• 한국결정성장학회지
• /
• 제22권6호
• /
• pp.261-264
• /
• 2012

본 연구에서는 HVPE법으로 사파이어 기판(0001) 위에 성장시킨 GaN epilayer의 etching에 따른 표면변화 특성을 조사하였다. 주사전자 현미경(SEM) 관찰 결과, 3가지 형태를 갖는 육각형 모양의 etch pit(edge, screw, mixed) 들이 GaN epilayer의 두께 변화에 따라서 형성되었다. 이러한 관통전위들은(TDs) epilayer의 두께가 얇고, etch pit density가 높을수록 screw and mixed type TDs이 많이 관찰되었고, 두께가 증가할수록 etch pit density가 낮아지면서 edge and mixed type TDs들이 주로 존재하는 것을 관찰 할 수 있었다.

• 한국결정성장학회지
• /
• 제12권6호
• /
• pp.299-303
• /
• 2002

The relationship of crystallinity between defects distribution with (100) ZnTe/GaAs using HWE growth was investigated by four crystal rocking curve (FCRC) and transmission electron microscopy (TEM). The thickness dependence of crystal quality in ZnTe epilayer was evaluated. The FWHM value shows a strong dependence on ZnTe epilayer thickness. For the films thinner than 6 ${\mu}{\textrm}{m}$, the FWHM value decreases very steeply as the thickness increases. For the films thicker than 6 ${\mu}{\textrm}{m}$, it becomes an almost constant value. At the thickness of 12 $\mu\textrm{m}$ with the smallest value of 66 arcsec. which is the best value so far reported on ZnTe epilayers was obtained. Investigation into the nature and behavior of dislocations with film thickness in (100) ZnTe/(100)GaAs heterostructures grown by Hot Wall Epitaxy (HWE). This film defects range from interface to 0.7 ${\mu}{\textrm}{m}$ thickness was high density, due to the large lattice mismatch and thermal expansion coefficients. The thickness of 0.7~1.8 ${\mu}{\textrm}{m}$ was exists low defect density. In the thicker range than 1.8 ${\mu}{\textrm}{m}$ thickness was measured hardly defects.

• 한국재료학회지
• /
• 제11권7호
• /
• pp.575-579
• /
• 2001

Metal organic chemical vapor deposition (MOCVB)법을 사용하여 sapphire (0001) 기판 위에 GaN 환충층을 성장하고, 그 위에 GaN 에피층을 성장하였다. GaN 완충층은 55$0^{\circ}C$에서 약 26 nm에서 130 nm까지 각각 다른 두께로 성장하였고, GaN 에피층은 110$0^{\circ}C$에서 약 4 $\mu\textrm{m}$의 두께로 성장하였다. GaN 완충층 성장 후 atomic force microscopy (AFM)으로 표면 형상을 측정하였다. GaN 완충층의 두께가 두꺼워질수록 GaN 에피층의 표면이 매끈해지는 것을 scanning electron microscopy (SEM)으로 관찰하였다. 이것으로 GaN 에피층의 표면은 완충층의 두께와 표면 거칠기와 관계가 있다는 것을 알 수 있었다. GaN 에피층의 결정학적 특성을 double crystal X-ray diffraction (DCXRD)와 Raman spectroscopy로 측정하였다. 성장된 GaN 에퍼층의 광학적 특성을 photoluminescence (PL)로 조사한 결과 두께가 두꺼운 완충층 위에 성장된 에퍼층의 결정성이 더 좋은 반면, 내부 잔류응력은 증가하는 결과를 보였다. 이러한 사실들로부터 완충층의 두께가 두꺼워짐에 따라 내부 자유에너지가 감소하여 에피층 성장시 측면성장을 도와 표면이 매끈해지고, 결정성이 좋아졌다.

