GaN의 에피성장에 유리하였다.

혼합 소스 HVPE 방법에 의한 4H-SiC 기판 위의 육각형 Si 에피층 성장 (Growth of hexagonal Si epilayer on 4H-SiC substrate by mixed-source HVPE method)

  • 김경화;박선우;문수현;안형수;이재학;양민;전영태;이삼녕;이원재;구상모;김석환
    • 한국결정성장학회지
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    • 제33권2호
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    • pp.45-53
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    • 2023
  • 4H-SiC 기판 위의 Si 성장은 전력 반도체, 바이폴라 접합 트랜지스터 및 광전자 공학에서 매우 유용한 재료로서 광범위한 응용 분야를 가지고 있다. 그러나 Si와 4H-SiC 사이에 약 20 %의 격자 불일치로 인해 4H-SiC에서 매우 양질의 결정 Si를 성장시키는 것은 상당히 어렵다. 본 논문에서는 혼합 소스 수소화물 기상 에피택시 방법을 이용하여 4H-SiC 기판에서 성장한 Al 관련 나노 구조체 클러스터에 의한 육각형 Si 에피층의 성장을 보고한다. 4H-SiC 기판 위에 육각형 Si 에피층을 성장시키기 위해 먼저 Al 관련 나노 구조체 클러스터가 형성되고 Si 원자를 흡수하여 육각형 Si 에피층이 형성되는 과정을 관찰하였다. Al 관련 나노 구조체 클러스터와 육각형 Si 에피층에 대하여 FE-SEM 및 라만 스펙트럼 결과로부터 육각형 Si 에피층은 일반적인 입방정계 Si 구조와 다른 특성을 가지는 것으로 판단된다.

다중양자우물의 상호섞임 현상을 이용한 광도파로 필터의 제작 (Fabrication of waveguide filter using quantum well intermixing)

  • 김항로;여덕호;윤경훈;김성준
    • 한국광학회:학술대회논문집
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    • 한국광학회 2000년도 제11회 정기총회 및 00년 동계학술발표회 논문집
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    • pp.268-269
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    • 2000
  • We demonstrate a polarization insensitive waveguide filter using quantum well intermixing(QWI). The bandgap of epitaxial layer is modified from 1.55${\mu}{\textrm}{m}$ to 1.40${\mu}{\textrm}{m}$ using QWI and a Bragg grating filter is demonstrated using electron beam lithography technology. The fabricated waveguide filter has a 70% reflection efficiency and a 1.46nm filter bandwidth. Furthermore polarization insensitive transmission characteristics are observed. The device can be applied to photonic integrated circuits(PIC).

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