• E2M - 전기 전자와 첨단 소재
• /
• 제7권4호
• /
• pp.300-305
• /
• 1994

We determined the alloy composition of the liquid-phase epitaxy(LPE) grown $Al_{x}$G $a_{1-x}$ As by the photoreflectance(PR), and observed the variation of PR signal by changing the condition of annealing and thickness of epilayer. As the measuring temperature was decreased, the broadening parameter was decreased, and the amplitude of PR signal was increased. When the temperature of annealing was increased, the surface carrier concentration was decreased and then the shape and amplitude of PR signal were affected by the surface electric field. The structure change was observed when the specimen was annealed for long time at a high temperature. We found that the surface electric field increased when the thickness of epilayer was decreased by etching, because the band bending was increased by the decreased of the width of depletion layer....

• Applied Microscopy
• /
• 제27권4호
• /
• pp.483-488
• /
• 1997

A misfit dislocation generation in InAs epilayers grown on (001) InP substrates (oriented $2^{\circ}$ off (001) toward the [110] direction) using metalorganic chemical-vapor deposition was studied. The InAs film of 17 nm thickness grown at $405^{\circ}C$ showed the three different arrays of dislocations: a straight orthogonal array to the <110> direction, an array to the >100> direction, and an array tilted by a degree of $5\sim45^{\circ}$ from the [110] direction. All of the dislocations had a/2<101> Burgers vectors inclined $45^{\circ}$ to the interface. Upon annealing at $660^{\circ}C$ the InAs films with 60, 140 and 220 nm thicknesses, most of the misfit dislocations became the Lomer type $(\sim100%)$ oriented exactly along the >110> direction. These misfit dislocation spacings were decreased with increasing the InAs thickness up to 220 nm thickness. This phenomena was interpreted by the relationship between the dislocation interaction energy among parallel misfit dislocations and the opposite remnant InAs epilayer strain energy. The distance between misfit dislocations was measured by transmission electron microscopy.

• Journal of Korean Vacuum Science & Technology
• /
• 제6권2호
• /
• pp.84-87
• /
• 2002

The Si$_{1-x}$ Gex/Si surface alloy (x = 0.3, 0.4 and 0.5), which are prepared by solid source MBE and have the SiGe epilayer thickness of 50$\AA$, are annealed with different parameters. The surface structure analyses of the heterostructure samples are made on a triple-axis X-ray diffractometer in grazing incidence X-ray diffraction (GIXRD) geometry. It has been found that with different annealing time (1.5h, 18h, 64h) and annealing temperature (550 $^{\circ}C$, 750 $^{\circ}C$), the SiGe epilayer experienced different strain relaxation process, which was deduced from the GIXRD measurements of the in-plane (220) diffraction peak of Si(001) substrate and the relevant (220) surface diffraction of SiGe epilayer. The results show that the stress relieving and the lateral strain relaxation in the SiGe/Si heterostructure can be promoted by correct annealing, which is very helpful for the preparation of SiGe/Si strained superlattice with fine strain crystallization..

• Applied Microscopy
• /
• 제25권2호
• /
• pp.65-72
• /
• 1995

The interfacial structures of ZnSe/GaAs which were grown by single chamber MBE at $300^{\circ}C$ were investigated by high resolution transmission electron microscope working at 300 kV with resolution of 0.18 nm. The interfaces of ZnSe/GaAs whose thickness is 2,700 nm are wavy and extensive stacking faults were formed in ZnSe epilayer but the interfaces maintained the coherency with the substrate GaAs. The stacking faults are formed in {111} planes and their sizes are $10{\sim}20nm$ in length and two or three atomic layer in width with the density of $10^9/cm^2$. Micortwins and moire fringes are also observed. However. in 10 nm ZnSe epilayer, the interfaces are pseudomorphic and only moire fringes are observed in local areas. The cylindrical defects which are perpendicular to the interface with $50{\sim}60nm$ in length, were observed with the interval of 50 nm at ZnSe/GaAs interfaces in 2,700nm epilayer. The origin and character of these defects are unknown, however, they played a role of producing the structural defects at the interfaces.

• 반도체디스플레이기술학회지
• /
• 제13권3호
• /
• pp.45-50
• /
• 2014

In this paper, we propose a super-junction MOSFET (SJ MOSFET) fabricated through a simple pillar forming process by varying the Si epilayer thickness and doping concentration of pillars using SILVACO TCAD simulation. The design of the SJ MOSFET structure is presented, and the doping concentration of pillar, breakdown voltage ($V_{BR}$) and drain current are analyzed. The device performance of conventional Si planar metal-oxide semiconductor field-effect transistor(MOSFET), Si SJ MOSFET, and SiGe SJ MOSFET was investigated. The p- and n-pillars in Si SJ MOSFET suppressed the punch-through effect caused by drain bias. This lead to the higher $V_{BR}$ and reduced on resistance of Si SJ MOSFET. An increase in the thickness of Si epilayer and decrease in the former is most effective than the latter. The implementation of SiGe epilayer to SJ MOSFET resulted in the improvement of $V_{BR}$ as well as drain current in saturation region, when compared to Si SJ MOSFET. Such a superior device performance of SiGe SJ MOSFET could be associated with smaller bandgap of SiGe which facilitated the drift of carriers through lower built-in potential barrier.

• 한국결정성장학회지
• /
• 제30권3호
• /
• pp.96-102
• /
• 2020

본 논문에서는 6H-SiC (0001) 기판 위에 AlN 에피층을 혼합 소스 수소화물 기상 에피택시 방법에 의해 성장하였다. 시간당 5 nm의 성장률로 0.5 ㎛ 두께의 AlN 에피층을 얻었다. FE-SEM과 EDS 결과를 통해 6H-SiC (0001) 기판 위에 성장된 AlN 에피층 표면을 조사하였다. HR-XRD와 계산식을 통해 전위 밀도를 예측하였다. 1.4 × 10⁹ cm^-2의 나사 전위 밀도와 3.8 × 10⁹ cm^-2의 칼날 전위 밀도를 가지는 우수한 결정질의 AlN 에피층을 확인하였다. 혼합소스 HVP E 방법에 의해 성장된 6H-SiC 기판 위의 AlN 에피층은 전력소자 등에 응용이 가능할 것으로 판단된다.

• 한국결정성장학회지
• /
• 제13권3호
• /
• pp.122-126
• /
• 2003

본 연구에서는 두께가 0.7 $\mu \textrm{m}$인 $Zn_{0.86}Mn_{0.14}$Te 에피막을 GaAs(100) 기판 위에 열벽 적층 성장하였다. 선택에칭용액에 의하여 GaAs 기판이 제거된 X-선 회절 패턴으로부터 $Zn_{0.86}Mn_{0.14}$Te에피막의 결정구조는 zincblende 이었으며 격자상수는 6.140 $\AA$으로 계산되었다. 이러한 격자상수 값과 Vegard 법칙으로부터 Mn의 조성비 x=0.14임을 알았다. 성장된 에피막의 결정성은 이중결정요동 곡선의 반폭치 값이 256 arcsec인 것으로부터 양호하다는 것이 확인되었다 상온에서 10K 까지 $Zn_{0.86}Mn_{0.14}$Te에피막의 온도에 따른 띠 간격 에너지를 측정하기 위하여 투과 스펙트럼으로부터 흡수 스펙트럼이 얻어졌다 온도가 감소할수록 흡수 스펙트럼에서 강하게 흡수가 일어나는 영역은 에너지가 큰 쪽을 향하여 이동하였고 흡쑤단 근처에서 자유 엑시톤 형성을 의미하는 흡수 피크가 생겨났다. $Zn_{0.86}Mn_{0.14}$Te에피막의 온도에 따른 자유 엑시톤 피크 에너지로부터 OK와 300 K일 때 띠 간격 에너지는 각각 2.4947 eV와 2.330 eV로 구하여졌다. 10 K에서 기판이 제거된 $Zn_{0.86}Mn_{0.14}$Te 에피막의 흡수 스펙트럼의 자유 엑시톤 피크 에너지는 광발광 피크 에너지보다 15.4 meV 정도 크다. 이 에너지 차이는 흡수 스펙트럼과 발광 피크 사이의 에너지 차이를 의미하는 Stokes shift를 나타낸다.